Layer Manufacturing as a Generic Tool for Microsystem Integration , - - PowerPoint PPT Presentation

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Layer Manufacturing as a Generic Tool for Microsystem Integration

Per Johander1

, Sjoerd Haasl2, Katrin Persson2 and Urban Harrysson3 1 IVF- Industrial Research and Development Corporation; Argongatan 30,

SE-431 53 Mölndal, Sweden,

2IMEGO AB; Arvid Hedvalls Backe 4, SE-411 33 Göteborg, Sweden; 3FCubic AB; Källarlyckevägen 6, SE-429 35 Kullavik, Sweden

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The packaging should generally solve three basic requirements.

• A reliable and efficient interface to the external medium

the microsystem should interact with.

• A reliable interface to the electronics
• A convenient interface to the application and the

macro world.

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• No standardized packaging of micro system all packaging for

electronics

• The Micro system has to be adapted to packaging
• Develop a generic packaging concept so the packaging could be

adapted to the application

• Function integration mechanical, electrical

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Layer manufacturing and Direct Manufacturing

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The desired structure is built up layer by layer using a ceramic powder as base material. Shaping is performed by printing solidifying ink into the ceramic powder bed. The structural information of each layer is provided by a CAD file (sliced version) of the final part.

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Our definition of direct manufacturing is:

• The full geometric and functional information of the product is contained

in a digital model, which directly could be transferred to the production equipment.

• The advantages of direct manufacturing are
• Production close to customer
• Production on demand
• No storage of spare parts
• Easy up-grading
• Less material consumption
• Lower energy consumption
• More functions integrated
• More complex geometries
• Favourable for production of Micro components

Layer manufacturing and Direct Manufacturing

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8 Parts 64 Parts

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3D electrical interconnects

• One of the most specific problems regarding microsystem integration

is how to achieve 3D electrical interconnects.

• In traditional printed Circuit Boards 2 ½ D
• 3D at the surface as in MID
• Full 3D in Layer Manufacturing

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MID FPC Lens holder Lens DSP(SBB)

3D MID

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• 1

1 2 3 50 100 150 200 250 Sintering Temperature ºC Log Resistance (ohm)

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