The PIC-based neutron imaging detector ( NID) for energy-resolved - - PowerPoint PPT Presentation

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The PIC-based neutron imaging detector ( NID) for energy-resolved - - PowerPoint PPT Presentation

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The PIC-based neutron imaging detector ( NID) for energy-resolved neutron imaging at J-PARC Joe Parker CROSS 15 MPGD @ 14 December 2018 15 MPGD 14 Dec 2018 J. Parker RADEN

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SLIDE 1

The µPIC-based neutron imaging detector (µNID) for energy-resolved neutron imaging at J-PARC

Joe Parker CROSS

15MPGD @14 December 2018

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SLIDE 2

RADEN and µNID development members

JAEA/J-PARC Center Takenao Shinohara Tetsuya Kai Kenichi Oikawa (BL10) Masahide Harada (BL10) Takeshi Nakatani Mariko Sagawa Kosuke Hiroi Yuhua Su CROSS Joe Parker (µNID Lead Developer) Hirotoshi Hayashida Yoshihiro Matsumoto Nagoya University Yoshiaki Kiyanagi Kyoto University Toru Tanimori Atsushi Takada

(µNID development)

Taito Takemura Tomoyuki Taniguchi Ken Onozaka Mitsuru Abe

15MPGD14 Dec 2018J. Parker

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SLIDE 3

Outline

  • (Brief) Intro to energyresolved neutron imaging
  • Current status of the µNID at RADEN
  • Ongoing development
  • 215µm pitch MEMS µPIC
  • µNID with boron converter

15MPGD14 Dec 2018J. Parker

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SLIDE 4

Energy-resolved neutron imaging at RADEN

  • Energy-dependence

quantitative information on macroscopic distribution of microscopic quantities

  • Pulsed neutrons wide

energy range, accurate energy determination by time-of-flight

  • Use time-resolved imaging

detectors at RADEN:

  • Sub-mm spatial resolution
  • Sub-µs time resolution
  • Mcps count rate
  • Strong background rejection

Energy-dependent neutron transmission

Energy

meV 1 keV

Wavelength

10 10-2 Resonance absorption Bragg-edge, Magnetic imaging 15MPGD14 Dec 2018J. Parker

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SLIDE 5

µPIC-based Neutron Imaging Detector (µNID)

15MPGD14 Dec 2018J. Parker

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SLIDE 6
  • Gaseous time-projectionchamber
  • CF4-iC4H10-3He (45:5:50) at 2 atm
  • µPIC micropattern readout
  • Compact ASIC+FPGA data

encoder front-end

  • 3-dimensional tracking of decay

pattern + time-over-threshold

  • Accurate position reconstruction
  • Strong gamma rejection

400 μm 50 μm

Cathode Anode

100 μm 400 μm

33 cm

E

µPIC-based neutron imaging detector (µNID)

X (strips)

10 20 30 40 50 60

Time-above-threshold (clocks)

5 10 15 20 25 30

Energy Deposition

TOT for proton-triton track Proton Triton Neutron

Digital encoder with time-over-threshold (TOT)

Threshold

µPIC

Discriminator

Time-over-threshold (∝ energy dep.)

Neutron detection via n + 3He p + t

Overall track length ~mm in gas

µPIC readout

10 cm x 10 cm area, 400 µm pitch x,y strips Polyimide substrate 15MPGD14 Dec 2018J. Parker 2.5 cm

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SLIDE 7
  • FPGA-based encoders for

high-speed data acquisition

  • Data transfer via Gigabit

Ethernet with SiTCP

  • FPGA-based system

controller

Encoders DAQ PC

SiTCP

Encoders

µPIC

Control box

DAQ controller System monitor DC power External timing signals Vessel pressure Ethernet GbE × 4

±2.5V, +3.3V

Ambient temperature Network DAQ control Monitoring Power Sensor power

µPIC-based neutron imaging detector (µNID)

15MPGD14 Dec 2018J. Parker

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SLIDE 8

µNID performance and usage at RADEN

Distance from interaction point (mm)

  • 2

4 8

Time-over-threshold (ns)

50 100 150 200 250 6 2

Template for fit Proton Triton

Base performance characteristics Active area 10 x 10 cm2 Spatial resolution 0.1 mm Time resolution 0.25 µs

  • sensitivity

< 10-12 Efficiency @25.3meV 26% Count rate capacity 8 Mcps Effective max count rate > 1 Mcps

Fine spatial resolution using template fit to TOT distribution

Bin size: 40 x 40 µm2

8 cm

Image of Gd test target

Detector usage at RADEN (2018A) µNID 34 days CCD camera 20 days Other counting-type 36 days

µNID used primarily for Bragg-edge, magnetic imaging, and phase imaging measurements at RADEN

15MPGD14 Dec 2018J. Parker

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SLIDE 9

µNID control software/analysis GUI

  • New DAQ controller

hardware and detector control software

  • Based on DAQ

middleware

  • Full integration into beam

line control system

  • In use since March 2018
  • New browser-based UI for
  • ffline analysis
  • First update with simplified

interface, better data visualization, etc.

