ArgonCube 2x2 Cabling and grounding F. Piastra 31.10.2019 Power - - PowerPoint PPT Presentation

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ArgonCube 2x2 Cabling and grounding F. Piastra 31.10.2019 Power - - PowerPoint PPT Presentation

ArgonCube 2x2 Cabling and grounding F. Piastra 31.10.2019 Power connections/grounding DAQ rack HVPS HV Power (phases) SYx527 crate Cryostat Detector grounded at the ground HV-FT HV-FT LVPS (<10V) (at the rack) G VME crate NIM


slide-1
SLIDE 1

ArgonCube 2x2

Cabling and grounding

  • F. Piastra

31.10.2019

slide-2
SLIDE 2

VME crate NIM crate DAQ server SYx527 crate LVPS (<10V)

HVPS

HV

Power connections/grounding

G

Copper braid (optional) Saturable inductor

Building ground DAQ rack

Common (neutral) Power (phases) HV-FT

Detector ground (at the rack) Cryostat grounded at the HV-FT

HV connection to cathode plane Insulation

slide-3
SLIDE 3

Light readout chain

Cold side:

  • Potted feedthrough in CF-60 flange: 8 connectors serve

24 modules (12 ArCLight + 12 LCM).

  • Micro-coax cables for SiPM biasing and signal readout.

Warm side:

  • CAEN A7040AN for SiPM biasing in SYx527 crate: 48

programmable HV channels, floating HV return.

  • Driver amplifiers box for differential signal transmission
  • n screened ribbon twisted pair cable.
  • JINR-ADC in VME crate: 64 differential analog pairs

inputs, ethernet interface to acquisition PC. CAEN A7040 JINR-ADC

Knut Skarpaas, 2019

slide-4
SLIDE 4

Light readout chain

CAEN 7040 Ch0 CAEN 7040 Ch.0 HV CAEN 7040 Ch.N HV LV-PS LV DCDC stabiliser JINR ADC

Detector ground reference

Driver amp. box Cryostat

Clean ground from cryostat

DAQ rack

Components grounded in the amp box SiPM and pre-amp.

slide-5
SLIDE 5

Charge readout chain

Cold side:

  • Each LArPix board is served by a 34 wires ribbon cable

from custom feedthrough.

  • Feedthrough: round PCB with copper plating for CF-60

flange sealing, 8x 34-pin feedthroughs.

Warm side:

  • Read out board in NIM module: XILINX ArtyZ7 board,

data transmission, analog monitor, ADC test, synchronisation tasks.

  • Direct connection of 34-wire ribbon cables to read out

electronics.

  • 2x NIM modules per TPC: 4 pixel tiles each module

Knut Skarpaas, 2019

slide-6
SLIDE 6

Charge readout chain

LV-PS LV DCDC stabiliser

Driver amp. box Cryostat

Clean ground from cryostat

DAQ rack

Components grounded in the amp box

NIM module

FPGA Digital lines Analog line (pulser) Analog monitor

LArPix

Power supply Analog

  • ut

Pulse in

slide-7
SLIDE 7

Slow monitor/control chain

Building ground

SC rack

  • Pressure transmitters:
  • 4 - 20 mA current loops
  • No ground connection from PLC to

sensors

  • Temperature transmitters:
  • 4 - 20 mA current loops
  • No ground connection from PLC to

sensors

  • RaspberryPi reads levelmeter on

detector ground, transmission over unshielded ethernet (UTP).

  • Feedthroughs:
  • Commercial CF60 with D-sub pins

for T sensors, valves control

  • Custom made potted FT for VFD

line: 3 phases, 1 ground wire and shield not in connection with the detector GND

  • TBD: Additional insulation from FT

flanges and the module or cryostat

Valves control PLC LAr pumps control (VFD drivers)

slide-8
SLIDE 8

Slow monitor/control chain

  • Bistable valves: activated by current

spikes, no ground connections.

  • Feedthroughs are multi-pin sockets/plugs
  • n standard stainless steel flanges (CF40

and CF60).

  • Shielding of the cables are grounded at

the rack side and floating at detector side

slide-9
SLIDE 9

Slow monitor/control chain

Potted FT for VFD line:

  • Cable shield insulated from

flanges and metal components

  • Vacuum tested down to 10-3

mbar Motor pumps:

  • Encasing grounded to the VFD line shield (building ground)
  • Dielectric breakers to insulate pumps body from flanges, cryostat

and pipes