NE ONE IBS Quality Control: Our Partnership with White Horse - - PowerPoint PPT Presentation

“ONE IBS”

Quality Control: Our Partnership with White Horse Laboratories

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QUALITY CONTROL

GENERAL INSPECTION STEPS

1. Upon delivery, packages are inspected for damage. Any damages are noted and photographed for the delivery driver to sign; supplier is immediately notified. 2. If package is undamaged, an IBS employee will open it and note any loose materials (ex. Torn bags, parts out of tubes). He or she will then take photos of any loose materials. 3. Manufacturer date and lot codes on supplier packing list are recorded to ensure they match the IBS purchase

• rder.

4. Then, photos are taken of part labels, supplier labels, and any supplier markings. ESD gloves will be used to handle the part directly, if necessary. 5. This information is then sent to U.S.A. Quality Control Office before proceeding. 6. U.S.A. Quality Control Office reviews data and advises whether to proceed. The purpose of this procedure is to describe how materials are received, verified, and shipped to customers via IBS GlobalWarehouses.

1. If parts are not up to quality standards, they’re subject to additional testing by a lab.

• Component Body Inspection—Detects any surface defects, sanding, or remarking.
• Permanency

Test Marking—Easing compounds are applied to ensure mfg. markings are original.

• Solderability

Test—Exposes any oxidation or foreign residues on leads.

• Lead Free (RoHs)

Testing—Subcontractor performs a lead test and data is provided.

• De-Capsulation

Test—T ests for die verification and substrate inspection of part.

• X-Ray

Test—Provides complete internal inspection: bonding, paddle, chip, die paddle.

2. After material passes quality inspection, an employee will check the invoice for special instructions from customer. 3. Then, material is wrapped in a layer of bubble cushion and additional foam cushioning. IBS invoice is enclosed in the master box. 4. Material is ready to ship.

GENERAL INSPECTION STEPS

If Parts are Inventory Items For inventory items, an IBS employee will enter bin location and complete entire receiving process. If Parts are Sourced from Open Market If parts are sourced from the open market, brokers, or independent suppliers, QA will make evaluations based on photos and notes. Outside lab testing will be performed, if necessary.

GENERAL INSPECTION STEPS

With IBS Electronics, parts are always obtained directly from factory or authorized distributor. When parts are EOL or OBSOLETED, customer’s approval is required before parts are sourced from open market. Careful considerations are taken when obtaining parts from the open market:

1.

Vendor Qualification and Evaluation

2.

ERAI website review and research (for vendor and parts)

3.

MFR datasheet review and comparison

4.

Component Body Inspection

5.

Marking Permanency or SolventTest

6.

SolderabilityTest

7.

X-ray examination

8.

De-cap examination

9.

Deliberation by MRB (Materials Review Board) Parts obtained from the open market with prior customers authorization, are reviewed and evaluated with ERAI’s High Risk Parts Report & ERAI’s High Risk Company Report on ERAI’s website. (see images on next slides)

GENERAL INSPECTION STEPS

IBS Electronics is committed to provide quality parts & services that exceed customers’ expectations. On Time, Every Time.

Incidents in the last three years:0 The IBS Electronics Group has had NO reports of counterfeit parts delivered to any of our customers for over 10+ years.

PERFORMANCE HISTORY

Founded in 2004, White Horse Laboratories is the first company in China to specialize in counterfeit detection of electronic components. Our international reputation for technical expertise, transparency, and uncompromising report integrity has helped us become the pre-eminent lab in Asia and a consultant to IDEA-STD-1010B and the G-19 DAS6171. We provide Product Verification, Electrical Testing, Failure Analysis, and Reliability Testing for electronic components, PCB, and PCBA in addition to Packaging, Logistics, and Factory Auditing and Inspection services.

White Horse Introduction

• The IBS Electronics Group has Partnered with Whitehorse

Laboratories to ensure Quality Control.

