Agenda KLA-Tencor Introduction Value of Process Control Strategy - - PowerPoint PPT Presentation

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Agenda KLA-Tencor Introduction Value of Process Control Strategy - - PowerPoint PPT Presentation

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Agenda KLA-Tencor Introduction Value of Process Control Strategy for Future Process Control Challenges 1 The ConFab May 2015 KLA-Tencor: Process Control Innovation Leadership First to market. Winning performance. Continuous

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SLIDE 1

1 The ConFab – May 2015

  • KLA-Tencor Introduction
  • Value of Process Control
  • Strategy for Future Process Control Challenges

Agenda

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SLIDE 2

2 The ConFab – May 2015

KLA-Tencor: Process Control Innovation Leadership

First to market. Winning performance. Continuous innovation.

<1990’s 1990’s 2000’s Today

1st Reticle Inspector Invented STARlight Optics Die-to-Database Inspection Teron 6XX 213X Line Monitoring 236X Hi Speed BB UV 28XX BB DUV AIT 1st Laser Scattering Wafer Inspector Puma 9XXX Laser Line Scanning AIT UV Surfscan SP1 360°Collector 1st Bare Wafer Inspector Surfscan SP5 SURFmonitor Surfscan SP1 DLS Backside 1st In-Line Overlay AIM Targets Archer 500 1st Wafer Inspector Invented Archer Platform 29XX Wafer Plane Inspection Puma 9850 Surfscan SP2 Platform µAIM Targets

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3 The ConFab – May 2015

“We’re blind without you guys…”

Find And Fix Today’s Critical Problems

Defect

Metrology / Performance

You can’t fix what you can’t find

Defect / Yield

You can’t control what you can’t measure

Blocked Implant Blocked Contact Trench Bridge Cu Bridge

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SLIDE 4

4 The ConFab – May 2015

Eye of Needle 2,000,000nm Flu Virus 100nm DNA Strand 6nm Semiconductor Defect 10nm Size

We Must Find, Classify & Measure Really Small Defects

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SLIDE 5

5 The ConFab – May 2015

Illumination Optics Sensor / Imaging Speed 1985 2015

Tungsten – Halogen light source Laser pumped plasma light source Brighter than the sun

Laser Fiber

Off-the- shelf microscope

  • bjectives

Catadioptic, Hi-NA, Broadband λ custom made

  • bjectives

Two custom 4 mega- pixel TDI sensors, no dead pixels 1000X faster than digital camera Off-the- shelf sensor

Innovation in Optical Wafer Inspection To Get to 10nm Solution in <30 years

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6 The ConFab – May 2015

A world on a wafer…

This is a disk….. 70,000,000,000,000,000 nm^2 70 E15 square nanometers And this is a sphere….. 5,000,000,000,000,000 ft^2 5 E15 square feet

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SLIDE 7

7 The ConFab – May 2015

A world on a wafer…

This is a disk….. 70,000,000,000,000,000 nm^2 70 E15 square nanometers And this is a sphere….. 5,000,000,000,000,000 ft^2 5 E15 square feet

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SLIDE 8

8 The ConFab – May 2015

Aerial View of Las Vegas

Our Tools Will Find Defects the Size of a Small Coins on the streets of Las Vegas from many miles in space…in Seconds

One Chip Wafer

  • Scale of data : up to 20TB
  • f data / wafer
  • Massive “Intelligent” Data

Compression necessary

  • Statistical Machine Learning

Essential

What Must Our Systems Do?

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SLIDE 9

9 The ConFab – May 2015

Agenda

  • KLA-Tencor Introduction
  • Value of Process Control
  • Strategy for Future Process Control Challenges
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10 The ConFab – May 2015

The Value of Process Control is Delivered in Many Forms

Credit: VLSIresearch

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SLIDE 11

11 The ConFab – May 2015

The Ten Fundamental Truths of Process Control

For Any Industry

  • 1. You can’t fix what you can’t find. You can’t control what you can’t

measure.

  • 2. It is always more cost-effective to over-inspect than to under-inspect.
  • 3. The most expensive defect is the one that wasn’t detected inline.
  • 4. Fab managers don’t like surprises: always quantify your lots at risk

when making changes to your process control strategy.

  • 5. Variability is the enemy of a well-controlled process.
  • 6. Time is the enemy of fab profitability.
  • 7. Improving yield also improves device reliability.
  • 8. Process control requirements increase with each design rule.
  • 9. High-stakes problems require a layered process control strategy.