  • In use since April 2018

µNID analysis GUI Software frameworks at the MLF

IROHA2 – Experimental device control system with web-based UI (MLF) DAQ Middleware – Detector control and data collection (KEK)

15MPGD14 Dec 2018J. Parker

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SLIDE 10

Automated measurements

  • Increased rate and integrated

control

  • Perform complex

measurements more easily

  • Computed tomography with

TOF

  • Quantify effects of scattering,

beam hardening, etc.

  • Combine with energy-

resolved imaging techniques

  • Dynamic samples
  • Fold TOF info with motion/

process frequency

  • Currently limited to cyclical

processes

P/P0

4 cm 4 cm

  • K. Hiroi et al., J. Phys.: Conf. Series 862 (2017) 012008

5 cm

Computed tomography

Fe step wedge Polarization image

Magnetic imaging of running motor

Model electric motor (provided by Hitachi) 2°/step 91 images

15MPGD14 Dec 2018J. Parker

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SLIDE 11

Ongoing development

  • 215µm pitch MEMS µPIC for improved spatial

resolution

  • µNID with boron converter for increased rate

performance

15MPGD14 Dec 2018J. Parker

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SLIDE 12

0.1 1 10 100 0.01 0.1 1 10

Count rate (Mcps) Spatial resolution (mm) µNID GEM LiTA12

Current and projected performance of event-type imaging detectors at RADEN

µNID

(Optimum rate performance)

Boron-µNID

µNID

(MEMS) 15MPGD14 Dec 2018J. Parker

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SLIDE 13

Small-pitch MEMS µPIC

15MPGD14 Dec 2018J. Parker

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SLIDE 14

55 mm

Small-pitch MEMS µPIC

  • Improve spatial resolution

with reduced strip pitch

  • Develop small-pitch µPIC
  • Manufacture using MEMS
  • n silicon substrate (by

DaiNippon Printing Company, Ltd.) Thru- silicon-via (TSV) µPIC

  • Successfully produced 215

µm pitch µPIC (down from 400 µm)

  • Small (14 x 14 mm2) and

larger area TSV µPICs (55 x 55 mm2) tested at RADEN

100µm

400µm

Cu 10~15µm 4~11µm 15µm

Current PCB µPIC (400 µm pitch) TSV µPIC

215 µm Surface of TSV µPIC (digital microscope)

215µm TSV µPIC

15MPGD14 Dec 2018J. Parker

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SLIDE 15

First test of TSV µPIC at RADEN (MPGD2016)

280µm pitch (192×192 strips) 215µm pitch (64×64 strips)

Time (ms)

5 10 15 20 25 30 35 40

s µ Counts/pulse/25

0.02 0.04 0.06 0.08 0.1 0.12

Neutron TOF (MEMS uPIC test)

TSV µPIC test board

Neutron TOF on 215µm section

  • No signal measured on 280µm

section (gain too low)

  • Signal confirmed on 215µm section
  • Observed gain instability

Gas filling used for test: P10:CF4:He (60:30:10) @2 atm

15MPGD14 Dec 2018J. Parker

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SLIDE 16

Gain instability under irradiation (MPGD2017)

9.5 10.0 10.5 11.0 11.5 12.0 0:00 1:00 2:00 3:00 4:00 5:00

Average TOT (clocks) Elapsed time (min)

Grounded Floating

  • TSV µPIC gain observed to

increase with neutron exposure even for 15µm SiO2 layer

  • Tried grounding Si substrate

400µm

Cu

10µm 4µm 15µm

Grounding substrate appears to stabilize gain Necessary anode HV was also reduced 590V 410V

215µm pitch (64×64 strips)

GND

Mean TOT vs Time

15MPGD14 Dec 2018J. Parker

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SLIDE 17

Large-area TSV µPIC test at RADEN

  • Imaging confirmed but spatial

resolution not improved as expected (slightly worse than PCB µPIC)

  • Gain instability under neutron

exposure improved by grounding substrate but not eliminated

Image taken with 215µm pitch TSV µPIC at BL22

55 mm § Gain stability: new MEMS µPIC with glass substrate (TGV µPIC) § Spatial resolution: optimize gas for shorter tracks?