WHITE HORSE LABS

Globally Approvedat Jabil since 2015. Hong Kong Labgistics & Packaging Centre. 600sqm with 6FT Technicians. The widest range of electrical t est and inspection method capabilities. Laboratory Testing for Product Verification, Failure Analysis, Reliability Testing, and Factory Auditing. Main Lab Facility in

• Shenzhen. 1,200sqm

with 40 FT employees including 7 Degreed Engineers.

Companies Who Trust WHL:

Substandard and Counterfeit:

• How Counterfeit and Substandard Products Enter the SupplyChain

– Clones – Old and PoorlyPackaged – Remarked – Refurbished – Factory Reject – “Walking Wounded” – Poor RiskManagement

• 20% of the Product we See is Substandard down from 80% in2006

International Standards and Certifications:

• ERAI
• SAE G-19
• IDEA
• AS5553
• AS6081
• AS6171
• AS9120
• SC21
• ANSI/ESD S20.20-201
• ISO9001-2015
• ISO17025
• MedAccred

Component Condition:

• As defined within the AS6081, stemming originally from ERAI,

the following definitions are used to categorize component condition.

• Suspect
• Fraudulent
• Counterfeit
• Refinished
• Refurbished
• Unused
• Uprated
• Upscreened
• Used (Refurbished or Pulled)

Detection Methods:

• Documentation and PackagingInspection
• General Inspection and Sampling
• External Visual Inspection
• Remarking and ResurfacingTests
• Heated ChemicalTesting
• X-Ray Inspection
• Delid/Decapsulation
• X-Ray Fluorescence (XRF)/EDX
• Scanning ElectronMicroscopy
• Scanning AcousticMicroscopy
• Electrical/Functional Testing
• SolderabilityTesting

Documentation & Packaging Inspection:

• Check Packing Document
• Check PackagingOuter

Condition

• VerifyQuantity
• Document with

Photograph

General Inspection & Sampling:

• Check Internal Packaging Condition
• Check the Marking and Orientation
• VerifyQuantity
• Select Sample for EVI

External Visual Inspection:

• Inspect Package Body
• Inspect Package Terminals
• Check the Marking
• Measure dimension and compare exterior configuration

Remarking and Resurfacing T ests:

• 2. Chemical Marking Permanency Test
• 1. Mechanical scraping of the surface test
• Check if there is coating onbody

For Laser marked device For ink marked device

X-Ray Inspection (Radiography):

• Check the internal structure

(lead frame, wire bond pattern, die position, etc.) and other anomalies such as voids.

Decapsulation:

• Check the die marking if matches with manufacture name or logo and

part number.

• Check die topography and die marking if consistent with reference sample or

previous sample.

• Check ifscratches or cracks ondie surface.

X-Ray Fluorescence:

• This test will show the

element PPM in test point.

Scanning Electron Microscopy:

• Provide very high-resolution images of the sample surface.

Scanning Acoustic Microscopy:

No anomaly during SAM Voids

• SAM detects internal anomalies prior to destructive analysis such as delamination

and voids.

Delamination

Solderability T est:

• This test is to determine the solderability of

device intended to be jointed to another surface using solder for attachment.

• There are 3 methods:

– Dip and look for non-BGA packages – Surface Mount Process Simulation for SMT devices – Wetting balance test

• quantitative

analysis method of solderability

Component Categorization Matrix and T est Levels:

Te s t ing Profiles

C o mp o n e n t C a t e g o r y PTPR/CVPD Application Test Functional Test Parametric Static Dynamic Timing Ca p a c it o r- Ce ra m ic N N N Y Y N Ca p a c it o r-T a n t a lu m N N N Y Y N Ca p a c it o r-Ele c t ro ly t ic N N N Y Y N Re s is t o r N N N Y N N In d u c t o r N N N Y Y N Os c illa t o r, R e s o n a t o r N Y Y N Y Y Dio d e -Re c t ifie r Y N Y Y Y N Dio d e -Z e n e r , T VS, E S D Y N Y Y Y N Dio d e -L E D Y N Y Y Y N Dio d e -DIA C Y N Y Y Y Y T ra n s is t o r-BJT Y N Y Y Y Y T ra n s is t o r-M O S F E T N N Y Y Y Y T ra n s is t o r-IGBT N N Y Y Y Y T h y ris t o r-SCR N N Y Y Y Y T h y ris t o r-T ria c N Y Y Y Y N Lin e a r-Op -A mp N Y Y Y Y N Lin e a r-A mp lifie r-A u d io , In s t ru me n t a t io n YG Y Y Y Y N Lin e a r- Co mp a ra t o r N Y Y Y N Y Co n v e rt e r-A n a lo g -t o -Dig it a l YG Y Y Y Y Y Co n v e rt e r- Dig it a l-t o -A n a lo g YG Y Y Y Y Y Co n v e rt e r- Vo lt a g e -F re q u e n c y YG Y Y Y Y N Re g u la t o r-Fixe d , R e f e r e n c e N N Y Y N N Re g u la t o r-A d ju s t a b le N Y Y Y N N Re g u la t o r-Swit c h in g , D C / D C YG Y Y Y N Y A n a lo g Swit c h -Lo g ic Re la y Y Y Y Y N Y A n a lo g Swit c h -Op t o c o u p le r N N Y Y N Y A n a lo g Swit c h -Po we r Swit c h Y Y Y Y N Y A n a lo g Swit c h -M u lt ip le xe r Y Y Y Y N Y M ixe d Sig n a l-LED/ M o t o r Driv e r Y Y Y Y N Y Lo g ic - Ga t e s , T ra n s c e iv e r , R e g is t e rs , e t c . Y Y Y Y N Y M e mo r y - F l a s h ,O T P , E E P R O M Y Y Y Y Y Y P r o c e s s o r s - M C U , D S P , C P U Y Y Y Y Y Y A p p lic a t io n Sp e c ific IC & Sy s t e m-o n -c h ip IC Y Y Y Y Y Y

• Passive components

– Resistor, Capacitor,Inductor – Transformer,Crystal

• Active components

– Diodes, Transistors – Optoelectronic Devices – Integrated Circuits(IC)

Components:

Electrical T esting Levels:

• Continuity Testing

– CurveTracer – PTPR/CVPD

• Application Test
• Functional Test
• Static Parameter (DC)
• Dynamic Parameters (AC)
• Timing Characteristics
• Temperature Range
• Burn-In

LCR:

• L(Inductor)

– Inductance, Impedance, DCR

• C(Capacitor)

– Capacitance, DF ,ESR, IR

• R(Resistor)

– Resistance *All L CRcan be precondition (High Temperature or humidity)

Discrete Devices:

• Diode

– VF,IR

• Transistor

– ICEO,BVCEO, – ICBO,VBE,HFE

• MOSFET

– IDSS,BVDSS, – VGSTH,RDS(On)

Digital Program T esting:

• E(E)PROM/FRAM/NVRAM
• B/PROM
• DRAM/SRAM
• PLD
• MCU/MPU

Electrical T esting:

• Pin continuity

test

• IDcheck
• Blank-check
• Program & verify
• Read & verify
• Erase

JTAG T esting:

Programmable Logic Device &

Field Programmable Gate Array

CPL D FPGA

Xilinx, Altera, Lattice, Microsemi(Actel)

JTAG T esting:

• Read the ID code and verify
• Loading the program
• Running on ApplicationBoard

Speed and T emperature T esting:

• Set the Temperature
• Commercial is –40C to

+85C

• Industrial is -40C to +100C
• Measure the output

frequency to compare the Golden Sample.

