Adhesion Technology of Copper Surface for High Frequency PWBs - - - PowerPoint PPT Presentation

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MEC Company Ltd. R&D Unit, Team 2 Approved Confirmed Prepared

• M. Kawaguchi

T.Goda

Prep: 2015.04.30

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Adhesion Technology of Copper Surface for High Frequency PWBs

• FlatBOND GT Process -

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Content of Presentation Content of Presentation

Prep: 2015.04.30

• 1. Background of the Development
• 2. FlatBOND GT Process Flow
• 3. Characterizations of FlatBOND GT Surface
• 4. Adhesion of FlatBOND GT Process to Prepregs
• 5. Comparison in Transmission Loss

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• 1. Background of the
• 1. Background of the

Development Development

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Less Etching High Adhesion

Surface Roughening

CZ-8100

Roughly Roughen Finely Roughen Surface Roughening

CZ-8101

L/S

Frequency of Signal

Finer Higher

ETCHBOND CZ Roadmap ETCHBOND CZ Roadmap

Prep: 2015.04.30

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Surface Roughness and Line Shape Surface Roughness and Line Shape

ETCHBOND CZ-8100

2µm(80µin) etching

ETCHBOND CZ-8101

1µm(40µin) etching

L/S=30/30µm(1.18/1.18mil)

Prep: 2015.04.30

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Chemical Roughening

Flat Copper Surface

Transmission Loss of Signal (Skin Effect) Reduction in Line Width for Finer Pattern

Adhesion w/o Etching

FlatBOND

Possible Problem in the Near Future Possible Problem in the Near Future

Prep: 2015.04.30

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L/S

Frequency of Signal

Surface Treatment Technology Roadmap Surface Treatment Technology Roadmap

Finer Higher

Surface Roughening

Less Etching High Adhesion

Flat

FlatBOND

w/o Etching Flat High Adhesion

CZ-8100 CZ-8101

Prep: 2015.04.30

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• 2. FlatBOND GT Process Flow
• 2. FlatBOND GT Process Flow

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FlatBOND GT Process FlatBOND GT Process

Prep: 2015.04.30

Diluted H2SO4 Water Rinse

FlatBOND GT

Acid Cleaning Form Metal Layer

Copper Copper

Cu/Sn/Ni Alloy Layer

Water Rinse Dry Water Rinse

FlatBOND GC

Form Anti-tarnish Layer

Anti-tarnish Layer

Dry

FlatBOND GW

Post Cleaning

Water Rinse MECBRITE CA-5372

Alkaline Cleaning

Copper

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Standard Process Conditions Standard Process Conditions

Prep: 2015.04.30

No. Step Shaft Material Solution Process Condition Temp. Time 1 Alkaline Cleaning SUS CA-5372 35℃ ℃ ℃ ℃(95F) 15sec(Spray) 2 Rinse-1 SUS DI water R.T. 15sec x 3times (Spray) 3 Acid Cleaning Carbon Diluted H2SO4 30℃ ℃ ℃ ℃(86F) 15sec(Spray) /30sec(dip) 4 Rinse-2 SUS DI water R.T. 15sec x 3times (Spray) 5 FlatBOND GT Titanium FlatBOND GT 30℃ ℃ ℃ ℃(86F) 30sec(dip) 6 FlatBOND GW Titanium FlatBOND GW 30℃ ℃ ℃ ℃(86F) 10sec(dip) 7 Rinse-3 SUS DI water R.T. 15sec x 3times (Dip ＆ ＆ ＆ ＆Spray) 8 FlatBOND GC SUS FlatBOND GC 30℃ ℃ ℃ ℃(86F) 30sec(dip) 9 Dry-1 SUS

• 90℃

℃ ℃ ℃(194F) 30sec 10 Rinse-4 SUS DI water R.T. 15sec x 3times (Spray) 11 Dry-2 SUS

• 80℃

℃ ℃ ℃(176F) 30sec

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• 3. Characterizations of the
• 3. Characterizations of the

FlatBOND GT Surface FlatBOND GT Surface

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Surface Composition by XPS Surface Composition by XPS

Prep: 2015.04.30

Thickness of FlatBOND GT layer: 0.05 - 0.1µm(2 - 3.9µin)

10 20 30 40 50 60 70 80 90 100 20 40 60 80 100 120 140 160 180 200

Sputtering time(sec) A t

• m

i c % ( % )

C O Copper Nickel Tin

FlatBOND Surface

0.362Å Å Å Å/sec(SiO2)

Surface Composition of FlatBOND GT

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Assumed Mechanism of FlatBOND GC Assumed Mechanism of FlatBOND GC

Prep: 2015.04.30

FlatBOND GT FlatBOND GT

Before FlatBOND GC Treatment After FlatBOND GC Treatment

R1O - Si - OR1 OR1 R2 HO - Si - OH OH R2 H2O + 3R1OH

Effective element of FlatBOND GC chemical =Silane coupling agent (Formation of silanol groups by hydrolysis)

O HO - Si -OH R2 O HO - Si -OH R2 O HO - Si -OH R2 O HO - Si -OH R2 O O O O H H H H

There are many -OH groups on the FlatBOND GT treated surface that form covalent bond with Si-OH groups of FlatBOND GC.

