WP7/8 Middle/Outer Layer Stave: Status Report 16 December 2013 VM
Meetings organization Combined WP7 and WP8 meetings Executive meetings focused on a specific topic plus short updates on other hot items Plan for next meetings o 12/12/201: FPC and PB, chip to FPC connection, demo module o 1 st meeting in 2014: Stave assembly procedure, production of dummy components, FPC layout and production o 2 nd meeting in 2014: Module assembly procedure, demo module o 3 rd meeting in 2014: Demo Module, FPC layout and production Report to the ITS Plenary meeting o Propose and discuss technical options and implementations 2
Layout Power Bus Flexible Printed Circuit 2 x 7 Pixel Chips Module Carbon Plate Cold Plate Half-Stave Left Half-Stave Right Space Frame 3
Material Budget Carbon Structure (9.1%) Water (14.2%) Cooling Pipe Walls and Cold Plate (8.0%) Thanks to Glue (9.5%) Flex Cable (50.1%) Mario Sitta Pixel Chip (9.2%) Mean X/X0 = 0.816% 4
Module and Stave assembly procedures 5
Module Assembly Procedure (1/2) A� B� 6
Module Assembly Procedure (2/2) • FPC extensions for handling and alignment Version 1 Version 2 Version 3 7
Stave Assembly Procedure • Several Options have been considered • Dedicated meeting on December 18 th to define the baseline • Baseline procedure will be presented and discussed in a WP7/8 meeting beginning of next year 8
FPC and PB fabrication and layout 9
Status� of� FPC� development� WP8,� A.� Di� Mauro,� 12/12/13� Increasing� laser� power� 4� 10
FPC fabrication based on laser ablation technologies • MICROLA - Working area: 7cm x 30cm - Samples under production: • FPC-like layout • Snake of differential pairs - Delivery expected: end of the week • LASERPOINT - Working: 6cm x 6cm - Samples under production: • Portion of FPC-like layout • Snake of differential pairs - Delivery expected: end of the week 11
FPC development and prototyping • Cu-version of FPC prototype based on TDR layout under production: - chemical etching - metallized holes (200 μm diameter) and connection pads - delivery expected by the end of the week - no bottom coverlay 12
FPC development and prototyping • Layout optimization - Master chip in the middle to optimize the clock distribution - new layout to be discussed at the next WP7/8 meeting - Urgent to define number, geometry, location and functions of the contact pads CLK� CFG� DATA� MASTER� 13 è
FPC to FPC and FTP to PB interconnectons 14
FPC to FPC and FPC to PB connection (TDR implementation) FPC� to� FPC� – � DATA� – � CLK� -� CFG� è PB� to� FPC� -� power� PB� to� FPC� -� ground� – – 15 è
FPC to FPC and FPC to PB connection FPC to FPC • add extensions to each FPC + laser soldering discarded • short cables or SMD 0402 resistors tin soldering - both FPCs on the same plane - during stave assembly, under measurement machine - direct tin soldering: • small pad size, small distance between pads • feasible only if modules already glued onto cold plate - Test on prototypes: • FPC-like PCB with Cu pads • dummy FPCs in Cu FPC to PB • tin soldering • windows and holes in the PB and FPC layers for soldering 16
Pixel Chip to FPC alternative connection techniques 17
Alternative Pixel Chip to FPC Connections (1/4) Wire Bonding VM – WP8 meeting, 12 December 2013 18
Alternative Pixel Chip to FPC Connections (2/4) SpTab Bonding Window: 500μm x 800μm Strip width: 150 μ m Main advantages of this technique: • ensure robust and stable connection; • no heavy metals (Au, Sn) necessary for laser soldering; • high-precision and automated equipment can be used. � � � � � � � Photoresist� � � � � � � � � � � � � � � Al� FDI-A� � � � � � � � � � � � � � � Pi� � � � � � � � � � Glue� � � � � � � � � � � � � � � Al� FDI-A� � � � � � � � � � � � � � � Pi� � � � � � � � Photoresist� � Pixel� Chip� Window: 200μm x 1500μm Strip width: 100 μ m VM – WP8 meeting, 12 December 2013 19
Alternative Pixel Chip to FPC Connections (3/4) SpTab Bonding � � � � � � � Photoresist� � � � � � � � � � � � � � � Al� FDI-A� � � � � � � � � � � � � � � Pi� � � � � � � � � � Glue� � � � � � � � � � � � � � � Al� FDI-A� � � � � � � � � � � � � � � Pi� � � � � � � � Photoresist� � Pixel� Chip� In Collaboration with FBK/ Micro Technologies Lab and Kirana Dummy� FPC� stack� up Kapton� � 50� µ m Aluminum� 25� µ m VM – WP8 meeting, 12 December 2013 20
• • Alternative Pixel Chip to FPC Connections (4/4) ‐ Laser-soldering: chip pads with stud bonds • Test - il laser solder is possible and yield/quality improves when the chip pads have Au stud bonds try the laser so er to make stu - NIKHEF bonder to make stud bonds on test chip pads - Laser soldering at CERN 21
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