ASIC Clouds: Specializing the Datacenter
Ikuo Magaki, Moein Khazraee, Luis Vega Gutierrez, and Michael Bedford Taylor UC San Diego and Toshiba
Presented By: Vandit Agarwal
ASIC Clouds: Specializing the Datacenter Ikuo Magaki, Moein - - PowerPoint PPT Presentation
ASIC Clouds: Specializing the Datacenter Ikuo Magaki, Moein Khazraee, Luis Vega Gutierrez, and Michael Bedford Taylor UC San Diego and Toshiba Presented By: Vandit Agarwal Motivation GPU and FPGA based clouds already successful Even ASIC
Ikuo Magaki, Moein Khazraee, Luis Vega Gutierrez, and Michael Bedford Taylor UC San Diego and Toshiba
Presented By: Vandit Agarwal
computation
improvement - explore and propose ASIC cloud
w design
availability, taxes etc.
**To meet the requirements at datacenter level, modifications trickle down in the hierarchy
Off-PCB Interface On-PCB Network
On-ASIC Interconnection Network
multiplied recursively
shared DRAM controllers connected to ASIC-local DRAMs
Off-PCB Interface On-PCB Network
On-ASIC Interconnection Network
Rackmount servers
removal from back
RCA:
Thermal Interface Material (TIM)
be?
few large ASICs
dissipation capacity increases (TIM)
packaging cost but not by much
Watts, increases performance
density), very little total silicon per lane (due to temperature constraints) and must be divided into many smaller chips
more silicon per lane and fewer chips
transactions
Byzantine Fault Tolerance determines whose transactions are added to the blockchain
hashes per second (GH/s)
and append the block
Difficulty
silicon costs start building up
significant
so that their supplies sum to 12V
savings in TCO optimal case
**Pareto points are glitchy because of variations in constants and polynomial order for server components as they vary with voltages
framework/skeleton for an ASIC cloud. How feasible do you think this technology is and how widely and how soon can we potentially adopt it for a large variety of applications?
the cloud providers and silicon foundries would potentially lead to lower TCO. Is this a good solution? Why or why not?
NRE) in more advanced nodes (eg 16nm) or using/modifying
target