3G Circular Magnetrons Presenting Gencoas 3 rd generation range of - - PowerPoint PPT Presentation

Gencoa 3G Circular Magnetrons

Presenting Gencoa’s 3rd generation range of circular magnetrons

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• Product Overview
• Introduction
• 3G Design Features
• 3G Mechanical Options
• High Yield Magnetics from 4” target
• High Strength Magnetics
• Low pressure operation
• Deposition Rate
• Performance curves
• Conclusion

Copper target, DC 300W, 8.5 E-3 Torr Copper target, RF 300W, 8.5 E-3 Torr

Contents

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3G

Product Overview

Product Overview

Gencoa 3G Circular Magnetrons – 3rd generation of circular magnetron design

Gencoa’s small sized circular magnetrons for R&D have evolved in 3 stages to the current third generation with more performance in a smaller space

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1996 2010 2017

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• Launched in 2017
• Works in wide range of pressure – into 10-6 Torr range
• Compact Size
• Unique non-bellow tilted magnetron head
• High Yield magnetics for the 4” target size
• Magnetic material sputtering
• Gas Injection as standard
• PEEK insulation to reduce outgassing
• Accommodates different target thickness
• DC, DC pulse, RF and HIPIMS ready

Copper target, RF 300W, 8.5 E-3 Torr

3G cathode features

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Available in 5 different assembly

• ptions
• SW (3G)- Full option with 45⁰ tilt, RF

/HIPIMS ready and gas injection

• SW (3GA)- The cathodes can be supplied

with a simple straight & no gas injection.

• SW (3GB)- The basic design with only gas

injection as option

• SW (3GC)- This model comes with tilt and

gas injection but no power connection box.

• SW (3GE)- Externally mounted magnetron

with gas injection and RF/HIPIMS ready

SW100(3G) SW100(3GE)

3G cathode variations

SW50(3GC) SW50(3GB)

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• Small head size – approx. 1” larger than target size
• Tilt height most compact in industry - tilt pivot point is 1” from cathode

rear allowing higher tilt angles

• 3G means smaller chambers can be used whilst having the same tilt and

head positions

C A B

24.4

Target A B C 2” 92.3 83.8 76.2 3” 97.7 85.7 101.6 4” 114 101.5 128.1

3G small head size and tilt means smaller chambers

3G has innovative head angle adjustment

• ±45° tilt without bellows
• Angle can be viewed and adjusted from the front of the

cathode

• The 2 position clamp pressure is released by means of a

supplied tool or by hand, the head is rotated to the desired angle, then the clamp is re-fixed to the first ‘notch’ tight position

• To measure the angle, there is a milled slot on the

clamp that is aligned with the protractor angle allowing the tilt angle to be fixed accurately to 5°.

• The protractor is removable.

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Knurled Single Ring allows easy tilting Protractor Tilt tightening Tool

Self Adjusting Target Clamps

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• Target clamp adjust to the target thickness. anti-

sticking materials used for the threaded fixing

• Can use a thermal conduction gasket between target

and cooled diaphragm

• High water flow (2l/min) and diaphragm cooling for

high power capacity

• Directly cooled targets available – factory configured

Threaded Target Clamp PEEK Insulator (reduces Outgassing) 4” HY target with graphite gasket and diaphragm Eroded Target Thermal Conduction Sheet (Graphite) Diaphragm Target Removal Tool

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Various mechanical options available

• Design allows to fit manual and pneumatic shutter
• Anode cooling to provide extra source cooling for

HOT chamber environments

• Gas injection
• Sputter Chimney
• Quick coupling feedthrough
• ISO or CF flange mounting option

Shutter (Optional) Power Connector (N type /7-16”/HN) Anode Cooling (Optional) Wall Mount Feedthrough (Optional) Shutter Adjustment Manual/Pneumatic (Shown) (Optional) Gas Injection

3G Extra Options

New shutter design with longer flexible shaft

3G Mechanical Option Matrix

Model Gas Injection Tilt RF/ HIPIMS Shutter Chimney Wall Mount Feedthrough Water Cooled Anode Hidden Anode 3G

• 3G(A)
• 3G(B)
• 3G(C)
• 3G(E)
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• Standard Feature
• Optional
• Not Applicable

Mechanical Options Examples

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4” 3G with Shutter) 3G100 External Anode Cooling 3G 45⁰ Tilted 3G No shaft (customer weld ) Sputter Chimney

3G100 High Yield type magnetics for high target use

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• The 3G100 is available with a high yield HY type array
• >40% target utilization
• Gencoa solution for precious material sputtering

Target profile ,mm

• 60
• 40
• 20

20 40 60

3G100-HY 10mm thick target erosion

Radial Position, mm

9 6 3

Target profile ,mm

Magnetic Material Sputtering (H (High Strength Array) )

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• The cathodes allow magnetic material sputtering as

standard with diaphragm cooled target.

• Thicker target can be sputtered using directly cooled target.

