Affinity 2.0 Electroless Nickel Immersion Gold HIGH PERFORMANCE LOW - - PowerPoint PPT Presentation

HIGH PERFORMANCE LOW VARIATION FINAL FINISH

Affinity 2.0 Electroless Nickel – Immersion Gold

Global Final Finish Team April 2017

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MacDermid Enthone Electronics Solutions

Leading Chemical Process Supplier in Global Electronics Markets

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GLOBAL PRESENCE

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Our Product Offerings

ADVANCED ELECTRONICS FINAL FINISHES METALLIZATION ELECTRONICS MATERIALS MEMORY DISK ELECTRONICS SPECIALTIES

• Direct Metallization
• Rigid PCBs
• Flex Circuitry
• Electroless Copper
• Electrolytic Coppers
• High Throw DC
• Periodic Pulse Reverse
• Via Fill / Through Hole Fill
• Organic Solderability

Preservative

• Immersion Tin
• Immersion Silver
• ENEPIG
• ENIG
• Leadframe Adhesion

Promotion

• Component Termination

Solderability

• Molded Interconnect Devices
• Light Emitting Diodes
• Solar Cell Metallization
• Specialty Treatments for Copper
• Dryfilm
• Copper Etchant
• Resist Strippers
• Solder Strippers
• Connector Finishing
• Oxide and Oxide Alternatives
• High RF Applications
• Damascene Copper
• Wafer Level Packaging
• Bump Plating
• Copper Pillars
• Redistribution Layers
• Preclean and Zincate

Solutions for AI substrate

• High Quality EN
• High Corrosion Resistance
• Low Particle Inclusion (PDI)
• Low Pit Count

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Our Product Offerings

ADVANCED ELECTRONICS FINAL FINISHES METALLIZATION ELECTRONICS MATERIALS MEMORY DISK ELECTRONICS SPECIALTIES

• Direct Metallization
• Rigid PCBs
• Flex Circuitry
• Electroless Copper
• Electrolytic Coppers
• High Throw DC
• Periodic Pulse Reverse
• Via Fill / Through Hole Fill
• Organic Solderability

Preservative

• Immersion Tin
• Immersion Silver
• ENEPIG
• Affinity ENIG 2.0
• Leadframe Adhesion

Promotion

• Component Termination

Solderability

• Molded Interconnect Devices
• Light Emitting Diodes
• Solar Cell Metallization
• Specialty Treatments for Copper
• Dryfilm
• Copper Etchant
• Resist Strippers
• Solder Strippers
• Connector Finishing
• Oxide and Oxide Alternatives
• High RF Applications
• Damascene Copper
• Wafer Level Packaging
• Bump Plating
• Copper Pillars
• Redistribution Layers
• Preclean and Zincate

Solutions for AI substrate

• High Quality EN
• High Corrosion Resistance
• Low Particle Inclusion (PDI)
• Low Pit Count

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ENIG Popularity

Strength and Weakness Analysis

Advantages……

• Long Shelf Life
• No Tarnish
• No Whiskers
• Consistent Solderability (multiple reflows).
• Aluminum Wirebondable.
• Surface Contact (Keypads)
• High Solderspread
• No Issues with Paste Misprints

Disadvantages……

• More Expensive (CEM/OEM)
• High Temperature Process (PCB Fab)
• Complex Process (PCB Fab)
• Not Re-workable (PCB Fab)
• Ni-Sn Solderjoint (Cu-Sn is preferred)
• Blackpad “Hangover” from the 90’s

HASL OSP Imm Silver Imm Tin ENIG ENEPIG

Planarity No Yes Yes Yes Yes Yes Solderjoint Cu-Sn Cu-Sn Cu-Sn Cu-Sn Ni-Sn Ni-Sn Relative Cost $ $ $$ $$ $$$ $$$ IPC Shelf Life No Specification No Specification 12 months 12 months 12 months 12 months Reflows 6 4 6 2 6 6 Contact E-Test, ICT Difficult E-Test, ICT, Keypad E-Test E-Test, ICT, Keypad E-Test, ICT, Keypad Press Fit Good Good Good Good Good Good Au Wirebond No No No No No Yes Al Wirebond No No Yes No Yes Yes

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Affinity ENIG 2.0

Reduced Variation - Higher Yield – Lower Operating Cost ENIG

• Affinity ENIG 2.0 has been developed from the lead ENIG technologies

from our newly integrated companies combining new innovations from our collective expertise.

• EN Corrosion
• EN corrosion has been engineered out of the process eliminating

concern and discussion with end users and OEM’s.

• Six Sigma Development
• Defects and wastes driven out during development and process variation

minimized in production– giving increased uniformity of product, compliance to OEM and End User specifications and unrivaled reliability.

• The Lowest Gold Metal Operating Cost
• Low gold thickness variation over time and between feature sizes

provides excellent control of gold consumption and significant

• pportunity for operating cost reduction.

