WP7/8 Middle/Outer Layer Stave: Status Report 16 December 2013 VM - - PowerPoint PPT Presentation

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WP7/8 Middle/Outer Layer Stave: Status Report 16 December 2013 VM - - PowerPoint PPT Presentation

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WP7/8 Middle/Outer Layer Stave: Status Report 16 December 2013 VM Meetings organization Combined WP7 and WP8 meetings Executive meetings focused on a specific topic plus short updates on other hot items Plan for next meetings o

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SLIDE 1

WP7/8 Middle/Outer Layer Stave: Status Report

16 December 2013 VM

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SLIDE 2

Meetings organization

  • Combined WP7 and WP8 meetings
  • Executive meetings focused on a specific topic plus short updates on other hot

items

  • Plan for next meetings
  • 12/12/201:

FPC and PB, chip to FPC connection, demo module

  • 1st meeting in 2014: Stave assembly procedure, production of dummy

components, FPC layout and production

  • 2nd meeting in 2014: Module assembly procedure, demo module
  • 3rd meeting in 2014: Demo Module, FPC layout and production
  • Report to the ITS Plenary meeting
  • Propose and discuss technical options and implementations

2

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SLIDE 3

3

Power Bus Flexible Printed Circuit 2 x 7 Pixel Chips Module Carbon Plate Cold Plate Half-Stave Left Half-Stave Right Space Frame

Layout

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SLIDE 4

Carbon Structure (9.1%) Water (14.2%) Cooling Pipe Walls and Cold Plate (8.0%) Glue (9.5%) Flex Cable (50.1%) Pixel Chip (9.2%)

Mean X/X0 = 0.816%

Material Budget

Thanks to Mario Sitta

4

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SLIDE 5

5

Module and Stave assembly procedures

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SLIDE 6

A B

Module Assembly Procedure (1/2)

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SLIDE 7

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Module Assembly Procedure (2/2)

Version 1 Version 2 Version 3

  • FPC extensions for handling and alignment
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SLIDE 8

Stave Assembly Procedure

8

  • Several Options have been considered
  • Dedicated meeting on December 18th to define the baseline
  • Baseline procedure will be presented and discussed in a WP7/8 meeting

beginning of next year

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SLIDE 9

9

FPC and PB fabrication and layout

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SLIDE 10

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Status

  • f

FPC development

WP8, A. Di Mauro, 12/12/13

Increasing laser power

4
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SLIDE 11

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FPC fabrication based on laser ablation technologies

  • MICROLA
  • Working area: 7cm x 30cm
  • Samples under production:
  • FPC-like layout
  • Snake of differential pairs
  • Delivery expected: end of the week
  • LASERPOINT
  • Working: 6cm x 6cm
  • Samples under production:
  • Portion of FPC-like layout
  • Snake of differential pairs
  • Delivery expected: end of the week
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SLIDE 12

12

FPC development and prototyping

  • Cu-version of FPC prototype based on TDR layout under production:
  • chemical etching
  • metallized holes (200 μm diameter) and connection pads
  • delivery expected by the end of the week
  • no bottom coverlay
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SLIDE 13

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FPC development and prototyping

  • Layout optimization
  • Master chip in the middle to optimize the clock distribution
  • new layout to be discussed at the next WP7/8 meeting
  • Urgent to define number, geometry, location and functions of the

contact pads

MASTER CLK

è

CFG DATA

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SLIDE 14

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FPC to FPC and FTP to PB interconnectons

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SLIDE 15

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FPC to FPC – DATA – CLK

  • CFG

è

PB to FPC

  • power

PB to FPC

  • ground

– –

FPC to FPC and FPC to PB connection (TDR implementation)

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SLIDE 16

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FPC to FPC

  • add extensions to each FPC + laser soldering  discarded
  • short cables or SMD 0402 resistors  tin soldering
  • both FPCs on the same plane
  • during stave assembly, under measurement machine
  • direct tin soldering:
  • small pad size, small distance between pads
  • feasible only if modules already glued onto cold plate
  • Test on prototypes:
  • FPC-like PCB with Cu pads
  • dummy FPCs in Cu

FPC to PB

  • tin soldering
  • windows and holes in the PB and FPC layers for soldering

FPC to FPC and FPC to PB connection

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SLIDE 17

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Pixel Chip to FPC alternative connection techniques

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SLIDE 18

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Alternative Pixel Chip to FPC Connections (1/4) Wire Bonding

VM – WP8 meeting, 12 December 2013

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SLIDE 19
  • Photoresist
  • Al
  • Pi
  • Glue
  • Al
  • Pi
  • Photoresist
  • Pixel
Chip FDI-A FDI-A

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SpTab Bonding

Window: 500μm x 800μm Strip width: 150μm Window: 200μm x 1500μm Strip width: 100μm

Main advantages of this technique:

  • ensure robust and stable connection;
  • no heavy metals (Au, Sn) necessary for laser soldering;
  • high-precision and automated equipment can be used.

Alternative Pixel Chip to FPC Connections (2/4)

VM – WP8 meeting, 12 December 2013

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20

SpTab Bonding

  • Photoresist
  • Al
  • Pi
  • Glue
  • Al
  • Pi
  • Photoresist
  • Pixel
Chip FDI-A FDI-A

Dummy FPC stack up

Aluminum 25 µm Kapton

  • 50

µm

In Collaboration with FBK/ Micro Technologies Lab and Kirana

Alternative Pixel Chip to FPC Connections (3/4)

VM – WP8 meeting, 12 December 2013

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SLIDE 21

21

‐

  • er to make stu

try the laser so

Alternative Pixel Chip to FPC Connections (4/4) Laser-soldering: chip pads with stud bonds

  • Test
  • il laser solder is possible and yield/quality improves when the chip

pads have Au stud bonds

  • NIKHEF bonder to make stud bonds on test chip pads
  • Laser soldering at CERN