(Pre- configured at factory)

• Anode height adjustable to accommodate different target

thickness.

Size Magnetic Strength on the target surface (G) Fe Thickness (mm) Ni Thickness (mm) 50mm (2”) 780 1 3 75mm (3”) 840 1.5 4 100mm (4”) 620 0.5 2

Anode height line

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• Extensive testing performed on 3G prototypes for product

reliability and plasma stability

• Achieved 2l/min water flow through the cathode at 1.5 bar

pressure difference

• Works in wide range of pressure
• Coating uniformity & deposition rate measured for

different target diameters

• Performance curves obtained at various pressure levels for

various power modes

Copper target, DC 300W, 8.5 E-3 Torr Copper target, RF 300W, 8.5 E-3 Torr

3G cathode testing

80 120 160 200 240 1.00E-05 1.00E-04 1.00E-03 1.00E-02 Target voltage, V Pressure, Torr

3G50-Cu Target

RF 300W RF 180W 300 350 400 450 1.00E-05 1.00E-04 1.00E-03 1.00E-02 Target voltage, V Pressure, Torr

3G50-Cu target

DC 300W DC 180W

10-6 to 10-2 Operating Pressure Range – example of 3G50 (2”)

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300 350 400 450 500 1.00E-05 1.00E-04 1.00E-03 1.00E-02 Target voltage, V Pressure, Torr

3G75 -Al target

DC 600W DC 300W 300 350 400 450 500 1.00E-05 1.00E-04 1.00E-03 1.00E-02 Target voltage, V Pressure, Torr

3G75-Cu target

DC 600W DC 300W

10-6 to 10-2 Operating Pressure Range – example of 3G75 (3”)

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300 350 400 450 500 1.00E-05 1.00E-04 1.00E-03 1.00E-02 Target voltage, V Pressure, Torr

3G100 - Cu target

DC 600W DC 300W 300 350 400 450 500 1.00E-05 1.00E-04 1.00E-03 1.00E-02 Target voltage, V Pressure, Torr

3G100 HS - Cu target

DC 600W DC 300W

10-6 to 10-2 Operating Pressure Range – example of 3G100 (4”)

300 350 400 450 500 550 600 650 1.00E-05 1.00E-04 1.00E-03 1.00E-02 Target voltage, V Pressure, Torr

SW100HY-Cu Target

DC 600W DC 300W

3G100HY operating parameter example

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1 2 3 4 5 200 300 400 500 600 700 400 800 1200 1600 Current, A Voltage, V Power, W

5.0E-4 Torr, DC power Al target

Voltage Current

Coating Uniformity 3G50

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0.2 0.3 0.4 0.5

• 50
• 40
• 30
• 20
• 10

10 20 30 40 50 OD Position, mm

DC Power 150mm T/S, Copper target

Range (mm) Uniformity 50 2.0% 30 0.9% 20 0.4%

Coating Uniformity 3G50

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0.2 0.4 0.6 0.8 1 1.2

• 50
• 40
• 30
• 20
• 10

10 20 30 40 50 OD Position (mm)

Normalised Uniformity over 100mm

50mm T/S 150mm T/S 100mm T/S

Coating uniformity 3G75 DC & RF comparison

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Range, mm DC Uniformity 50 ±4.4% 60 ±6.5% 70 ±8.4% Range, mm RF Uniformity 50 ±3.5% 60 ±5.7% 70 ±7.9%

Al target, DC 300W, 2.5 E-3 Torr Al target, RF 300W, 2.5 E-3 Torr

0.2 0.4 0.6 0.8 1 1.2

• 30
• 20
• 10

10 20 30

3" Al target @100mm T-S

RF DC

Coating Uniformity 3G100 DC & RF Comparison

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Range, mm DC Uniformity 50 ±5.1% 60 ±7.2% 70 ±9.1% Range, mm RF Uniformity 50 ±5.2% 60 ±6.9% 70 ±9.1%

Cu target, DC 300W, 1.4 e-2Torr Cu target, RF 300W, 1.4 e-2Torr

0.2 0.4 0.6 0.8 1 1.2

• 40
• 30
• 20
• 10

10 20 30 40

4" Cu Target @150mm T-S

DC RF

Power Vs Voltage Vs Current (3G50 Cu target, DC power)

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0.2 0.4 0.6 0.8 1

250 300 350 400 450

60 120 180 240 300 Current, A Voltage, V Power, W 5E-4 Torr 0.2 0.4 0.6 0.8 1 250 300 350 400 450 60 120 180 240 300 Current, A Voltage, V Power, W 2.5E-3 Torr 0.2 0.4 0.6 0.8 1

250 300 350 400 450 60 120 180 240 300

Current, A Voltage, V Power, W 1.4E-2 Torr

Voltage Current Voltage Current Voltage Current

Power Vs Voltage (3G50 RF Power)

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50 90 130 170 50 100 150 200 250 300

