Thermal Conductive Polymers Thermal Conductive Polymers gen-Nuernb - - PowerPoint PPT Presentation

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Thermal Conductive Polymers Thermal Conductive Polymers gen-Nuernb - - PowerPoint PPT Presentation

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INSTITUTE OF POLYMER TECHNOLOGY Prof. Dr.-Ing. Dietmar Drummer berg Thermal Conductive Polymers Thermal Conductive Polymers gen-Nuernb and their Benefit for MID ersity Erlan 9 th International Congress Molded Interconnect Devices, Fuerth,

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SLIDE 1

INSTITUTE OF POLYMER TECHNOLOGY

  • Prof. Dr.-Ing. Dietmar Drummer

berg

Thermal Conductive Polymers

gen-Nuernb

Thermal Conductive Polymers and their Benefit for MID

ersity Erlan

9th International Congress Molded Interconnect Devices, Fuerth, 29./30.09.2010

  • gy – Unive

Dipl.-Wirtsch.-Ing. Florian Ranft Dipl -Ing Christoph Heinle

mer Technolo

Dipl.-Ing. Christoph Heinle

  • Prof. Dr.-Ing. Dietmar Drummer

Dipl.-Ing. Johannes Hoerber, Institute FAPS

  • Prof. Dr.-Ing. Joerg Franke, Institute FAPS
  • Prof. Dr.-Ing. XYZ

te of Polym

Institute of Polymer Technology University Erlangen-Nuernberg A W i h l 9

  • Prof. Dr. Ing. Joerg Franke, Institute FAPS

Institu

Am Weichselgarten 9 91058 Erlangen Germany

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SLIDE 2

Outline

berg

  • Motivation

gen-Nuernb

  • Thermal Conductive Polymers (TCP)

ersity Erlan

  • Investigation and Material Properties
  • Results
  • gy – Unive

TCP and Solderability TCP d A li ti R li bilit

mer Technolo

TCP and Application Reliability TCP and Thermal Management

te of Polym

  • Summary

Institu

2

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SLIDE 3

Motivation

berg

Manufacturing New Fields of Application

i j ti ldi gen-Nuernb

mechanical requirements thermal requirements

injection molding automotive / medical high reliability and harsh environmental conditions ersity Erlan

electrical requirements

metallization

source: lanxess/Harting Mitronics

  • gy – Unive

physical requirements chemical requirements

power electronics / lighting technologies mer Technolo

geometrical requirements environmental sustainability

soldering adapted thermal management te of Polym

environmental sustainability

source: FAPS/TECHNOMID

Institu

3

suitable substrate materials satisfying a wide range of technical requirements are necassary for spreading the MID-technology

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SLIDE 4

Motivation

berg

Thermal load on substrate material

gen-Nuernb

reflow soldering Chemical aging

requried temperature profiles for reflow soldering:

ersity Erlan

Chemical aging degradation of molecular chains

  • gy – Unive

cross-linking …

mer Technolo

Physical aging post-cristallization l ti Dimensional stability under heat warpage and distortion

te of Polym

relaxation … partial melting at edges etc. …

Institu

malfunction of MID because of thermal loads during manufacturing and application

4

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SLIDE 5

Thermal Conductive Polymers (TCP)

berg

Thermal Conductive Polymers for:

gen-Nuernb

Effects:

dimensional accuracy

ersity Erlan

improving mechanical stability homogeneous temperature dimensional accuracy dimensional stability

  • gy – Unive

homogeneous temperature distribution low thermal expansion reduction of Hot-Spots

mer Technolo

heating and cooling of electronic components

te of Polym

Potentials from the view of manufacturing and economics:

enhanced spectrum of materials integration of additional f t

Institu

enlargement of the process latitude features

5

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SLIDE 6

Thermal Conductive Polymers (TCP)

berg

Combining advantages of Filler performance

gen-Nuernb

materials and processes

increasing electrical and thermal conductivity

ersity Erlan

attainment of magnetical function changing mechanical properties

Fillers Thermoplastic matrices Powder

  • gy – Unive

g g p p

Powder Fibers Flakes

...

Injection Molding

mer Technolo Functionalized compounds Additives Stabilizers Antioxidants Sli dditi te of Polym Slip additives

...

