Thermal & Fluids Analysis Workshop TFAWS 2004 Jet Propulsion - - PowerPoint PPT Presentation

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Thermal & Fluids Analysis Workshop TFAWS 2004 Jet Propulsion - - PowerPoint PPT Presentation

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Thermal & Fluids Analysis Workshop TFAWS 2004 Jet Propulsion Laboratory Pasadena, CA. August 31, 2004 NASA Reentry Material Technology Test and Evaluation Langley 8-ft High Temperature Tunnel Aerothermal Ground Testing Gerald Russell /

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SLIDE 1

Thermal & Fluids Analysis Workshop TFAWS 2004

Jet Propulsion Laboratory Pasadena, CA. August 31, 2004

NASA Reentry Material Technology Test and Evaluation

Langley 8-ft High Temperature Tunnel Aerothermal Ground Testing

Gerald Russell / AMRDEC Joe Raymond & Forrest Strobel/ ITT Jimmy Lee, Susan Spencer, Tony Oneil/NASA MSFC September 2, 2004

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SLIDE 2

Aerothermal Ground Test Objective

2 2

♦Conduct a screening test and evaluation program to identify best candidates for hypersonic/space exploration flight test demonstration ♦Maximize leveraging/collaboration with NASA/DoD programs requiring material aerothermal test data

  • NASA Aerocapture/Hypersonics
  • DARPA/Air Force (FALCON/CAV/RESE, SBIRs)
  • NAVY (HyFLY, SBIRs)
  • Army (Hypersonic Scramjets, Missiles, SBIRs)
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SLIDE 3

Ground Testing Will Evaluate:

3 3

♦ Seal & Attachment Technology ♦ TPS Thermal Performance ♦ Instrumentation ♦ Bondline Performance ♦ TPS Candidate Technologies:

  • Metallics
  • Blankets
  • Tiles
  • Ablative/decomposing

♦ Instrumentation Technologies:

  • Ablation Rate Sensors
  • Heat Flux Gages
  • Embedded Thermocouples
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SLIDE 4

Ground Test Candidate Materials

4 4

TPS Candidate Classification Vendor CRI Blanket/NASA Boeing AETB/TUFI Tile/NASA Ames Research Center 20° ply angle 2D C-C with RTV-12 (new MX-4830) Carbon-Carbon/CAV ATK Thiokol Ceramic Foam CMC Foam/NASA Ames Research Center SC-20 Ablative/NASA Applied Research Associates Hyperlite C Ablative/NASA Applied Research Associates C-SiC CMC/DoD/NASA Physical Sciences Incorporated MSTPS C-C RTV Ablative/DoD/NASA Aerothermo Technologies RX2390 Ablative/DoD Mineral Technologies TMC Metallic/NASA FMW Composites CeramARC Ceramic/NASA/DoD FMW Composites Intergral TPS Ablative/DoD Vanguard Composites 20° ply angle 2D C-C with RTV-12 (FiberCote) Carbon-Carbon/CAV ATK Thiokol 20° ply angle 2D C-C with RTV-12 (Lewcott) Carbon-Carbon/CAV ATK Thiokol Carbon-Carbon Ablative/DoD/NASA Fiber Materials Inc Carbon Carbon-Silicon Carbide Ablative/DoD/NASA Fiber Materials Inc HotBlox Ceramic/NASA/DoD Raytheon/American Technical Coatings Acusil-2 Panel AMRDEC/ITT Molybdenum Plate Calorimeter Plate AMRDEC/ITT TC Plugs/ARADS/Heat Flux Gages Instrumentation Data Possible Aerocapture Interest

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SLIDE 5

Ground Aerothermal Testing

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Ground Aerothermal Testing

Ground Aerothermal Testing

♦ Simulate aerothermal environments of interest

  • Shear
  • Recovery conditions
  • Pressure
  • Test duration (limited compared to

flight test time)

♦ Conduct facility assessment for appropriate test validation ♦ Assess external TPS attachment and seal concept ♦ Collect thermal response data for model validation ♦ Assess flight instrumentation technology

Facility Selection

AEDC H2, or H3 Arc Heater Large Core (50,70 MW) NASA LaRC High Temperature Tunnel (HTT) NASA Ames Arc Facilities

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SLIDE 6

Ground Aerothermal Test Facility Conditions

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5,000 10,000 15,000 20,000 10 10 10 10 10 1 10 10 10 10