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Technology Benefits – Six Sigma Development

Affinity ENIG 2.0

What is Six Sigma and why is it important to your business? “The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety

• f industries for their proficiency at reducing defects and driving process improvement.

A six sigma process produces only 3.4 defects per million opportunities! We already have a 99% ENIG yield, why would we care about Six Sigma ?

(1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day!

• 99% take-off success would mean 11 air disasters every day!!!

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Technology Benefits – Six Sigma Development

Affinity ENIG 2.0

What is Six Sigma and why is it important to your business? “The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety

• f industries for their proficiency at reducing defects and driving process improvement.

A six sigma process produces only 3.4 defects per million opportunities! We already have a 99% ENIG yield, why would we care about Six Sigma ?

(1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day!

• 99% success would mean 11 air disasters every day!!!

(2) A PCB Fabricator produces 5,000 panels per day with a 99% ENIG yield !

• 99% yield would mean 14,500 scrap panels per year (based on 290 working days per year).

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Technology Benefits – Six Sigma Development

Affinity ENIG 2.0

What is Six Sigma and why is it important to your business? “The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety

• f industries for their proficiency at reducing defects and driving process improvement.

A six sigma process produces only 3.4 defects per million opportunities! We already have a 99% ENIG yield, why would we care about Six Sigma ?

(1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day!

• 99% success would mean 11 air disasters every day!!!

(2) A PCB Fabricator produces 5,000 panels per day with a 99% ENIG yield !

• 99% yield would mean 14,500 scrap panels per year (based on 290 working days per year).

Six Sigma’s vast tool kit was used throughout research, alpha and beta test phases of Affinity ENIG 2.0. MacDermid-Enthone’s Six Sigma green and black belts will bring these benefits to your factory.

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Technology Benefits – Six Sigma Development

Affinity ENIG 2.0

• 4.8 MTO

• 4 MTO

• 3 MTO

• 2 MTO

• 1

• O MTO

• 4.8 MTO

• 4 MTO

• 3 MTO

• 2 MTO

• 1

• O MTO

Xbar-S Chart of Affinity 2.0 EN %P

1st 2nd 4th 3rd

Overall Ranking

Quality Deployment Function

• Used to compare ENIG chemistries during development process.
• Created a focus to improve EN %P control and corrosion.
• Created a focus to eliminate cost.

Measurement System Analysis

• Used to understand Au thickness and EN%P measurement errors.
• Improved measurement of gold thickness and EN %P.
• Improved control of gold thickness and cost.

Statistical Process Control

• Used to ensure “Critical to Quality” process variables are under control.
• Same product every shift and every day.

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Technology Benefits – Six Sigma Development

Affinity ENIG 2.0

Design of Experiments

• Used to optimize and understand effect and Interactions of Key Process Variables.
• Issues engineered out during design stage.
• MacDermid-Enthone service team has a deep understanding of the process.

Capability Analysis

• Used to assess process performance against End User or OEM specifications.
• OEM specifications met.

Reliability Simulations

• Weibull and other reliability simulations undertaken to ensure deposit meets

Industry expectations.

• Reliability confidence when PCB’s are out in the field.

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Affinity ENIG 2.0

Process Cycle and Equipment Equipment And Plating Cycle:

Affinity Clean Affinity Etch Microetch Post -Dip Affinity Activate PDS Affinity Activator Post -Dip Affinity 2.0 Electroless Nickel Affinity 2.0 Immersion Gold

• Affinity 2.0 fits into standard ENIG process equipment, giving technical

benefits over incumbent processes.

• Equipment improvements available to deliver improved deposit

distribution uniformity for new build or retro fit.

• Affinity Nickel 2.0 delivers 0,15-0,23 µ/min plating rate over 5 MTO

giving unrivaled productivity.

• Affinity 2.0 has been engineered to be simple to use eliminating the

need for complicated auto-control / analysis systems reducing engineering time and chance of operator error.

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Affinity ENIG 2.0

Process Chemistry Overview Affinity Clean Affinity Etch Sulfuric Acid Pre-dip Affinity Activate PDS Affinity Post-dip Affinity Nickel 2.0 Affinity Gold 2.0

• Acid Cleaner
• Options to take care of NPTH plating and produce chemically clean surfaces for

subsequent processing.

• Microetch
• Etch options to minimize variation of incoming copper surface.
• Activator Pre-dip
• Helps minimize occurrence of galvanic skipping.
• Palladium Sulfate Based Activator
• Low palladium concentration to minimize operating cost and formulated to eliminate

extraneous and skip plating.

• Activator Post-dip
• Helps to minimize risk of extraneous plating.
• Electroless Nickel
• Dummy free, stable and easy to use chemistry. Provides superior phosphorous

control, cosmetic appearance and deposit uniformity.

• Immersion Gold
• Optimized for low gold metal operation with excellent thickness and corrosion control.

