Metro IMAPS Vendor Day Introduction to High Temperature Electronics - PowerPoint PPT Presentation

Metro IMAPS Vendor Day Introduction to High Temperature Electronics By Tom Terlizzi GM Systems November 19, 2013 Clarion Hotel, Ronkonkoma, N.Y

PURPOSE ◆ A BRIEF INTRODUCTION INTO THE WORLD OF HIGH TEMPERATURE ELECTRONICS 2

AGENDA ◆ DEFINE HIGH TEMPERATURE ELECTRONICS ◆ DESCRIBE SOME APLICATIONS 3

WHAT ARE TYPICAL INTEGRATED CIRCUIT MILITARY OPERATING TEMPERATURE RANGES? MIL-PRF-38535 MAXIMUM JUNCTION AND STORAGE TEMPERATURE 150 o C MAXIMUM OPERATING TEMPERATURE 125 o C 4

DEFINITION OF HIGH TEMPERATURE ELECTRONICS? ◆ NO INDUSTRY STANDARDS OR AGREEMENT ◆ “ELECTRONICS OPERATING AT TEMPERATURES IN EXCESS OF THOSE NORMALLY ENCONTERED BY CONVENTIONAL SILICON-BASED SEMICONDUCTORS OR THEIR AUXILLARY COMPONENTS.” 1 ◆ TYPICALLY >125 o C OR >150 o C BUT SOME REPORTED LAB WORK TO 600 o C. 1 “ High Temperature Electronics” By F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski, page 2 5

JET ENGINE TEST JET ENGINE TEST STAND ROTOR JET ENGINE CROSS SECTION 6

TELEMETRY HYBRID CROSS SECTION ALUMINUM WIRE BONDABLE 1 MIL GOLD WIRE THICK FILM GOLD FROM SUBSTRATE TO PINS 1 MIL ALUMINUM WIRE FROM IC’S, THIN FILM RESISTORS AND TRANSISTORS PLUG IN METAL HYBRID TO a THICK FILM HERMETIC SIDE WALL SUBSTRATE DIP PACKAGE THICK FILM SUBSTRATE ◆ 150 o C & 20KG’S FOR >2000 HOURS MOUNTED WITH THIXOTROPIC EPOXY TO PACKAGE BASE ◆ MONOMETALLIC ON SEMI’S AND CHIP RESISTORS ◆ Centrifuge calculator available at: http://www.calctool.org/CALC/phys/newtonian/centrifugal 7

JET ENGINE TELEMETRY SYSTEM TELEMTRY HYBRID US PATENT 20080224845 A1 R. BIRES - PRATT AND WHITNEY 8

COMMERCIALLY AVAILABLE TELEMETRY SYSTEMS 9

DOWNHOLE APPLICATIONS 10

DOWNHOLE APPLICATIONS APPROXIMATELY ~20 o C INCREASE IN TEMPERATURE PER KILOMETER DEPTH 11

NASA HIGH TEMPERATURE ELECTRONICS 12

NASA HIGH TEMPERATURE ELECTRONICS WBG =Wide Band Gap=GaN or SiC BS = BULK SILICON SOI=SILICON ON INSULATOR High-Temperature Electronics—A Role for Wide Bandgap Semiconductors PHILIP G. NEUDECK, SENIOR MEMBER, IEEE, ROBERT S. OKOJIE, MEMBER, IEEE, AND LIANG-YU CHEN 13

IMAPS HiTEC 2014 14