Problem Prototype and Production Test Applications demand high - - PowerPoint PPT Presentation

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Problem Prototype and Production Test Applications demand high - - PowerPoint PPT Presentation

Dec 29, 2022 407 likes •589 views

Problem Prototype and Production Test Applications demand high bandwidth followed by high compliance, low resistance and high temperature. Elastomers have high bandwidth Elastomers have low resistance Elastomers have low compliance

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SLIDE 1
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SLIDE 2

Problem

Prototype and Production Test Applications demand high bandwidth followed by high compliance, low resistance and high temperature.

  • Elastomers have high bandwidth

IP, Apr2011

  • Elastomers have low resistance
  • Elastomers have low compliance
  • Due to small thickness and mechanical coupling
  • Elastomers have limited temperature range
  • Due to the inherent process of silicone rubber
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SLIDE 3

Solution - SM Contact

SM is a new elastomer technology that has silver balls held in a conductive column like buttons which are embedded in a non-conductive silicone rubber on a proper pitch that provides high compliance and extreme temperature ranges. The non-conductive rubber has a core in the middle to enable compression stop feature. SM is available for BGA, LGA, QFN, PoP and other packages from 0.25mm to 1.27mm.

Relaxed Actuated

IP, Apr2011

  • Array of Columns - Elastomer Matrix

Cross Section - Silver Particles POP Interposers

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SLIDE 4

Solution - SMP Contact

0.63 mm The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP. SMP is for ATE production test and is available for BGA, LGA, QFN, PoP and other packages from 0.25mm to 1.27mm.

IP, Apr2011

0. m Actuated

SMP SM

Top Side Tips Pierce DUT Bottom Side Tails Compress SM Columns

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SLIDE 5

SM/SMP Contact - Typical Characteristics

Contact resistance <15 mOhms Bandwidth >40GHz @-1dB Self Inductance <0.21nH @ 10GHz Mutual inductance <0.10nH Capacitance to ground <0.15pF

IP, Apr2011

Capacitance to ground <0.15pF Mutual capacitance <0.04pF Force 25-45grams per contact Operating temperature -55 to +155°C Insertion/Extraction cycles >500,000 Current rating >4A per contact Contact length (compressed): 0.45mm Compliance: 0.25mm

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SLIDE 6

Bandwidth Data – 0.5mm Pitch

S21 (f)

  • 3
  • 2
  • 1

1 [dB] S11 (f)

  • 20
  • 15
  • 10
  • 5

1 [dB]

SM Contact

IP, Apr2011

  • 8
  • 7
  • 6
  • 5
  • 4
  • 3

10 20 30 40 f [GHz] S21 [d

G W N 502

  • 45
  • 40
  • 35
  • 30
  • 25
  • 20

20 40 f [GHz] S11 [

GW N 502

Insertion Loss -1dB @ 40GHz Return Loss -15dB @ 22GHz

Note: 0.5mm MLF Electrical Characterization Performed with previous version SM contact

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SLIDE 7

Current Data – 0.5mm Pitch

SM Contact

Temperature rise as a function of drive current I

10 12 14 16

4 Amps @ 14C Heat Rise

IP, Apr2011

Note: 0.5mm MLF Electrical Characterization Performed with previous version SM contact 2 4 6 8 10 1 2 3 4 5

I [A] dT [deg C]

GWN 404

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SLIDE 8

Temperature Data – 1.27mm LGA SM Contact

IP, Apr2011

Note: Temperature Specifications for SM contact is -55C to +155C

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SLIDE 9

Endurance Data – 0.5mm QFN

0.5mm Pitch QFN Vertical Plunge Cycler, Gold plated device simulator and Gold plated load board @ Room Temp (Ambient)

1 0.004826 0.652853 0.452899 0.418984 0.372352 0.340557 0.331372 252 0.00412 0.681115 0.436648 0.357515 0.341264 0.347623 0.36458 503 0.004762 1.668166 0.620351 0.430289 0.369526 0.329253 0.344797

C400 44-LEAD QFN

SM Contact

IP, Apr2011

503 0.004762 1.668166 0.620351 0.430289 0.369526 0.329253 0.344797 754 0.005661 32.8009 0.753889 0.450779 0.409093 0.359634 0.337025 1005 0.004762 2.291343 0.63095 0.40556 0.369526 0.375885 0.359634 1256 0.004874 1.908393 0.844328 0.443714 0.374472 0.339144 0.306643 1507 0.00473 1.232224 0.579371 0.420398 0.368113 0.332785 0.350449 1758 0.005404 1.391905 0.587143 0.453605 0.397788 0.365993 0.331372 2009 0.005501 45.00939 0.751063 0.447953 0.402027 0.388603 0.357515 2260 0.004971 1.64485 0.605514 0.40768 0.378711 0.313708 0.330666 2511 0.004377 0.862698 0.450073 0.349743 0.352569 0.353982 0.371646 2762 0.004441 1.100806 0.551816 0.40768 0.355395 0.337731 0.353275 3013 0.005228 1.246355 0.525674 0.462791 0.390016 0.404147 0.368819 3264 0.005099 2.842453 0.691006 0.426757 0.384363 0.392136 0.365287 3515 0.004682 1.038629 0.505184 0.425343 0.365993 0.332785 0.326426 3766 0.004826 1.853989 0.591383 0.408386 0.372352 0.383657 0.349036 4017 0.004666 1.520497 0.58573 0.390016 0.365287 0.365993 0.390722 4268 0.004923 60.92514 0.864111 0.467736 0.376591 0.378005 0.378005 4519 0.004762 1.117056 0.541218 0.413332 0.369526 0.337025 0.356101