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AFFINITY ENIG 2.0

Pre-Treatment

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Affinity ENIG 2.0

There are many variables in the PCB manufacturing process prior to the ENIG process that can effect yield. Affinity 2.0 has been developed with pretreatment options designed to minimize variation in incoming panel quality.

Pre-Treatment Technology Overview

• Affinity NPTH Cleaner 2.0
• Affinity Etch One
• Affinity Activate PDS
• Excellent cleaning of copper surfaces removing dirt, oils, and copper oxidation ensuring nickel

adhesion and coverage.

• Ties up residual palladium in tooling holes from electroless copper processing preventing

undesired plating.

• Produces cleaned etched surface for optimal palladium adsorption.
• Modifies copper topography to provide uniform low roughness surface for Electroless Nickel

grain formation eliminating larger EN grain boundaries which are more prone to galvanic attack in Immersion Gold chemistry.

• Optimized to activate copper surfaces and eliminate extraneous plating on a variety of

commonly used and high performance PCB laminates.

• Mild formulation minimizes copper build up and provides long solution life giving high

performance with economical operating cost.

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Affinity ENIG 2.0

Cleaner Technology

• Affinity Cleaner 1.0 and Affinity NPTH Cleaner 2.0 both provide

effective removal of copper oxide, fingerprints and other soils from previous manufacturing processes.

• Affinity NPTH Cleaner 2.0 is a two part cleaning system that provides a

solution for elimination of unwanted plating in tooling holes. Utilization of a palladium poison renders residual palladium inactive during the cleaning process preventing Electroless Nickel plating.

Ni 2+ Ions Residual Pd Pd Poison

Affinity Cleaner 1.0 Affinity NPTH Cleaner 2.0

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Affinity ENIG 2.0

Microetch Technology

• Excessive copper roughening prior to

soldermask application can result in irregular grain boundary formation during Electroless Nickel deposition. Irregular EN grain boundaries have been cited as potential sites for excessive corrosion during Immersion Gold deposition.

• Affinity Etch and Affinity Etch One

microetch processes contain surface topography modifiers which allow reduction of surface roughness creating uniform copper surfaces and resulting in a more uniform Electroless Nickel surface.

Untreated Roughened Copper Following ENIG Roughened Copper / Etch One Following ENIG

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Affinity ENIG 2.0

Microetch Post-Dip Technology

0.35 MTO

• Trapped microetch chemistry in partially plugged via holes can create galvanic cells will enough potential to prevent Electroless Nickel

plating along the connected trace.

• Use of a simple sulphuric acid post dip following microetch is sufficient to assist with removal of the trapped process chemistry.
• MacDermid-Enthone recommend inclusion of this process step to safeguard against galvanic skipping pads without resorting to expensive

proprietary chemistry.

Skipped Pad Trapped Solution Via Hole

Bulk EN Solution

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Affinity ENIG 2.0

Activator Technology

FR-4 Material Aluminum Nitride Ceramic

• Affinity Activate PDS is a palladium sulphate

based activator optimized for compatibility with common and advanced substrates alike.

• Skip and extraneous free electroless nickel

deposition ensuring yield maximization.

• Operation at 25 ppm of palladium giving low

make cost and drag out losses.

• Mild corrosivity for copper ensures long

working bath.

Arlon 85N Isola P96 Rogers 3010

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Affinity ENIG 2.0

Activator Post-Dip Technology

0.35 MTO

• Post Dip Chemistry has the ability to removal residual palladium from tight geometries and hold in solution preventing re-deposition.
• This results in cleaner feature edges and a reduction in extraneous plating with problematic spacing and or materials.

Complexor Palladium

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AFFINITY ENIG 2.0

Electroless Nickel

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Affinity ENIG 2.0

Electroless Nickel Technology Overview

Affinity 2.0 Electroless Nickel has been designed to work synergistically with the Affinity 2.0 Pre-Treatment chemistry to ensure a uniform and consistent initiation of electroless nickel. So what does this mean to the PCB Fabricator ?

Affinity 2.0 Electroless Nickel’s enhanced chemistry delivers……

• “Right first basket” start up.
• Reduced cycle time and cost by elimination of need to dummy plate.
• Efficient even in stop/start situations. No need to worry about start up procedures
• Consistent basket to basket nickel thickness.
• Consistent productivity irrespective of Electroless Nickel solution age.
• Formulation minimizes effect of EN property changes as bath ages = consistent rack to rack deposition.
• Superior control over phosphorous content over long Electroless Nickel life.
• Improved cosmetic appearance of ENIG deposit.
• Consistent corrosion resistance of Electroless Nickel deposit.
• Consistent gold thickness basket to basket.
• Simplified operation.
• Elimination of operator intervention.
• Reduced special cause variation and potential for operator error.

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Affinity ENIG 2.0

Technology Benefits – Electroless Nickel Plating Rate

Having high and consistent plating rates allows the PCB fabricator high levels of productivity and increased control over EN thickness without having to adjust Electroless Nickel pH to maintain throughput and the resultant phosphorous content sacrifices.