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Assumed Mechanism of FlatBOND GT Process Assumed Mechanism of FlatBOND GT Process

Prep: 2015.04.30

Cu

FlatBOND GT (Cu-Sn-Ni)

Resin Cu

FlatBOND GT

FlatBOND GC

O HO - Si -OH R2 O HO - Si -OH R2 O HO - Si -OH R2 O HO - Si -OH R2

R3 R3 R3 R3

Functional groups, R2, react with functional groups in resin, R3, which forms covalent bond.

Chemical Bonding!

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Surface Topography Surface Topography

Prep: 2015.04.30

Plated Copper w/o Treatment CZ-8101: 1µm (40µin) FlatBOND GT SEM x3,500

Unlike roughened surface topography with roughening chemical, flat surface is observed after FlatBOND GT treatment.

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Detailed Analysis by FE Detailed Analysis by FE-

• SEM

SEM

Prep: 2015.04.30

SEM (x3,500) FE-SEM (x100,000) Plated Copper w/o Treatment FlatBOND GT

<0.1µm(4µin)

Mechanical Bonding?

Minute holes in nano-scale are observed.

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Prep: 2015.04.30

Pattern Shape Pattern Shape

Pattern Width: 50µm(1.97mil)

Before treatment After FlatBOND GT Process

No change in pattern shape is observed after treatment.

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• 4. Adhesion of FlatBOND GT
• 4. Adhesion of FlatBOND GT

Process to Prepregs Process to Prepregs

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Evaluation Method Evaluation Method

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Resin Type: MEGTRON6(Panasonic, Dk=3.5, Df=0.002@1GHz) MEGTRON7(Panasonic, Dk=3.3, Df=0.001@1GHz) LW-900G(Hitachi Chemical, Dk=3.6, Df=0.003@1GHz) Copper Foil: 35µm(1oz) Standard Cu Foil (3EC-Ⅲ) Surface Treatment: a) CZ-8101: 1µm(40µin) etching b) BO-7790V: 1.5µm(60µin) etching c) FlatBOND GT Process Evaluation Items: Peel strength measurement 1) Initial 2) After reflow*

*Reflow condition is for Pb-free solder.

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Evaluation Method Evaluation Method

Prep: 2015.04.30

Peel Strength Measurement

Test Coupon Treated Copper Foil Laminate

@ MEC

Carrier Board Prepreg Measure Peel Strength JIS C 6481 M side S side (Treated Side) Cut 1cm(0.39in) in width As is Reflow

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Peel Strength Peel Strength

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Peel strength of FlatBOND GT Process is higher than that of roughening treatments for all materials evaluated.

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Peel Strength before & after Reflow Peel Strength before & after Reflow

Prep: 2015.04.30

The peel strength of FlatBOND GT Process is high and stable even after 10 times reflow.

MEGTRON6

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• 5. Comparison in
• 5. Comparison in

Transmission Loss Transmission Loss

Prep: 2015.04.30

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Prep: 2015.04.30

Evaluation Method Evaluation Method

Test Coupon Copper Type: H-VLP(35µm(1oz)) Inner Treatment: a) No treatment b) FlatBOND GT Process c) Black Oxide d) BO-7790V: 1.5µm(60µin) etching e) BO-7790V: 2.5µm(100µin) etching CCL Thickness： 0.13mm(5.1mil) Resin Type: MEGTRON6, 0.06mm(2.4mil) x 2 Pattern Length: 100mm(3.9in), 200mm(7.9in) Impedance： 50Ω Evaluation Item S21 measurement by VNA(Agilent technology PNA-X) 10MHz - 50GHz

M side 35µm (1oz) Cu Inner Treatment 0.28mm (11mil)

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Prep: 2015.04.30

Comparison in Surface Topography Comparison in Surface Topography

a) No treatment b) FlatBOND GT Process c) Black Oxide No photo d) BO-7790V@1.5µm(60µin) e) BO-7790V@2.5µm(100µin) a), b): SEM x5,000 d), e): SEM x3,500

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Comparison in Transmission Loss Comparison in Transmission Loss

Transmission loss for FlatBOND GT Process is almost as same as that for No treatment.

Frequency [GHz] S21 [dB/m] Transmission Loss of Signal Data S21 [dB/in]

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Prep: 2015.04.30

Comparison in Transmission Loss Comparison in Transmission Loss

Transmission loss for FlatBOND GT Process is about 10dB/m(0.25dB/in) less than that for other treatments at 50GHz.

Frequency [GHz] S21 [dB/m] Transmission Loss of Signal Data (magnified figure) S21 [dB/in]