DC voltage, V Forward power, W

Cu target

5.0E-4 Torr 2.5E-3 Torr 1.4E-2 Torr

250 300 350 400 450 500 550 600 50 100 150 200

DC voltage, V Forward power, W RF power, 2.5E-3 Torr, fused silica target

Power Vs Voltage Vs Current (3G75 Al target, DC power)

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0.4 0.8 1.2 1.6 2 220 270 320 370 420 470 120 240 360 480 600

Current, A Voltage, V Power, W

5.0E-4 T orr,

0.4 0.8 1.2 1.6 2 220 270 320 370 420 470 120 240 360 480 600

Current, A Voltage, V Power, W

2.5E-3 T orr, Voltage Current Voltage Current

0.4 0.8 1.2 1.6 2 220 270 320 370 420 470 120 240 360 480 600

Current, A Voltage, V Power, W 8.5E-3 Torr Voltage Current

0.4 0.8 1.2 1.6 2 220 270 320 370 420 470 120 240 360 480 600

Current, A Voltage, V

Power, W 1.4E-2 Torr

Voltage Current

Power Vs Voltage (3G75, RF power)

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120 160 200 240 280 50 100 150 200 250 300

DC voltage, V

Forward power, W

RF power, Al target

5.0E-4 Torr 2.5E-3 Torr 8.5E-3 Torr 1.4E-2 Torr

Power Vs Voltage Vs Current (3G100 Cu target, DC power)

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0.5 1 1.5 2 2.5 3 250 300 350 400 450 500 550 200 400 600 800 1000 1200 Current, A Voltage, V Power, W 1.4E-2 Torr

Voltage Current

0.5 1 1.5 2 2.5 3 250 300 350 400 450 500 550 200 400 600 800 1000 1200 Current, A Voltage, V Power, W 8.5E-3 Torr

Voltage Current

0.5 1 1.5 2 2.5 3 250 300 350 400 450 500 550 200 400 600 800 1000 1200 Current, A Voltage, V Power, W 2.5E-3 Torr

Voltage Current

0.5 1 1.5 2 2.5 3 250 300 350 400 450 500 550 200 400 600 800 1000 1200 Current, A Voltage, V Power, W 5.0E-4 Torr

Voltage Current

Power Vs Voltage (3G100, RF power)

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50 100 150 200 250 50 100 150 200 250 300 DC voltage, V Forward power, W

RF power, Cu target

5.0E-4 Torr 2.5E-3 Torr 8.5E-3 Torr 1.4E-2 Torr

Gencoa 3G – No.1 choice for R&D Thin Film Technology

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Gencoa 3G Advantages

Competition

Lower Pressure Operation. 3G magnetrons can work down to e-6 Torr range Most small size magnetrons work e-4 Torr range only Small head size allows for smaller chambers or more sources within the same space Larger heads require larger chambers Magnetron head can be tilted 45 ⁰ with ease. No welded bellows and compact tilt height allows sources closer together in a cluster. The angle can be fixed accurately to 1 °. Magnetrons are tilted using welded bellows which requires more chamber space and less accurate. High Yield magnetics for 4” offering >40 % target use and recommended for precious metal sputtering Not Available Gas injection standard for all magnetrons Extra cost DC, RF & HIPIMS compatible as standard Ordered as an option Gencoa developed uniformity software to generate a coating uniformity direct from the magnetic field model and taking into account all system parameters Not available

3G Cu Example Deposition Rates (100mm T-S)

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2” 3 DC 300 134 2” 3 RF 300 94.5 3” 6 DC 300 133 3” 6 RF 300 80 4” 6 DC 300 116 4” 6 RF 300 70

Gencoa cluster solution to R&D Market

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IMC75

• A powerful new tool for

thin film research.

• Fits into the space of a

typical magnetron and has head tilt adjustment.

• Multiple uses - ion

assistance, patterning, pre-cleaning, coating stripping, PECVD

• DC power technology

for low cost of

• wnership.
• Dedicated Power supply

with Gas regulation via automatic feedback control FFE75

• Dynamic plasma

movement for full face erosion

• Clean target for

defect free layers

• High target use for

precious metals

• Better Uniformity
• Ideal for high cost

and compound targets.

• RF, HIPIMS and

DC Option

• Tilt, shutter, Gas

injection available 3G75

• State of the

art design

• Wide rang of
• perating

pressure

• Compact in

size

• Various

mechanical

• ptions

possible.

• RF, HIPIMS

and DC Option

Further information gencoa.com/3g-circular

You might also be interested in our small circular ffe magnetron range and IMC75 circular ion source

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IMC75 R&D Power in one source – substrate pre-cleaning, etch and patterning, ion assistance,

• xidation, Plasma ALD, Plasma

CVD, ion beam sputtering, cluster encapsulation ffe75 ffe75 ffe75 ffe100

Further in information

For further information on the Gencoa range of 3G circular magnetrons, visit www.gencoa.com/3g-circular or email sales@gencoa.com to contact member of the sales team.

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