5 4 3 2 1

10 8 6 4

EN MTO microinch / min _ X=6.833 UCL=7.418 LCL=6.248 5 4 3 2 1

0.8 0.6 0.4 0.2 0.0

EN MTO Moving Range __ MR=0.22 UCL=0.7188 LCL=0

I-MR Chart of Affinity Nickel 2.0 Plating Rate

• Temperature increase from 80 to 86 OC allows consistent

electroless nickel thickness to be achieved over 5 EN MTO’s.

• Consistent EN thickness with increasing EN age.
• All EN cells have same plating speed.
• No reduction in productivity.
• Temperature adjustment has no significant effect on the

electroless nickel phosphorous content, and is thus preferred to pH adjustment.

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Affinity ENIG 2.0

Phosphorous Content – Measurement System Error

• Neither EDS or XRF showed good %P analysis performance (< 10 % of the tolerance).
• The XRF method showed minimal bias (error reading the standard) and if enough measurements are made the average %P is close to the actual.
• It was determined that averaging 10 XRF measurements provide a suitable measurement system of EN %P.

Reference 9.5762 Mean 9.563224 StDev 0.1 054968 6 × StDev (SV) 0.6329809 Tolerance (Tol) 2 Basic Statistics Bias

• 0.01

2976 T 0.61 49740 PValue 0.544 (Test Bias = 0) Bias Cg 0.63 Cgk 0.59 Capability %Var(Repeatability) 31 .65% %Var(Repeatability and Bias) 33.84% Gage name: Waterbury SDD XRF Date of study: Feb 201 6 Reported by: Paul Romaine Tolerance: 2 Misc:

25 23 21 1 9 1 7 15 1 3 1 1 9 7 5 3 1 1 0.5 1 0.0 9.5 9.0

Observation %P

Ref Ref + 0.10 × Tol Ref - 0.10 × Tol

Run Chart of %P by XRF

Type 1 Gage Study for %P

Reference 9.67 Mean 9.9453 StDev 0.22753 6 × StDev (SV) 1 .3651 8 Tolerance (Tol) 2 Basic Statistics Bias 0.2753 T 4.68670 PValue 0.000 (Test Bias = 0) Bias Cg 0.29 Cgk

• 0.1

1 Capability %Var(Repeatability) 68.26% %Var(Repeatability and Bias)

• 1

81 .22% Gage name: Taiwan GDAC SEM-EDS Date of study: May 201 6 Reported by: Kenny Lin Tolerance: 2 Misc:

1 5 1 4 1 3 12 11 10 9 8 7 6 5 4 3 2 1 1 0.50 1 0.25 1 0.00 9.75 9.50

Observation %P EDS

Ref Ref + 0.10 × Tol Ref - 0.10 × Tol

Run Chart of %P EDS

Type 1 Gage Study for %P EDS

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Technology Benefits – Electroless Nickel Phosphorous Content

• Some traditional EN systems utilize pH adjustment to maintain plating rate with age, thus reducing the EN %P.
• Affinity 2.0 EN uses temperature increase to maintain plating rate and thus no effect on the deposit %P content.
• Thus Affinity 2.0 EN maintain consistent deposit properties over the working life of the chemistry.
• With high MSE associated for EN %P this reduces chance of EOL deposits being out of specification.

Affinity ENIG 2.0

5 MTO 4 MTO 3 MTO 2 MTO 1 MTO 0 MTO 9 8 7 Sample Mean _ _ X=7.925 UCL=8.094 LCL=7.756 5 MTO 4 MTO 3 MTO 2 MTO 1 MTO 0 MTO 0.3 0.2 0.1 Sample StDev _ S=0.1731 UCL=0.2971 LCL=0.0491

Xbar-S Chart of Traditional EN %P

Affinity 5 MTO Affinity 4 MTO Affinity 3 MTO Affinity 2 MTO Affinity 1 MTO Affinity 0 MTO 9 8 7 Sample Mean _ _ X=8.981 UCL=9.186 LCL=8.776 Affinity 5 MTO Affinity 4 MTO Affinity 3 MTO Affinity 2 MTO Affinity 1 MTO Affinity 0 MTO 0.4 0.3 0.2 0.1 Sample StDev _ S=0.2102 UCL=0.3608 LCL=0.0596

Xbar-S Chart of Affinity 2.0 EN %P

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Predictable EN deposit %P allows…

• High conformance to OEM and end user specifications.
• Consistent corrosion resistance.
• Excellent gold thickness control.
• Consistent low level of observed corrosion anomalies.
• Consistently reliable functional performance.