10.Adding process control reduces production costs and cycle time.

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SLIDE 12

12 The ConFab – May 2015

Find the problem now ...

  • r, find it later.

The Most Expensive Defect is The One That Wasn’t Detected In-Line…

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13 The ConFab – May 2015

Strong Correlation Between Yield and Reliability

Shirley, C. Glenn (Intel). “A Defect Model of Reliability” 33rd Annual International Reliability Symposium, Las Vegas, NV 1995.

Improving Yield Will Also Improve Device Reliability…

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14 The ConFab – May 2015

Reliability is Critical The same defect types that impact yield also impact reliability.*

Killer Defect Potential Latent Reliability Defect Killer Defect Potential Latent Reliability Defect Non-killer Defect Non-killer Defect By Definition:

  • Killer Defects: device fails at t = 0 (probe)
  • Latent Defects: device fails at t > 0 (burn-in  ~6 months)
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15 The ConFab – May 2015

Reliability is Critical Devices Cannot Fail –There is No Room for Maybe

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16 The ConFab – May 2015

If it’s worth achieving, it’s better to over-achieve than under-achieve

It is More Cost-Effective to Over-Inspect Than Under-Inspect…

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17 The ConFab – May 2015

Number of Process Steps

(logic/foundry)

Design Rule 2015 we are here

Source: IC Knowledge Strategic Cost Model

The Number of Process Steps is Exploding

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18 The ConFab – May 2015

As the number of process steps increase, ALL STEPS must be held to a tighter standard for:

1. Excursions (wafer yield) 2. Defect density (die yield) 3. Variability (Cpk)

Cleaner Unit Processes are Required

All Process Steps

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19 The ConFab – May 2015

200 400 600 800 1,000 1,200 1,400

90nm 65nm 45nm 28nm 20nm 14nm 10nm 7nm 5nm

Process Steps Design Rule (nm)

30% 40% 50% 60% 70% 80% 90%

Cumulative Yield

Predicted Cumulative Yield assuming the per-step yield stays constant at 28nm levels.

Cumulative Yields will drop unless there is an improvement in step yield

Number of Process Steps

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SLIDE 20

20 The ConFab – May 2015

Agenda

  • KLA-Tencor Introduction
  • Value of Process Control
  • Strategy for Future Process Control Challenges
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SLIDE 21

21 The ConFab – May 2015

KLA-Confidential – Internal Use Only

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  • Many new materials and

technology challenges

  • Lithography / Patterning
  • Rising fab, design,

development and litho costs

  • Transistor costs if yields

aren’t achieved

Challenges to Moore’s Law

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22 The ConFab – May 2015

Accelerating Yield is the Best Solution to Achieving Cost Goals of Moore’s Law

(J. Chen, IPTC Keynote 2011)

Transistor Costs

  • 1. Scaling Factor
  • 2. Manufacturing

Costs

  • 3. Yields

Source: Nvidia, IC Cost Knowledge, KLA-Tencor

Transistor Cost Improvements Slowing

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23 The ConFab – May 2015

  • Is My Design Robust?
  • Where are the Weak Points?
  • What is the Impact of Process Variance?
  • What is My Process Window?
  • What are the Sources of Error?
  • What is the Impact of Process Variance?

Problems for IC Manufacturers Continue to Grow

How Robust is My Design and Process Window?

30 to 300 Million Potential Weak Points

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24 The ConFab – May 2015

Process Window Discovery, Expansion and Control

Bare Wafer Inspection

Defect Discovery Pattern Fidelity “5D”

Patterned Wafer Inspection Unpatterned Wafer Inspection e-beam Review Design

+

Optical CD/Shape Overlay Mask Registration Wafer Shape & Geometry Films

Strategy & Structure: Growing Investment in System of Systems

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25 The ConFab – May 2015

Intelligent Feed Forward and Feedback Required for Pattern Control

Process Variation

FEED FORWARD

Existing feedback loops Optimized feedback loops Feed forward loops

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26 The ConFab – May 2015

Process Control Critical to IC Industry Success

Investment in Process Control Provides Strong ROI

  • Process Control Helps
  • Ramp Yields Faster
  • Lower Costs
  • Improve Cycle Times
  • Lower Risks
  • Provide More Predictable

Delivery

  • Increase Profits

Shorter Development Times Faster Manufacturing Ramps Improved Yield Improved Predictability Source: KLA-Tencor

Increased Profit and Lower Costs for Chipmakers