Institu

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polymer preparation with different filler systems enables innovative substrate materials for MID with additional functions

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SLIDE 7

Thermal Conductive Polymers (TCP)

berg

Suppliers:

gen-Nuernb graphite- copper- compounds

Albis Plastic GmbH Polyone Lehmann & Voss & Co

ersity Erlan graphite compounds

Lehmann & Voss & Co. Cool Polymers Inc. RTP Company Lati Industria Thermoplastici

k

  • gy – Unive

Lati Industria Thermoplastici …

Polymers:

mer Technolo aluminum- compounds ceramic - compounds

y

PA6, PA66, PBT, PPS…

te of Polym compounds Institu

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functionalized compounds with thermal conductivities up to 20 Wm-1K-1 based on various basic polymers are available

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SLIDE 8

Investigation

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thermal conductivity heat capacity filler shape filler size

gen-Nuernb

Material

thermal expansion … filler fraction …

ersity Erlan polymer + thermal conductive filler

  • gy – Unive

mechanical behaviour thermal management mer Technolo

^^^^^^^^^^^^^^^^

thermophysical and –mechanical properties te of Polym

Process Construction

component size

  • rientation filler

Institu

8

p ribs and beadings … cooling conditions …

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SLIDE 9

Investigation

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Test Specimens Molded Interconnect Devices

gen-Nuernb

Devices

heat sink plate

ersity Erlan

  • gy – Unive

base: 80 x 60 x 2 mm3 ribs (height): 25 mm 50 x 55 x 2 mm3 mer Technolo

Thermal Conductive Polymers

te of Polym

matrix: polyamide 66 (Durethan A30S) filler: aluminum oxide Al2O3 (Alcoa CL 3000FG)

Institu

9

20 μm

k = 0,2 – 0,4 Wm-1K-1 k = 20 – 40 Wm-1K-1

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SLIDE 10

Thermal behavior – Conductivity

berg gen-Nuernb ersity Erlan

  • gy – Unive

mer Technolo

neat PA66

te of Polym Institu

10

addition of 50 vol.-% aluminum oxide increases the thermal conductivity

  • approx. from 0,3 to 2,0 Wm-1K-1 at room temperature (T = 23 °C)
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SLIDE 11

Mechanical behavior – Stiffness

berg gen-Nuernb ersity Erlan

  • gy – Unive

mer Technolo te of Polym Institu

11

particle modification in high concentrations as a method for increasing the stiffness of MID substrate materials

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SLIDE 12

Rheological behavior – Flowability

berg plate/plate - rheometer gen-Nuernb ersity Erlan

  • gy – Unive

mer Technolo v v te of Polym Institu

12

increasing viscosity and suppressed melt flow in consequence of growing filler content

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SLIDE 13

Thermomechanical behavior – Thermal expansion

berg 1st heating gen-Nuernb

0-6/°C]

ersity Erlan

nsion α [1

  • gy – Unive

rmal expan

mer Technolo

ther

te of Polym

filler fraction Φ [vol.-%]

Institu

13

considerable decline of thermal expansion below and above glass transition temperature with increasing filler content

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SLIDE 14

TCP and Solderability

berg

soldering method: forced convection solder alloy: SnAgCu (lead free)

gen-Nuernb 235°C 40°C 240°C 250°C 235°C 250°C 290°C 280°C 70°C PA66 + 50 vol.-% Al2O3

solder alloy: SnAgCu (lead free)

ersity Erlan 210°C 40°C 215°C 225°C 210°C 225°C 290°C 265°C 70°C neat PA66

consistent T

  • gy – Unive

T

activation = 170°C

Tli

id

= 217°C

T

surface

mer Technolo Tliquidus 217 C Tmaximum = 240°C te of Polym 210°C 40°C 215°C 225°C 210°C 225°C 290°C 265°C 70°C 235°C 40°C 240°C 250°C 235°C 250°C 290°C 280°C 70°C PA66 + 50 vol.-% Al2O3 neat PA66 Institu

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adapted temperature settings of the reflow oven to comply with the required processing guidelines due to the specific material properties of the substrate

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SLIDE 15

Results – Solderability

berg gen-Nuernb ersity Erlan

  • gy – Unive

mer Technolo te of Polym Institu

15

homogeneous component heating and evenly distributed solder joints quality at all levels due to high heat flux

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SLIDE 16

Results – Solderability

berg 50 gen-Nuernb 55 p1 p2 p3 ersity Erlan

  • gy – Unive

mer Technolo te of Polym Institu

16

higher stiffness combined with a uniform lower shrinkage cause reduced warpage after forced convection soldering