Technology Benefits – Electroless Nickel Phosphorous Content

Several OEM’s already specify an EN phosphorous content of 7 – 10%, but PC Fabricators prefer 8 – 10 % due to improved corrosion resistance. Out of specification (low) phosphorous content is often cited in failure analysis as root cause of excessive

• corrosion. Affinity 2.0 Electroless Nickel demonstrates consistent EN %P allowing consistent corrosion resistance over the

working life contributing to reduced variation in gold thickness as well as minimizing observed corrosion anomalies.

Affinity ENIG 2.0

EN2 - 4.6 MTO EN2 - 4 MTO EN3 - 3 MTO EN2 - 2 MTO EN2 - 1 MTO EN2 - 0 MTO EN1

• 4.8 MTO

EN1

• 4 MTO

EN1

• 3 MTO

EN1

• 2 MTO

EN1

• 1

MTO EN 1

• O MTO

9.2 9.0 8.8 Sample Mean _ _ X=8.9642 UCL=9.2270 LCL=8.7014 EN2 - 4.6 MTO EN2 - 4 MTO EN3 - 3 MTO EN2 - 2 MTO EN2 - 1 MTO EN2 - 0 MTO EN1

• 4.8 MTO

EN1

• 4 MTO

EN1

• 3 MTO

EN1

• 2 MTO

EN1

• 1

MTO EN 1

• O MTO

0.4 0.3 0.2 0.1 Sample StDev _ S=0.2695 UCL=0.4625 LCL=0.0764

Xbar-S Chart of Affinity 2.0 EN %P

XRF %P measurement over two Electroless Nickel solution lives

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Affinity ENIG 2.0

Technology Benefits – Consistent EN and ENIG Structure

EN Only ENIG

• Affinity 2.0 provides a consistent and uniform EN deposit structure over 5 MTO’s. This allows not only consistent gold deposit

but improved cosmetic appearance.

0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO

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Affinity ENIG 2.0

Technology Benefits – Consistent Cosmetic Appearance

• Affinity 2.0 Electroless Nickel’s highly uniform

structure allows improvement in ENIG cosmetic appearance.

• Improved “haloing” of PTH-in-ground features.
• Reduced pad-pad color differences between

adjacent pads connected to trace or ground area.

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AFFINITY ENIG 2.0

Immersion Gold

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Affinity ENIG 2.0

Technology Benefits- Corrosion Control

Anodic Reaction Ni → Ni2+ + 2e- Cathodic Reaction 2[Au(CN)2]- → 2Au+ + 4CN- 2Au+ + 2 e- → 2 Au Overall Reaction Ni + 2[Au(CN)2]- → 2Au + [Ni(CN)4]2-

• Immersion gold mechanism involves galvanic

displacement of nickel ions from the EN surface

• The point at which EN corrosion leads to reliability

concerns is debated, but this concern is reduced significantly with Affinity 2.0

• PCB fabricators and end users continue to become

more critical of ENIG corrosion, this is reflected in the recent revision A of IPC4552

• Affinity ENIG 2.0 has been developed with these

concerns in mind, delivering low and consistent corrosion occurrence.

Affinity 2.0 Traditional ENIG

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IPC4552 Revision A

Corrosion Control

IPC4552A section ”3.6 Nickel Hyper-Corrosion” discusses and tries to add some sense and uniformity to the ongoing ENIG corrosion acceptability and reliability argument. Key Points….

• Some occurrences of hyper-corrosion will always be found if enough samples are taken from a printed board or if excessive

magnification is used for evaluation. A single occurrence of hyper-corrosion is NOT rejectable.

• The defect associated with hyper-corrosion is non-wetting (although the gold has been consumed) as defined by a lack of

Intermetallic Compound (IMC) formation.

• Hyper-corrosion may be evident but if it does not interfere with the formation of a reliable solder joint as defined by contiguous

IMC formation, it is NOT considered to be rejectable.

• Severe hyper-corrosion whereby the soldering is impacted negatively is a rejectable condition. Inspection of hyper-corrosion for

acceptance criteria shall use optical microscopy at a maximum of 1000X magnification.

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IPC4552 Revision A

Corrosion Control

IPC4552A section ”3.6 Nickel Hyper-Corrosion” discusses and tries to add some sense and uniformity to the ongoing ENIG corrosion acceptability and reliability argument. Key Points….

• Some occurrences of hyper-corrosion will always be found if enough samples are taken from a printed board or if excessive

magnification is used for evaluation. A single occurrence of hyper-corrosion is NOT rejectable.

• The defect associated with hyper-corrosion is non-wetting (although the gold has been consumed) as defined by a lack of

Intermetallic Compound (IMC) formation.

• Hyper-corrosion may be evident but if it does not interfere with the formation of a reliable solder joint as defined by contiguous

IMC formation, it is NOT considered to be rejectable.

• Severe hyper-corrosion whereby the soldering is impacted negatively is a rejectable condition. Inspection of hyper-corrosion for

acceptance criteria shall use optical microscopy at a maximum of 1000X magnification. Non-wetting soldering defects can occur for many reasons. For this reason a consistent and low level of EN corrosion is advisable to avoid any solderability failure being diagnosed as “Hyper Corrosion”.

