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Agenda
Abstract Introduction Overview Of 3-LAYER Package Transceiver Architecture And Specifications Measurement Results For The Passive Antenna Transmit-Receive Measurements Conclusion
An X-band System-in-Package Active Antenna Module 96868804 - - PowerPoint PPT Presentation
An X-band System-in-Package Active Antenna Module 96868804 - - PowerPoint PPT Presentation
An X-band System-in-Package Active Antenna Module 96868804 Agenda Abstract Introduction Overview Of
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Abstract
SiP Antenna SiP Antenna
Development of a low cost, compact RF front end
SiP solution for X-band.
A printed antenna is integrated with a multilayer
BGA package using low cost laminate substrates.
Can help mitigate the feed network losses and
phase errors.
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Introduction
System-on-Chip (SoC) is
another technique that aims at achieving the total system integration in a single unit by integrating all the system functionalities in one single wafer process.
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The system-on-package (SoP) approach
developed by Georgia Institute of Technology achieves the system integration in a similar way as SiP.
APM BT+ WiFi Samsung WiFi Samsung BT
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The system-in-package (SiP) concept seeks to
integrate multiple ICs along with other system components like passives, interconnects and antenna into a single functional package.
X-band SiP solution where the radiating element
has been successfully integrated with the transmit/receive ICs in a 3-layer, low cost
- package. The module utilizes currently available
low cost substrates and discrete passives.
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Overview of 3-Layer Package
20 mil RTDuroid5880 (εr = 2.2, tanδ = 0.001) 5 mil GETEK (εr = 3.9, tanδ = 0.01) 31 mil GETEK 62 mil FR-4
~ 107 A couple dollars
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Transceiver Architecture And Specifications
Conductive silver epoxy and Wire bonds High cost GaAs ICs SiCMOS or SiGe ICs
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Measurement Results For The Passive Antenna
(PCAAD 5.0) Estimate: 7.3 dB and 89.4% efficiency (gain of 6.8 dB)
10.2 GHz 6.4 dB
Efficiency of 81.3% Solder ball transitions between the motherboard and the package and the wire bond connections inside the package The patch showed a return loss of around 25 dB before and after it was mounted on the motherboard.
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Transmit-Receive Measurements
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- A. Receiver Measurements
IF for the receiver : 300 MHz LO frequency : 10.5 GHz Measured gain : 23.9 dB
10.2 GHz 23.9 dB
Estimated gain : 25 dB Upper sideband image rejection (at 10.8 GHz) of 12 dB
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- B. Transmitter Measurement
Transmitter chain was 17.3 dB
10.2 GHz 17.3 dB
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Conclusion
An inexpensive, highly integrated X-band active
antenna element has been demonstrated.
The packaging scheme utilizes the currently
available low cost laminate substrates and BGA technique to achieve the integration of the entire transmit and down-converter chain with an antenna.
The measured gain of the active element is
comparable to the estimated gain in both the modes, thus showing that packaging does not affect the IC performances drastically.
The central short used in the package helps
suppress package resonances in the desired X-band as well as improves the isolation within the package.
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