  • 5
  • 4
  • 3
  • 2
  • 1

2 3 4

Seconds

Microseconds Milliseconds Seconds Minutes Hours 5 10 15 20 1 2 3 4 6 8 10 Shock Tunnels Operating Limit of Non-Arc Heated Tunnels Hotshots Arc Heated Tunnels Shock Tubes VKI Longshot Gun Tunnels NSWC Hypervelocity Tunnel 9 Ludweig Tubes Blowdown Tunnels Continuous Tunnel Limit ONERA R4CII

Flow Duration Total Enthalpy (1000 Btu/lbm) Equivalent Velocity (1000 ft/sec) Stagnation Temperature, oR

Sleds

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SLIDE 7

ARC Test Facility Condition Envelopes

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300 2 4 6 8 10 12 14 16 18 20 22 24 SIMULATED VELOCITY, KFT/S

AEDC HR AEDC H1 & H3 SHUTTLE ICBM AEDC H2 JSC & AMES ARCS H2 WITH H3 HTR 200 400 600 800 1000 2000 4000 6000 8000 10000

TOTAL ENTHALPY, BTU/LBM

ICBM MAX HEATING

SCIROCCO

De = 76 in.

SCIROCCO

De = 36 in.

LaRC AHSTF

12MW Arc Heater 11”x11” Freejet

SCRAMJET ASCENT

q = 1000 psf

MSHWT

100 200 ALTITUDE KFT

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SLIDE 8

Facility Comparison

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Parameter

Flight AEDC H2 LaRC 8-ft HTT AMES PTF Mach

5 - 10 5.9 - 7.8 7 5.5

Enthalpy (BTU/lbm)

492-1268 1800 – 2500 785 BTU/lbm max (Temp = 3650 R) 2000 - 14000

Heat Flux (BTU/ft2-sec)

15 - 110 50 5.9 – 39.8 0.5 - 75

Edge Pressure (atm)

0.04 - 0.28 0.12 0.025 - 0.129 0.0005 – 0.05

Test Duration

600 seconds Up to 20 minutes 120 seconds 30 minutes

Test Article Size

Reentry Vehicle Up to 24 inch nozzle exit available 8 ft diameter by 12 ft long test section. Full size vehicle can be tested or full scale panel utilizing the HTT panel holder. Test fixture for 14” x 14” flat panels

Comments

Pull out condition is severe High enthalpy

  • facility. Expanding

flow in test section produces non- uniform conditions

  • n test panel

Matches most parameters of interest but is limited in test duration High enthalpy low

  • pressure. Would

not provide a good evaluation of the sealing concepts.

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SLIDE 9

9 9

Langley 8-ft HTT Test Section

12 ft

♦ Mach 7 flow provided at 8-ft diameter

nozzle exit ♦ Test Section is 12-ft long ♦ A 16-ft. I.D. pod intersects the test section from the bottom, containing a model injection system that can insert the model into the flowfield once steady flow has been achieved ♦ Diffuser system for attaining supersonic flow ♦ A 3.5 ft. x 5 ft. panel test fixture is available 8 ft

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SLIDE 10

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Selected Test Conditions: LARC 8-ft HTT Panel Selected Test Conditions: Peak Facility Operating Conditions at Mach 7, 80-100 kft:

  • 2000 psia freestream pressure
  • 3190°F total temperature
  • 120 second total test time at peak
  • Vary Panel Angle from 0-degrees at startup to a 5 or 15 degree

angle of incidence (Low and High Test Conditions) Panel Angle Prescriptions of High and Low Test Conditions

Time (sec) Panel Angle (deg) Pe (atm) HR (BTU/lbm) Time Panel Angle (deg) Pe (atm) HR (BTU/lbm) 0.025 786 0.025 786 5 0.025 786 5 0.025 786 5 15 0.129 773 5 5 0.037 777 120 15 0.129 773 120 5 0.037 777

High Prescription Low Prescription

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SLIDE 11

11 11

Coldwall Heat Flux and Shear versus Panel Angle for Selected LARC Test Conditions

1 2 3 4 5 6 7 8 9 10 5 15

Panel Angle (degrees) Shear (lbf/ft2)

Shear

10 20 30 40 50 5 15

Panel Angle (degrees) Coldwall Heat Flux (BTU/ft2-sec)

Coldwall Heat Flux

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SLIDE 12

12 12

Predicted Surface Temperatures for 2-inch thick Silica Phenolic for Selected LaRC Test Conditions

500 1000 1500 2000 2500 3000 3500 4000 4500 5000 20 40 60 80 100 120 Time (sec) Surface Temperature (F)

  • 30
  • 25
  • 20
  • 15
  • 10
  • 5

5 10 15 20 Prescribed Panel Angle (deg)