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Affinity ENIG 2.0

Optimization of Galvanic Displacement Reaction

Traditional ENIG

Traditional ENIG - Galvanic Displacement Reaction

• 1a. Replacement of Ni from EN surface with Au ion (electron transfer) proceeds.
• 2. Gold deposit forms with spikes of corrosion.
• 1b. Oxidation of the EN surface can occur simultaneously.

Gold Deposit Corrosion Spikes Electroless Nickel Copper

Affinity 2.0 ENIG - Controlled Galvanic Displacement Reaction

• 1. Surface Active Agent adsorbs on EN surface
• 2. Surface Active Agent desorbtion allows
• 3. Controled replacement of nickel with gold

preventing nickel oxidation / corrosion. controlled replacement of Nickel with Gold. proceeds by repeating stages 1 and 2. Gold Deposit Surface Active Agent Electroless Nickel Copper

O2 O2 Au+ Ni2+ Ni2+ Ni2+ Ni2+ O2 Au+ Ni2+ Ni2+ Ni2+ Ni2+ O2 O2

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Affinity ENIG 2.0

Optimization of Galvanic Displacement Reaction

Traditional ENIG Affinity ENIG 2.0

Traditional ENIG - Galvanic Displacement Reaction

• 1a. Replacement of Ni from EN surface with Au ion (electron transfer) proceeds.
• 2. Gold deposit forms with spikes of corrosion.
• 1b. Oxidation of the EN surface can occur simultaneously.

Gold Deposit Corrosion Spikes Electroless Nickel Copper

Affinity 2.0 ENIG - Controlled Galvanic Displacement Reaction

• 1. Surface Active Agent adsorbs on EN surface
• 2. Surface Active Agent desorbtion allows
• 3. Controled replacement of nickel with gold

preventing nickel oxidation / corrosion. controlled replacement of Nickel with Gold. proceeds by repeating stages 1 and 2. Gold Deposit Surface Active Agent Electroless Nickel Copper

O2 O2 Au+ Ni2+ Ni2+ Ni2+ Ni2+ O2 Au+ Ni2+ Ni2+ Ni2+ Ni2+ O2 O2

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Affinity ENIG 2.0

Technology Benefits – Corrosion Control

0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO

• Affinity ENIG 2.0 provides excellent corrosion observations by X-Section and SEM following gold stripping.
• PCB Fabricator and End Users will observe consistent and low occurrence of corrosion.
• Eliminate concern and discussion over reliability associated with traditional ENIG systems.

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Affinity ENIG 2.0

Gold Thickness Control: Ability to meet Specification

Revision A to IPC4552.

X ̄ - 3s ≥ 0.04 µm [≥1.58 µIn] X ̄ + 3s ≤ 0.1 µm [≤3.94 µIn]

• IPC has added an upper specification limit for gold thickness
• Addition of upper boundary increases need for Gold

thickness control to maintain a capable process.

• IPC allows a lower average Gold thickness is good deposit

distributions can be achieved.

• This offers potential savings in gold metal consumption.

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Affinity ENIG 2.0

Gold Thickness – IPC4552 Rev A Specification

• Gold thickness specification statistical constraints adds more pressure to maintain a consistent gold thickness .
• Affinity ENIG 2.0 shows consistent basket to basket gold thickness control - no thickness variation due to EN age.
• High level of conformance to the IPC4552 (Revision A) specification - 0 DMPO (no out of specification parts produced).

5.0 MTO 4.5 MTO 4.0 MTO 3.5 MTO 3.0 MTO 2.5 MTO 2.0 MTO 1 .5 MTO 1 .0 MTO 0.5 MTO 0 MTO 2.40 2.25 2.1 Sample Mean _ _ X=2.2704 UCL=2.3376 LCL=2.2033 5.0 MTO 4.5 MTO 4.0 MTO 3.5 MTO 3.0 MTO 2.5 MTO 2.0 MTO 1 .5 MTO 1 .0 MTO 0.5 MTO 0 MTO 0.1 0.05 0.00 Sample StDev _ S=0.0471 UCL=0.0983 LCL=0

Xbar-S Chart of Affinity 2.0 ENIG Gold Thickness

As per IPC4552 Revision A

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Affinity ENIG 2.0

Gold Thickness – IPC4552 Rev A Specification

• Gold thickness specification statistical constraints adds more pressure to maintain a consistent gold thickness .
• Affinity ENIG 2.0 shows consistent basket to basket gold thickness control - no thickness variation due to EN age.
• High level of conformance to the IPC4552 (Revision A) specification - 0 DMPO (no out of specification parts produced).
• Potential for reduction in gold consumption - Average gold thickness reduction.

