EFECS 2019 - IPCEI on Microelectronics
Jens Fabrowsky, Executive Vice President Automotive Electronics Robert Bosch GmbH
2019-11-19 EFECS 2019 - Jens Fabrowsky, Bosch 1
a a strong European Mic icroelectronics in industry ry for the - - PowerPoint PPT Presentation
EFECS 2019 - IPCEI on Microelectronics IP IPCEI I on Mic icroelectronics - a a strong European Mic icroelectronics in industry ry for the dig igital future in in Europe Jens Fabrowsky, Executive Vice President Automotive Electronics
EFECS 2019 - IPCEI on Microelectronics
Jens Fabrowsky, Executive Vice President Automotive Electronics Robert Bosch GmbH
2019-11-19 EFECS 2019 - Jens Fabrowsky, Bosch 1
EFECS 2019 - IPCEI on Microelectronics
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Mobility Solutions Industrial Technology Consumer Goods Energy & Building Technology
2019-11-19 EFECS 2019 - Jens Fabrowsky, Bosch
EFECS 2019 - IPCEI on Microelectronics
MEMS Sensors
Acceleration / angular rate sensors
For airbag systems, driver information, vehicle dynamics systems, active suspension systems, consumer devices
Optical microsystems
For consumer devices, IoT applications, home appliances, head-up displays
Pressure Sensors
For airbag systems, engine management systems, transmission control systems, consumer devices, IoT solutions
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Semiconductors
SoCs, system ASICs and sensor ASICs
For specific automotive applications
Power semiconductors and modules
Low voltage power semiconductors for various automotive applications and robust high voltage power modules for electric powertrain inverters
IP modules for µC integration
Individual functions, developed in Reutlingen for licensing
Semiconductor components Semiconductor components
2019-11-19 EFECS 2019 - Jens Fabrowsky, Bosch
EFECS 2019 - IPCEI on Microelectronics
Electrified Connected Intelligent Automated
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Source: depositphotos
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13,60% 12,70% 13,30% 34,10% 25,20% 8,90% 8,20% 7,60% 5,40% 4,90% 33,80% 12,00% 11,20%
Source: Strategy Analytics, WSTS, Bosch
Total Sales 2018 2018 $53.9 Bi Billio lion Total Sales 2018 $469 Billion Auto 12.7% (2000, 5.6%)
* incl. MEMS Sensors
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Power Smart Grid Transport & Mobility Smart Home Smart Cities Industry 4.0 IoT Health
Extreme reliability high power density Always connected energy efficiency Edge intelligence Ubiquitous sensing Security Application Requirements Electronic Products Semiconductor Technology and Production CO2 neutral
Sensors System on Chip Power electronics Embedded computing Security modules Materials, Technologies Equipment Production and Supply Chain
Foto: RB
2019-11-19 EFECS 2019 - Jens Fabrowsky, Bosch
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Tools, Lithography, Automation, Manufacturing mixed signal >22nm, Special (MEMS, SiC, Power) SoC, smart power, sensors, security, µC Automotive systems, Medical, Industry Vehicles, Industry, Medical Equipment World Electronic Value Chain in 2018 European strengths (examples) % Europe 10% 9%
2019-11-19
EFECS 2019 - IPCEI on Microelectronics
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Sources: Bosch, depositphotos
Materials Equipment Chips Architecture Systems Applications
Pre-competitive R&D and pilots: ECSEL, Eureka, national
IPCEI: First Industrial Deployment (FID) Objectives
IPCEI 2017 – 2020 (2022)
Design Tools
EFECS 2019 - IPCEI on Microelectronics
2019-11-19 EFECS 2019 - Jens Fabrowsky, Bosch 10 Source: ipcei-me.eu
Measures
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« 5G » 300mm SOI Capacity Extension
2000m² Building Permit obtained August 2019
« Bernin 3 production line »
Creation of a new production line for Piezo On Insulator substrates (RF filters)
« Bernin 2 conversion »
300mm SOI substrates «new generation»
« Substrate Innovation Center »
R&D SOI fabrication line in Leti
New infrastructures in purple Up to 700 new employees in European R&D and Production
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❑RDI and First Industrial Deployment in French ST‘s sites an and lab abs ❑Tec echnology de development an and ne new ci circuits s on
FD-SOI, , em embedded NVM, Ima Imagin ing Se Senso sors, , Power Ga GaN, , etc.
Ne New In Investments su supported by y th the IPC IPCEI in initi itiative in in Fr France an and It Ital aly:
300mm Croll lles Gateway extension and • R3 300mm construction in Agrate and and
❑RDI and First Industrial Deployment in Italian ST‘s sites an and lab abs ❑Tec echnology de development an and ne new ci circuits s on
BCD, MEMS, , Si SiC, , RF RF GaN GaN, Di Digital microprocessors, etc.
EFECS 2019 - IPCEI on Microelectronics
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R&D and First Industrial Deployment Power Start of Pilot Production end of 2021 Up to 500 new employees in European R&D and Production
Differentiating new tech for electric mobility and renewables Opportunity for European Leadership
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next generation High NA EUV Optics
has started
production in Europe since project start
2019-11-19 EFECS 2019 - Jens Fabrowsky, Bosch
EFECS 2019 - IPCEI on Microelectronics
H igh-Tech-S ens
T-S tart-U ps
GloFo, Fraunhofer, NBT launch startup for IoT chips Neues Start-up vermarktet Sensorplattform EU EU unterstütz stützt t Mikroe
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ik mit 1,75 Mrd rd Euro EU erlaub ubt t millionenschw nenschwere re Mikroch chip-För örderun derung U S
hiphers teller G lo balfo undries w ill in D res den kräftig inves tieren
Globalfoundries sees success for its diversification strategy
Aufschwung im Silicon Saxony
2019-11-19 EFECS 2019 - Jens Fabrowsky, Bosch
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https://www.digitimes.com/news/a20191028PD205.html
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achieve societal goals.
Europe needs to continue to act jointly to achieve technological sovereignty, and to keep and strengthen it‘s strategic manufacturing base in microelectronics IPCEI are an important tool to bring technology to the level of First Industrial Deployment and should be continued and further developed.