High Prescription Surface Temperature Low Prescription Surface Temperature High Prescription Panel Angle Low Prescription Panel Angle

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SLIDE 13

Test Panel Configuration

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♦ Three Panels will be tested simultaneously ♦ Silica phenolic holders:

  • Constructed of separate panels of

silica phenolic that are attached with mortis and tenon joints and bonded

  • 90 degree lay-up relative to heated

surface

3.5 x 5 ft. test fixture

TPS experiment panels

LaRC HTT Test Fixture

Interface Design

Silica phenolic holder

Rear Panel will be interchangeable with a CRI interface panel

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SLIDE 14

Test Fixture Design Verification

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500 1000 1500 2000 2500 3000 100 200 300 400 500 600 700 800

Time (sec) Temperature (deg-F)

Surface, 20-deg layup angle 0.10-in Depth, 20-deg layup angle 0.25-in Depth, 20-deg layup angle 0.50-in Depth, 20-deg layup angle 1.0-in Depth, 20-deg layup angle 1.5-in Depth, 20-deg layup angle 2.0-in Depth, 20-deg layup angle Surface, 90-deg layup angle 0.10-in Depth, 90-deg layup angle 0.25-in Depth, 90-deg layup angle 0.50-in Depth, 90-deg layup angle 1.0-in Depth, 90-deg layup angle 1.5-in Depth, 90-deg layup angle 2.0-in Depth, 90-deg layup angle

Thermostructural Analysis

  • Decomposition
  • Thermal Expansion

Expansion Region Expansion Region

Test Fixture Modal Analysis

  • Modes 1-6
  • Initial Natural Frequency = 70 Hz
  • Redesigned to 130 Hz

Robust Thermostructural Design

0.01 0.02 0.03 0.04 0.05 0.06 0.07 20 40 60 80 100 120 140

  • Max. Displacement (in)

Dmax, test 90 deg Dmax, test 20 deg

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SLIDE 15

15 15

HTT Test Hardware Configuration with CRI Interface Installed

PANEL HOLDER STRUCTURE (FURNISHED BY LANGLEY) FRAME PS-WF-010784 .25” AL PLATE AND INSULATING TILES (FURNISHED BY LANGLEY) CRI HOLDER PS-WF-010842 CRI GASKET PS-WF-010843 CRI BLANKET (FURNISHED BY MSFC) NEXTEL ROPE SEALS (FURNISHED BY LANGLEY) CRI INTERFACE PLATE PS-WF-010841 INSULATING TILES (FURNISHED BY LANGLEY) TPS INTERFACE PLATE PS-WF-010782 TPS HOLDER GASKET PS-WF-010785 TPS HOLDER ASSEMBLY PS-WF-010699 INSULATING TILES (FURNISHED BY LANGLEY)

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SLIDE 16

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Interface Hardware / TPS Experiments

  • All vendors have received Silica

Phenolic panel holders

  • TPS Samples should begin arriving

at ITT in August.

  • 1 NASA Ames Sample has been

received

  • Fabrication of all interface hardware

is complete except for CRI blanket interface

  • Design of CRI interface is complete,

fabrication by Millennium Machine is in-process 23.5 21.9

Fit Checking of TPS Holder and Interface Hardware CRI Blanket

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SLIDE 17

Calorimeter Design

17 17

500 1000 1500 2000 2500 50 100 150 200 250 300 350 400 450

Time (sec) Temperature (oF)

3D 1D

♦ A thin skin calorimeter design has been developed for flight ♦ Candidate materials included 17- 4PH steel, molybdenum, and

  • xygen free high conductivity

(OFHC) copper ♦ Trade-off studies conducted to select material and thickness ♦ Thin skin criteria (ht/k < 0.1) applied in evaluating the materials ♦ 17-4PH experienced excessive temperatures ♦ OHFC copper needed to be excessive thick (2 inch) to remain at acceptable temperatures ♦ Molybdenum, with a 0.25 inch thickness was selected for the design

  • Temperature < 1800 ºF
  • Low thermal expansion

Expansion Gaps Fiberfrax porivdes seal between Silica Phenolic and Molybdenum Fasteners secure Molybdenum to Silica phenolic (Fastened at both ends) Expansion Gaps Fiberfrax porivdes seal between Silica Phenolic and Molybdenum Fasteners secure Molybdenum to Silica phenolic (Fastened at both ends) Pinned joint for thermal expansion Expansion Gaps Fiberfrax porivdes seal between Silica Phenolic and Molybdenum Fasteners secure Molybdenum to Silica phenolic (Fastened at both ends) Expansion Gaps Fiberfrax porivdes seal between Silica Phenolic and Molybdenum Fasteners secure Molybdenum to Silica phenolic (Fastened at both ends) Pinned joint for thermal expansion