5.0 MTO 4.5 MTO 4.0 MTO 3.5 MTO 3.0 MTO 2.5 MTO 2.0 MTO 1 .5 MTO 1 .0 MTO 0.5 MTO 0 MTO 2.40 2.25 2.1 Sample Mean _ _ X=2.2704 UCL=2.3376 LCL=2.2033 5.0 MTO 4.5 MTO 4.0 MTO 3.5 MTO 3.0 MTO 2.5 MTO 2.0 MTO 1 .5 MTO 1 .0 MTO 0.5 MTO 0 MTO 0.1 0.05 0.00 Sample StDev _ S=0.0471 UCL=0.0983 LCL=0

Xbar-S Chart of Affinity 2.0 ENIG Gold Thickness

As per IPC4552 Revision A

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Affinity ENIG 2.0

Understanding Variation: What Does Gold Distribution Mean For Quality and Savings?

• A normal distribution will have 99.7% of all data evenly distributed ± 3 standard deviations from the population mean (µ).
• Therefore 99.85% of all gold thickness measurements will be + 6 standard deviations from the minimum thickness measured.

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Affinity ENIG 2.0

Understanding Variation: What Does Gold Distribution Mean For Savings?

• Some PCB fabricators only care about not

exceeding the minimum specification gold thickness.

• With poorly distributed Immersion Gold thickness

this can lead to significant waste.

Affinity 2.0 Competing ENIG

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Affinity ENIG 2.0

Understanding Variation: What Does Gold Distribution Mean For Savings?

• Some PCB fabricators only care about not

exceeding the minimum specification gold thickness.

• With poorly distributed Immersion Gold thickness

this can lead to significant waste.

• Affinity ENIG 2.0 has been demonstrated to

deliver significantly improved gold thickness distribution over competitive ENIG systems.

Affinity 2.0 Competing ENIG Waste $

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Affinity ENIG 2.0

Affinity 2.0 Competing ENIG

Cost Down

Ave Au = 2.0 µIn Ave Au = 2.8 µIn

Understanding Variation: IPC4552A - What Does Gold Distribution Mean For Savings?

• Some PCB fabricators only care about not

exceeding a minimum specification gold thickness.

• Poor gold thickness distribution = significant

waste

• Affinity ENIG 2.0 delivers significantly improved

gold thickness distribution compared to competitive ENIG systems.

• IPC4552 Rev. A allows minimum gold

thickness of 1.58 microinches at three standard deviations below the average thickness.

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Affinity ENIG 2.0

Affinity 2.0 Competing ENIG

Cost Down

Ave Au = 2.0 µIn Ave Au = 2.8 µIn

Understanding Variation: IPC4552A - What Does Gold Distribution Mean For Savings?

• Some PCB fabricators only care about not

exceeding a minimum specification gold thickness.

• Poor gold thickness distribution = significant

waste

• Affinity ENIG 2.0 delivers significantly improved

gold thickness distribution compared to competitive ENIG systems.

• IPC4552 Rev. A allows minimum gold thickness
• f 1.58 microinches at three standard deviations

below the average thickness.

• This translates directly to cost savings for

processes with tighter gold thickness distributions.

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Affinity ENIG 2.0

Technology Benefits – Basket to Basket and Within Panel Gold Thickness Comparison

• .Affinity 2.0 – Shows a consistent average thickness over time (5 EN MTO’s) due to minimized basket-

basket gold variation. Affinity 2.0 also shows superior gold thickness dispersion around the average gold thickness due to the superior within panel distribution. These two features provide excellent control over gold thickness and therefore cost.

1 2 4 3

• Affinity 2.0 and three competitive

ENIG systems were analyzed for basket to basket gold thickness as well as within panel gold thickness.

• 4 different pad sizes
• 5 Panel locations
• Over 5 EN MTO’s

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Technology Benefits – Proving Cost Savings

Affinity ENIG 2.0

• Affinity ENIG 2.0 deposits have shown consistent low gold distribution vs competitive products in benchmarking exercises.
• Affinity ENIG 2.0 has potential to realize large reductions in gold metal consumption.

3.00 2.75 2.50 2.25 2.00 1.75 1.50 0.35 0.30 0.25 0.20 0.15 0.10

Average Au Thickness Std Dev

Traditional MacDermid Enthone 2 Traditional MacDermid Enthone 1 Competition B Competition C Competition A-1 Competition E Competition D Competition A-2 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0 Affinity 2.0

Scatterplot of Std Dev vs Average Au Thickness

Analysis of Affinity 2.0 ENIG vs Competitive Systems

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Affinity ENIG 2.0

Technology Benefits – Average Gold Thickness Reduction / Cost Saving Calculation

Au Metal $/g 37.85 Metal Area 15.00% Incumbent Affinity 2.0 Minimum Gold Thickness microinches Gold Thickness Standard Deviation 0.2500 0.1500 microinches Average Au Thickness 2.35 2.05 microinches Gold Metal Consumed 0.0316 0.0276 gram /panel sq ft Gold Metal Cost $1.20 $1.044 $ /panel sq ft Gold Consumption Reduction Product Estimate Month Monthly Saving Annual Saving 1.60 125,000 $19,106.50 $229,278.06