0.002 0.004 0.006 0.008 0.01 0.012 0.014 0.016

1 14057 28113 42169 56225 70281 84337 98393 112449 126505 140561

Resistance (Ohms) Cycles

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SLIDE 10

Endurance data with real devices to understand contact resistance without cleaning

C400: BGA / LGA: SnCuAg vs. SnPb Plating

0.250

SM Contact

IP, Apr2011

0.000 0.050 0.100 0.150 0.200 0.250

250 500 750 1,000 1,250 1,500 1,750 2,000 2,250 2,500 2,750 3,000 3,250 3,500

ACTUATIONS (no cleaning) 8/09 OHMS / LEAD

BGA SnPb LGA SnPb BGA SnCuAg LGA SnCuAg

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SLIDE 11

5K Endurance data with real devices showing the effects of cleaning

C400: BGA (Effect of Cleaning)

0.175 0.200

D

at 0K hits

SM Contact

IP, Apr2011

0.000 0.025 0.050 0.075 0.100 0.125 0.150 0.175

SnPb SnCuAg

Static (Manual) tests 8/09

OHMS / LEAD

at 5K -no clean at 5K -air cleaned, then retested

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SLIDE 12

SMP QFN Contact – Temperature Data

A MB IE NT D E LTA R FS - 0.5mm MLF - C 200 0.010 0.020 0.030 0.040 0.050 O HMS . Av g Stdev

0.5mm Pitch, 44QFN + 16 GND, Delta RFS Handler Tri-Temp Cycling, (Ambient, +150°C, -50°C) +25C – Ambient Test

0.0050 0.0100 0.0150 0.0200 0.0250 C R E S (O h m s ) Avg Std Dev 95% Level

+25C – Ambient Test

IP, Apr2011

0.000 50 100 150 200 250 C Y C LE S (000) +150C D E LTA R FS - 0.5mm MLF - C200 0.000 0.010 0.020 0.030 0.040 0.050 50 100 150 200 250 CY C LE S (000) O H MS . Av g Stdev

+150C – HOT Test

  • 50C

D E LTA R FS - 0.5mm MLF - C 200 0.000 0.010 0.020 0.030 0.040 0.050 50 100 150 200 250 C Y C LE S (000) O H MS . Av g Stdev

  • 50C – COLD Test

0.0000 5 1 1 5 2 2 5 3 3 5 4 4 5 5 5 5 6 6 5 7 7 5 8 8 5 9 9 5 1 1 5 1 1 1 1 5 1 2 Cycles

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SLIDE 13

24.00

SMP BGA Contact – Endurance Data

0.0200 0.0300 0.0400 0.0500 0.0600 0.0700 0.0800 0.0900 0.1000 0.1100 CRES Ohms

0.5mm 518 BGA - 500K Cycles

Avg Std Dev 95% Level

IP, Apr2011

0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 20.00 22.00 24.00 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 cycles (K) cres (milliohms)

ave cres ave+2std dev 95%tile

1.27mm 479 BGA – 250K Cycles, Ambient Test

0.0000 0.0100 0.0200 50000 100000 150000 200000 250000 300000 350000 400000 450000 500000 Cycles

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SLIDE 14

SM/SMP Value Proposition

Low cost elastomer solution for 0.25mm to 1.27mm pitch devices Extreme temperature solutions (-55 to +155C) High power applications (excellent current rating of 4A@14C rise) High speed digital and RF applications (excellent bandwidth

>40GHz)

Reliable test data due to stable contact resistance throughout life

cycle

High compliancy for large package warpage Mixed pitch and non-conventional array solutions for densely

IP, Apr2011

Mixed pitch and non-conventional array solutions for densely

populated devices at low cost

SM contact provides superior compliance in all lab and evaluation

applications due to individual button technology at affordable cost

SM sockets with wide temperature range are available in same

footprint as other Ironwood sockets

Custom test socket can be produced using SM contact in less

than 3 weeks when standard socket is not available

SM sockets are robust and can be used in demonstration products

for multiple handling process without contact degradation

SMP sockets are proven in ATE applications

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SLIDE 15

Comments Comments and Notes and Notes

  1: _____________________________________________________________ 1: _____________________________________________________________________ ________   2: _____________________________________________________________ 2: _____________________________________________________________________ ________   3: _____________________________________________________________ 3: _____________________________________________________________________ ________   4: _____________________________________________________________ 4: _____________________________________________________________________ ________   5: _____________________________________________________________ 5: _____________________________________________________________________ ________   6: _____________________________________________________________ 6: _____________________________________________________________________ ________

Your Reliable Partner for Electronic Products Your Reliable Partner for Electronic Products

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SLIDE 16

Thanks for your time and attention !! Thanks for your time and attention !!

Your Reliable Partner for Electronic Products Your Reliable Partner for Electronic Products