11 12 13 14 15 0:00 2:00 4:00 6:00 8:00 10:00 12:00 14:00

Mean TOT Time (hours) TSV185 (4/1) TSV165 (5/22)

500V 510V 460V Odd behavior near end Large current (>1 µA)

  • n all strips

Mean TOT vs Time

15MPGD14 Dec 2018J. Parker

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SLIDE 18

12 14 16 18 20 22 24 0:00 2:00 4:00 6:00

Mean TOT Time (hours) µPIC gain stability at RADEN

MEMS µPIC with glass substrate (12/10)

PCB Silicon Glass Image from digital microscope

  • Initial testing performed at Kyoto U.

(Abe-san’s talk)

  • Gain stability measured at RADEN

– Improved over silicon substrate – Slightly worse than PCB µPIC

TGV µPIC test board Strip pitch: 215 µm Area: 27.5 x 27.5 mm2

P R E L I M I N A R Y

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SLIDE 19

Imaging with the 215µm MEMS µPICs

400µm PCB µPIC 215µm TGV µPIC

40µm bins 21.5µm bins 21.5µm bins

215µm TSV µPIC Note: measurement statistics are different for each image

l Image quality with TGV µPIC looks good l Resolution may be slightly improved

compared to PCB µPIC

P R E L I M I N A R Y

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SLIDE 20

Imaging with the 215µm MEMS µPICs

400µm PCB µPIC 215µm TGV µPIC

l Image quality with TGV µPIC looks good l Resolution may be slightly improved

compared to PCB µPIC

40µm bins 21.5µm bins 21.5µm bins

215µm TSV µPIC Note: measurement statistics are different for each image

P R E L I M I N A R Y

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SLIDE 21

µNID with boron converter

15MPGD14 Dec 2018J. Parker

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SLIDE 22

µNID with boron converter (B-µNID)

~5 mm Al drift cathode (t=1mm) µPIC readout

10B coating (t=1.2µm)

  • Increase count rate capacity

by reducing event size

  • 10B (,Li) for 3x smaller

event size than 3He (p,t)

  • Trade-off in spatial

resolution

  • µNID with flat boron converter

(for initial testing)

  • Thin, 1.2µm 10B layer low

efficiency (3~5%)

  • Need to consider ways to

improve detection efficiency

10cm

10B

(t = 1.2µm)

Expect 20~25 Mcps count rate and 0.4 ~ 0.5 mm spatial resolution

Boron converter installed in µNID Underside of drift plane

15MPGD14 Dec 2018J. Parker

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SLIDE 23

Position (mm)

10 20 30 40 50

Neutron transmission

0.6 0.7 0.8 0.9

1.0 0.9 0.8 0.7 0.60.5 0.4

Line-width (mm)

Spatial resolution study at RADEN

  • Study of spatial resolution, event size
  • vs. gas pressure (1.2 ~ 1.6 atm)
  • L/D:1000, Exposure time: 15 mins
  • Spatial resolution estimated from

contrast of line-pairs (MTF)

  • Maximum count rate at hardware

limit: 22 Mcps @1.6 atm

Pressure (atm)

1.2 1.4 1.6

Average hits/ event

5.86 5.42 4.82

MTF @0.6mm

27% 36% 41%

Spatial resolution @10% MTF (mm)

0.50 0.48 0.45

Gas pressure: 1.4 atm Bin size: 200 x 200 µm2

Contrast (MTF) from fit of sine curves

15MPGD14 Dec 2018J. Parker

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SLIDE 24

Summary

  • Standard µNID detector is in regular use at RADEN
  • Integration into RADEN control system greatly improved usability
  • Incremental improvements in spatial resolution, rate performance
  • MEMS µPICs for improved resolution
  • TSV µPIC gain stability initially seemed to be improved with grounded

substrate, but long-term operability may be adversely affected

  • Large-area TSV µPIC image quality worse than PCB µPIC (gain instability?)
  • TGV µPIC improved gain stability, good image quality
  • µNID with boron converter for increased rate
  • Proof-of-principle study completed confirmed peak rate of 22 Mcps and

spatial resolution of 0.45 mm

  • Next: gas optimization for further reduced event size, increase efficiency of

converter

  • Will make a new, dedicated Boron-µNID system for RADEN next year

15MPGD14 Dec 2018J. Parker