Net Benefit in Gold Consumption Calculation

12.77% 0.5 1 1.5 2 2.5 3 0.5 1 1.5 2 2.5 3 3.5 Density Au (microinches)

Gold Thickness Distribution Affinity 2.0 ENIG vs. Competitive System

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AFFINITY ENIG 2.0

Reliability and Performance Testing

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Affinity ENIG 2.0

Lead Free Soldering – Introduction

• Affinity ENIG 2.0 Supercoupons TV’s processed at every EN MTO.
• All samples for Lead Free solderability testing were pre-conditioned

by processing X3 as per the attached lead free profile.

• Following Pre-Conditioning these TV’s were assessed for

solderspread and ballshear using as well as PTH fill by lead free wave soldering.

• Peak Temp of Panel = 255 OC

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Affinity ENIG 2.0

Technology Benefits – Soldering

• Using Alpha CVP-390 SAC305 solderpaste, Affinity 2.0

shows excellent solder wetting properties following X3 lead free reflow.

• Solderspread analysis shows high and consistent %

spread measurements from 0 – 5 EN MTO’s.

5 MTO 4 MTO 3 MTO 2 MTO 1 MTO 0 MTO 350 300 250 200 150 100 50

Affinity Nickel 2.0 MTO % Solderspread

Boxplot of Affinity 2.0 Solderspread vs EN MTO

0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO

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Affinity ENIG 2.0

Technology Benefits – Soldering

• Affinity 2.0 shows excellent high and consistent ball shear performance.
• All failures observed are the preferred ductile failure mode (within solderball).

5 MTO 4 MTO 3 MTO 2 MTO 1 MTO 0 MTO 3.0 2.5 2.0 1.5 1.0 0.5 0.0

Affinity Nickel 2.0 MTO Kg Force

Boxplot of Affinity 2.0 Ball-Shear vs EN MTO Solder Ball Laminate

• 1. Pad/Substrate
• 2. Intermetallic(IMC)
• 3. Solder Joint
• 4. Bulk Solder

0 MTO 1 MTO 2 MTO 5 MTO 4 MTO 3 MTO

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Affinity ENIG 2.0

Technology Benefits – Soldering

• Supercoupons TV’s were evaluated for PTH filling by passing through

Novastar solderwave equipment under standard conditions for SAC alloy using Alpha EF6000 Flux.

• % of PTH’s filled to Target conditions of IPC J-Std 003 was calculated.

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Affinity ENIG 2.0

Technology Benefits – Soldering

• Affinity 2.0 shows excellent high and consistent PTH filling following X3 lead free reflow - easily

conforming to IPC J-Std 003.

75% 80% 85% 90% 95% 100%

0 MTO 1 MTO 2 MTO 3 MTO 4 MTO 5 MTO PTH % Fill

Affinity 2.0 PTH Filling vs EN MTO

Affinity 2.0 IPC J-Std 003

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Affinity ENIG 2.0

Value Proposition Statement

$86,000 less kW*hrs Reduction In Gold Use Reduction in Out-of- Spec Parts Elimination

• f OEM

returns

Benefits

Reduced Labor costs

Significant operational savings from superior within panel gold thickness distribution and basket to basket thickness control versus competitive processes. Low and consistent corrosion eliminating discussion and concern over reliability. Six Sigma approach to R&D and process control provide robust manufacturing, increased yieild and conformance to end user specifications. Process simplicity results in reductions in labor costs, engineering input, defects and production strain.

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Affinity ENIG 2.0

Proposal

MacDermid-Enthone propose to process standard test vehicles through incumbent ENIG process over the course of the EN life (beginning, middle and end as a minimum). MacDermid-Enthone will analyze the gold thickness distribution, examine the corrosion as well as other key attributes of the ENIG process and provide a report detailing the operating cost reduction and technical benefits in switching to Affinity 2.0. MacDermid-Enthone will process any additional test vehicles required by the customer through Affinity ENIG 2.0 and return them for evaluation.

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For more information…

John Swanson

Director Surface Finishes Global MacDermid Enthone Electronics Solutions 245 Freight St Waterbury CT 06702 john.swanson@macdermidenthone.com O +1 203 575 7909 M +1 203 228 0762

Martin Bunce

Global Applications Manager Lean Six Sigma Black Belt MacDermid Enthone Electronics Solutions 245 Freight St Waterbury CT 06702 martin.bunce@macdermidenthone.com O +1 203 575 5772 M +1 203 706 8539

Ryan Tam

Final Finish Product Manager Asia MacDermid Enthone Electronics Solutions 4/F, #9 Tongfuyu Industrial Town, Tanglang, Xili, Nanshan Dist. Shenzhen, Guangdong ryan.tam@macdermidenthone.com O +8675536905271 M +8613501597927