Pin Continuity T esting:

• Pin-to-PinResistance Clampdown Voltage
• f Protective Diodes
• Curve Trace

T esting Program - PTPR/CVPD:

Pin-to-Pin Resistance Clampdown Voltage of ProtectiveDiode Pass Fail

Curve Trace:

The tracer is for one pin IC Pin-out

Bench T esting:

• Voltage
• Current
• Frequency

Recommendations By Product Type – Protocol Cheat Sheet:

I n s p e c t i o n P r o c e s s e s

C o m p o n e n t C a t e g o r y V i s u a l I n s p e c t i o n D e c a p s u l a t i o n X - R a y S o l d e r a b i l it y L e a d - fr e e C a p a c i t o r - C e r a m i c Y N Y G YG YG Y Y C a p a c i t o r - T a n t a l u m Y N Y Y C a p a c i t o r - E l e c t r o l y t i c Y N Y Y R e s i s t o r Y N N Y Y I n d u c t o r Y N YG Y Y O s c i l l a t o r , R e s o n a t o r Y N N Y Y D i o d e - R e c t i fi e r Y N YG YG Y Y D i o d e - Z e n e r , T V S , E S D Y N Y Y D i o d e - L E D Y N N Y Y D i o d e - D I A C Y N YG Y Y T r a n s i s t o r - B J T Y N YG Y Y T r a n s i s t o r - M O S F E T Y N YG Y Y T r a n s i s t o r - I G B T Y N YG Y Y T h y r i s t o r - S C R Y N YG Y Y T h y r i s t o r - T r ia c Y N YG Y Y L i n e a r - O p - A m p Y Y Y Y Y L i n e a r - A m p l i fi e r - A ud io , I n s t r u m e n t a t i o n Y Y Y Y Y L i n e a r - C o m p a r a t o r Y Y Y Y Y C o n v e r t e r - A n a l o g - t o - D i g i t a l Y Y Y Y Y C o n v e r t e r - D i g i t a l - t o- A n a l og Y Y Y Y Y C o n v e r t e r - V o l t a g e - F r e q u e n c y Y Y Y Y Y R e g u l a t o r - F i x e d , R e f e r e n c e Y Y YG Y Y R e g u l a t o r - A d j u s t a b l e Y Y YG Y Y R e g u l a t o r - S w i t c h i n g , D C / D C Y Y Y Y Y A n a l o g S w i t c h - L o g i c R e l a y Y Y Y Y Y A n a l o g S w i t c h - O p t o c o u p l e r Y Y Y Y Y A n a l o g S w i t c h - P o w e r S w i t c h Y Y Y Y Y A n a l o g S w i t c h - M u l t ip l e xe r Y Y Y Y Y M i x e d S i g n a l - L E D / M o t o r D r i v e r Y Y Y Y Y L o g i c - G a t e s , T r a n s c e i v e r , R e g i s t e r s , e t c . Y Y Y Y Y M e m o r y - F l a s h , O T P , E E P R O M Y Y Y Y Y P r o c e s s o r s - M C U , D S P , C P U Y Y Y Y Y A p p l i c a t i o n S p e c i fi c I C & S y s t e m - o n - c h i p I C Y Y Y Y Y

Report Examples:

• Inspections combined report
• Visual inspection (Remarked &Refurbished)
• Parametric test – Resistor (temperature range)
• Functional test –JT

AG

• FailureAnalysis

Component, PCB, and PCBA Failure Analysis & Reliability Testing:

• Component and Board-level Failure Analysis to verify the

reported failure mode and the cause of it. OEM and EMS require this information to make decisions about the reliability of the products they are providing to their customers.

• White Horse provides faster more reliable answers thanOCM or supplier direct

who have a vested interest in protection themselves.

• Curve Trace Testing
• Failure Mode Verification
• Scanning Acoustic Microscopy
• Cross Sectioning
• Scanning Electron Microscopy
• Liquid Crystal (Hotspot) Testing
• Layered Demetalization

Product Packaging and Programming:

• Poor packaging can lead to lead oxidation,

delamination, and “popcorning” and we frequently see good quality product delivered inpoor packaging.

• Wide range of carriers and material in stock for most

component package types

• ESD-certified facility
• Baking MSL-sensitive parts
• Tape and Reel packaging service
• Dry-Pack (vacuum seal withdesiccant and HIC)
• Re-boxing and labeling
• Documentation and bookings

Our Valued Customers

IBS Electronics’ Quality Policy is “committed” to provide quality parts & services that exceeds our customers’ expectations. On Time, Every Time. We look forward to being your strategic supply chain solutions provider. www.ibselectronics.com