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SLIDE 17

TCP and Application Reliability

berg

stamping die with hot-embossed

gen-Nuernb

0 5 1 2 3

conductor layout plate specimens

ersity Erlan

0,5 3

  • gy – Unive

55

50 60

mer Technolo

50

43

te of Polym

  • ptimized peel strength (> 1 N/mm)

Institu

17

MID metallization with adhesive free stamping foils (CuSn/Bo) with a thick- ness of 35 µm via hot-embossing (T

s = 255 °C / ts = 2,5 s / Ps = 120 MPa)

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SLIDE 18

TCP and Application Reliability

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temperature shock

gen-Nuernb

th = 15 min

temperature shock test chamber

ersity Erlan

  • gy – Unive

mer Technolo te of Polym Institu

18

MID application reliability under enhanced thermal conditions verified by thermal shock testing (1.000 cycles each -40°C/+125°C)

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SLIDE 19

Results – Application Reliability

berg gen-Nuernb

highly filled PA66 - no detectable defects

ersity Erlan

no detectable defects

  • gy – Unive

mer Technolo te of Polym Institu

19

cracks in hot-embossed copper metallization as failure mechanism at neat PA66 after thermal cycling due to high thermomechnical stress

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SLIDE 20

TCP and Thermal Management

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assembly & i t ti 3D-MID: an innovative heat sink concept

gen-Nuernb

metallization & structuring interconnection heat sink concept

ersity Erlan

structuring circuit carrier production

  • gy – Unive

placement and

mer Technolo

hot embossing placement and reflow soldering

te of Polym

injection molding

Institu

20

thermal management of electronic components via heat dissipation by introducing TCP as innovative MID substrate materials

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SLIDE 21

TCP and Thermal Management

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front side

  • 1)

front side K-1)

gen-Nuernb

5 Wm-1K- 32 Wm-1

ersity Erlan

(λ ≈ 0,35 er (λ ≈ 2,

  • gy – Unive

back side ss fibers back side ctive fille

mer Technolo

66 + glas + condu

te of Polym

PA6 PA66

Institu

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3D specimen featuring surface area for circuitry (front side) and integrated cooling ribs for convective heat transfer (back side)

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SLIDE 22

TCP and Thermal Management

berg

3 S l P4 LED Th l I i

front side gen-Nuernb

3 Seoul P4-LEDs:

12 V power supply (500 mA)

Thermal Imaging

front side ersity Erlan

3 x 1,12 W

  • gy – Unive

mer Technolo te of Polym back side Institu

22

IR temperature measurement on front and back side of a MID mounted with three high power LEDs as function of thermal conductivity

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SLIDE 23

Results – Thermal Management

berg

standard conductive

T = 165 °C T = 89 °C

gen-Nuernb front side

Tmax = 165 C Tmax = 89 C

ersity Erlan

  • gy – Unive

∆T ≈ 70 °C

mer Technolo back side

∆T ≈ 70 C (steady state)

te of Polym Institu

23

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SLIDE 24

Summary

berg

  • polymer modification with high contents of thermal conductive fillers changes

gen-Nuernb

polymer modification with high contents of thermal conductive fillers changes the thermomechanical and thermophysical material properties

  • TCP enhance the dimensional stability during reflow soldering and reduce

ersity Erlan

  • TCP enhance the dimensional stability during reflow soldering and reduce

solder joints failures due to an homogeneous heating of the MID

  • gy – Unive
  • TCP with extremly reduced coefficients of thermal expansion offer great

potential to improve the long term reliability of hot-embossed modules

mer Technolo

  • TCP open new possibilities to introduce additional functions in technical

applications for cooling and heating electronic components

te of Polym

  • TCP are an innovative approach to extend the spectrum of substrate

materials for Molded Interconnect Devices

Institu

24

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SLIDE 25

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Th k f i !

gen-Nuernb

Thank you for attention!

ersity Erlan

  • gy – Unive

Thanks to:

mer Technolo

Federal Ministry of Economics and Technology (BMWi) for financial support within the AiF-project 15583

te of Polym

RF-Plast GmbH, Evonik Degussa GmbH, Bolta Werke GmbH, LANXESS Deutschland GmbH, KEW GmbH for suppling sample materials and technical equipment

Institu

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