Confined Ultrathin Silicon Nanowires P.D. Tran, T.J. Macdonald, B. - - PowerPoint PPT Presentation

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Confined Ultrathin Silicon Nanowires P.D. Tran, T.J. Macdonald, B. - - PowerPoint PPT Presentation

Photo-responsive Properties on Locally Confined Ultrathin Silicon Nanowires P.D. Tran, T.J. Macdonald, B. Wolfrum, R. Stockmann, A. Offenhausser, T. Nann and B. Thierry Ian Wark Research Institute, University of South Australia, Australia Peter


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SLIDE 1

S D

SiNWs

5 µm 5 µm 500 nm

Photo-responsive Properties on Locally Confined Ultrathin Silicon Nanowires

http://bionanoengineering.com

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P.D. Tran, T.J. Macdonald, B. Wolfrum, R. Stockmann, A. Offenhausser, T. Nann and B. Thierry

Ian Wark Research Institute, University of South Australia, Australia Peter Grünberg Institute, Forschungszentrum Juelich GmbH, Juelich, Germany

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SLIDE 2

Why Ultrathin Silicon Nanowire ?

 Silicon nanowires (SiNWs) are promising functional building blocks for novel

  • ptoelectronic devices1,2

 Down-scaling to ultrathin SiNWs open up opportunities to explore new fundamental properties of one-dimensional materials  high performance nanoscaled devices  The performance of planar SiNWs optoelectronic devices is currently limited by the inherent low fill factor and light reflection  CdTe quantum dots (QDs) are high-efficiency fluorescence materials with tuneable emission wavelength  “light harvesting antenna” for ultrathin SiNWs devices

  • 1. Zhang, A.; Kim, H.; Cheng, J.; Lo, Y

.-H. Nano Letters 2010, 10, (6), 2117-2120.

  • 2. Garnett, E.; Yang, P. Nano Letters 2010, 10, (3), 1082-1087.

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Aim: To fabricate and improve the performance of novel, locally confined ultrathin SiNWs photo-resistors

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SLIDE 3

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The Fabrication

  • 1. SiNWs Patterning
  • 2. Localized Etching
  • 3. Packaging

SiNWs patterning by e-beam lithography and TMAH etching  Wafer-scaled homogeneity of the Si device layer thickness (~ 40nm)  Highly-ordered SiNWs (WxL: 200 nm x10 µm) with smooth trapezoidal shape

a b c d

nm

500 nm 5 µm

S D

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SLIDE 4

4

The Fabrication

0.5 1 1.5 2 2.5 3 3.5 4 65 55 45 35

Etch rate (nm/s) Temperature (oC)

Optimization of the TMAH wet etching using isopropanol additive for localized etching

  • 1. SiNWs Patterning
  • 2. Localized Etching
  • 3. Packaging

0.95 nm 0.12 nm

a b

1.2 nm 0.0 nm 1.1 nm

  • 0.1 nm

c

1.3 nm

  • 0.1 nm

e

1.4 nm 0.0 nm

d f

0.0 nm 3 nm

Pristine Si 35oC 45oC 55oC 65oC Oxidation + HF

 A very slow (~0.5 nm/s) and well-controlled TMAH etching rate on Silicon (100) was obtained  Atomic smooth Si surface is maintained after etching (rms roughness ~0.15 nm)

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SLIDE 5

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The Fabrication

  • 1. SiNWs Patterning
  • 2. Localized Etching
  • 3. Packaging

Ultrathin SiNWs were fabricated with thickness down to ~20 nm by localized wet-etching with optimized TMAH  Compatible with device integration techniques  Thickness scalable to sub-20 nm  Straight forward and easy to implement

20 nm

e f

500 nm 5 µm

40 nm 20 nm

40 nm

100 nm 200 nm Si SiO2

Si SiO2

Ultrathin SiNW

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SLIDE 6

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The Fabrication

  • 1. SiNWs Patterning
  • 2. Localized Etching
  • 3. Packaging

A novel wafer-scaled top-down process for the fabrication of locally thinned-down silicon nanowires based device has been developed

g h i j

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SLIDE 7

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Ultrathin SiNWs Characterizations

Ids (µA) a Vds (V) Time (s) b

  • 100

100 200 300 400 500 600 700 3.4 3.6 3.8 4.0 4.2

Ids (µA) Dark 1.28 1.2 0.85 0.75 0.5

 High photosensitive, LOD: 0.75 mW.cm-2  High photoresponsivity, R ~ 104 A/W >> 0.7A/W ( commercial silicon PIN photodiode)  Good time response: t = 0.003s  High mobility photocarriers are generated in high quality ultrathin SiNWs

c

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SLIDE 8

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Ultrathin SiNWs Characterization

  • 3
  • 2
  • 1

1 2 3

  • 8
  • 4

4 8 12 16 20 24

Dark 254 nm 365 nm 680 nm

Ids (µA) Vds (V)

5 10 15 20

  • 1

1 2 3 4 Bias at 2.0 V Bias at -2.0 V

Ids (µA) Time (minute) OFF ON ON

  • 3
  • 2
  • 1

1 2 3

  • 10
  • 5

5 10 15 20 25 273 K 298 K 313 K 343 K

Ids (µA) Vds (V)

 Broad light detection spectrum: 254 nm  680 nm  Thermal stability: 0oC  70oC  Long-term stable measurement: 20 mins  Highly photo-responsive and stable

ultrathin SiNWs

a b c

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SLIDE 9
  • 0.5

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 10 20 30 40

Dark 365 nm/Bare Si 365nm/Si-QD 680nm/Bare Si 680nm/Si-QD

Ids (µA) Vds (V)

0.0 0.2 0.4 0.6 0.8 1.0 2 4 6 8 10

Dark Bare Si Si/QD

Ids (µA) Vds (V)

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Quantum dot – SiNWs hybrids

b a

 10 nm CdTe quantum dots nanoparticle were successfully synthesised  ~ 59 ± 10% improvement in photocurrent response of QD-SiNWs measure under 365 nm UV light due the QDs emitting in the visible region.  Initial measurement on solar full spectrum (300  1400 nm; 100 mW/cm2) show ~20 % increasing in photocurrent response  Fast, stable and highly photoresponsive new nanostructures based on

quantum dots - SiNWs hydrids have been developed

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SLIDE 10

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Conclusion and Outlook

 A novel and straight-forward top-down fabrication of functional ultrathin SiNWs has been developed  The fabricated ultrathin SiNWs have demonstrated ultrahigh photo-responsivity, high photosensitivity, stability, durability and fast response  QD modified SiNWs have shown an improvement of the photocurrent measured under UV light while preserving their performance in visible light Potential to apply this novel process to fabricate sub-10 nm thin SiNWs Exciting applications for opto-electronics and photovoltaics hydrid systems

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Acknowledgements

  • Dr. Dirk Mayer, Dr. Venesa Maybeck, Dr. Stefan Trellenkamp - Forschungszentrum

Jülich, Germany

  • Dr. Xuan Thang Vu - University of Applied Sciences Kaiserslautern, Germany
  • Dr. Tong Duy Hien - Nanosens Research Co., Netherland
  • Asso/Prof. Steve Madden - Australian National University, Australia
  • This work was performed in part at the SA and ACT nodes of the Australian

National Fabrication Facility, a company established under the National Collaborative Research Infrastructure Strategy to provide nano and micro- fabrication facilities for Australia’s researchers. Thank for the financial support from: + Australian Technology network – German Academic Exchange Service (DAAD) award + NH&MRC 631939 research project