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SLIDE 18

Calorimeter Plate Instrumentation

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♦ Calorimeter will be evaluated in HTT test and used to measure the facility heat flux ♦ Instrumentation includes 8 thermocouples and 2 pressure transducers ♦ Thermocouples used for redundancy and to quantify three dimensional conduction effects

x x x x x x x

Thermocouple locations Pressure ports

x x x x x x x

Thermocouple locations Pressure ports

X

Pressure Transducers

Molybdenum thin skin calorimeter

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SLIDE 19

Instrumentation Technology Panel

19 19

SIPH Holder Assembly SIPH Test Plate 20 Degree Ply Astrometrics’ Delta-T Sensor Delta-M’s Thermocouple Plug 3 Element Astrometrics’ Quartz ARAD Sensor Astrometrics’ Thermocouple Plug 4 Element Astrometrics’ Carbon Phenolic ARAD Sensor Flow

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SLIDE 20

20 20

MULTI-ELEMENT SIP QUAD EMBEDDED PLUG THERMOCOUPLE HAS TPS PLIES IN THE REQUIRED ORIENTATION FOR TESTING

Instrumentation Test Hardware

Astrometrics Carbon Phenolic ARAD Sensor Astrometrics Silica Phenolic Thermocouple Plug

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SLIDE 21

Ground Test Candidate Instrumentation/Database

21 21

Sublayers/Insulation Attachment Hardware TPS M aterial Experiment TPS Holder Sublayers/Insulation Attachment Hardware TPS M aterial Experiment TPS Holder

  • Vendors will instrument samples to obtain in depth

thermal response

  • Vendors will provide thermophysical properties
  • Measured data and thermophysical properties will

assembled in report and database for future material design model development if desired

  • Decomposition Kinetics
  • Density
  • Thermal Conductivity
  • Specific Heat
  • Dimensions (TC locations, Layers)
  • Emissivity

Embedded Thermocouples

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SLIDE 22

Preliminary Test Matrix

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Test Day Test Condition TPS Candidate Vendor TPS Candidate Vendor TPS Candidate Vendor 1 Calorimeter Plate Prescription, 10 seconds at 0, 5, 10, and 15-deg Calorimeter Plate AMRDEC/ITT Calorimeter Plate AMRDEC/ITT Calorimeter Plate AMRDEC/ITT 2 High AETB/TUFI Ames Research Center Ceramic Foam Ames Research Center Calorimeter Plate AMRDEC/ITT 3 High PhenCarb-20 Applied Research Associates SRAM-20 Applied Research Associates SRAM-17 Applied Research Associates 4 High C-SiC Physical Sciences Incorporated 3D C/C-SiC with a SiC- Rich Seal Coat Fiber Materials Inc 2D C/C-SiC with a SiC- Rich Seal Coat Fiber Materials Inc 5 High MSTPS C-C RTV Aerothermo Technologies Regular HotBlox Raytheon/America n Technical Coatings HotBlox Light Raytheon/America n Technical Coatings 6 High

20-deg play angle staple PAN-based 2D C-C with RTV-12 (new MX-4830)

ATK Thiokol 20-deg play angle staple PAN-based 2D C-C with RTV-12 (FiberCote) ATK Thiokol 20-deg play angle Needled PBCF-based 2D C-C with RTV-12 (Lewcott) ATK Thiokol 7 High Calorimeter Plate AMRDEC/ITT Silica Phenolic Instrumentation Technology Panel AMRDEC/ITT CeramARC FMW Composites 8 Low RX2390 (1) Mineral Technologies / NAWC RX2390 (2) Mineral Technologies / NAWC Acusil 2 AMRDEC/ITT 9 Low TMC FMW Composites Intergral TPS Vanguard Composites Calorimeter Plate AMRDEC/ITT 10 Low - CRI Panel aft of TPS Experiment positions Calorimeter Plate AMRDEC/ITT Calorimeter Plate AMRDEC/ITT Calorimeter Plate AMRDEC/ITT Position 3 Position 1 Position 2 Test/Conditions

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SLIDE 23

Summary

23 23

♦ Ground aerothermal test and evaluation planned for October 2004

  • Langley Research Center High Temperature Tunnel (HTT)
  • Variety of candidate material technologies considered to include

projected reusable technology such as blankets, tiles, and metallics as well as a significant number of ablative material technologies supporting NASA and DoD

  • Instrumentation candidate technology test and evaluation