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Judicious Choice of Waveform Parameters and Judicious Choice of Waveform Parameters and Accurate Estimation of Critical Charge Accurate Estimation of Critical Charge for Logic SER Estimation for Logic SER Estimation and Vivian Zhu 1 Palkesh


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SLIDE 1

Palkesh Jain Palkesh Jain

and Vivian Zhu

and Vivian Zhu1

1

Texas Instruments India, Bangalore Texas Instruments India, Bangalore

1 1Texas Instruments Inc., Dallas, TX USA

Texas Instruments Inc., Dallas, TX USA

palkesh@ti.com palkesh@ti.com

Judicious Choice of Waveform Parameters and Judicious Choice of Waveform Parameters and Accurate Estimation of Critical Charge Accurate Estimation of Critical Charge for Logic SER Estimation for Logic SER Estimation

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Outline Outline

  • Motivation

Motivation

  • Simulation methodology

Simulation methodology

  • Impact of waveform shapes on Qcrit

Impact of waveform shapes on Qcrit

  • Impact of pulse widths : circuit response time

Impact of pulse widths : circuit response time

  • Impact of transistor ageing on Qcrit

Impact of transistor ageing on Qcrit

  • Re-ordering of critical nodes

Re-ordering of critical nodes

  • Summary and recommendations

Summary and recommendations

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SLIDE 3

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EE Times and Keynotes EE Times and Keynotes

  • Texas Instruments

Texas Instruments

  • "

"Logic SER may become as significant as SRAM error rates Logic SER may become as significant as SRAM error rates," ," predicted Hans Stork, TI CTO, in a keynote speech at the predicted Hans Stork, TI CTO, in a keynote speech at the International Reliability Physics Symposium, 2004. International Reliability Physics Symposium, 2004.

  • Robert Baumann warned that reductions in circuit operating

Robert Baumann warned that reductions in circuit operating voltages, aggressive substrate/junction engineering and voltages, aggressive substrate/junction engineering and reductions in node capacitance mean radiation-induced reductions in node capacitance mean radiation-induced single single event effects have become a serious threat. event effects have become a serious threat.

  • Intel

Intel

“Soft errors are the second biggest [reliability] concern after Soft errors are the second biggest [reliability] concern after leakage current in submicron memory design leakage current in submicron memory design” ” . .

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EE Times and Keynotes EE Times and Keynotes

  • IBM:

IBM:

  • Tim Dell,

Tim Dell, “ “For every 256 Mbytes of memory, you will get one For every 256 Mbytes of memory, you will get one soft error a month soft error a month” ”. .

  • Sun Microsystems

Sun Microsystems

  • Encountered

Encountered SEEs SEEs causing Sun server workstations to require causing Sun server workstations to require

  • ccasional resets.
  • ccasional resets.
  • Cisco Systems

Cisco Systems

  • Encountered SEE failures with its 12000 series router line

Encountered SEE failures with its 12000 series router line cards, reporting failures of memory and cards, reporting failures of memory and ASICs ASICs and subsequent and subsequent debugging attempts for soft errors. Cards showed ASIC errors debugging attempts for soft errors. Cards showed ASIC errors that may have resulted in a card's reloading with a two- or that may have resulted in a card's reloading with a two- or three-minute recovery, according to a field note. three-minute recovery, according to a field note.

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  • What are Single Event Upsets (SEU) ?

What are Single Event Upsets (SEU) ? – – Due to alpha particles and cosmic neutrons Due to alpha particles and cosmic neutrons – – Storage node will be flipped if Q Storage node will be flipped if Qcollected

collected > Q

> Qcrit

crit

SEU depends on 1. Diffusion charge collection area 2. Node capacitance 3. Restoring current Qcrit is a single metric, which represents a node’s sensitivity to soft errors.

SER Primer SER Primer

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SER Modeling Flow SER Modeling Flow

Device Circuit Gate RTL System

Simulation Methodology Expected Outcome

3D Simulator SPICE Timing Tools Logic Tools Usage Model Charge Collection Physics Waveforms Qcrit and Nominal FIT Timing Activity; Temporal Masking; Logical Deration System SER

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Critical Charge Modeling Critical Charge Modeling

Critical charge at a node represents the ‘minimum’ charge required

by a single-event particle strike, to create an upset.

Generally, absolute values of critical charge are not of much

importance and it is the relative ranking of nodes, in order of their criticality, which is more important.

Designer may choose to harden the top critical nodes.

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Critical Charge Modeling Critical Charge Modeling

It is of importance to estimate the relative critical charge of the

nodes accurately.

Traditional methods to estimate Qcrit include : Device simulation, including generation of electron-hole pairs

to simulate the particle strike and associated circuit response (entirely at device level).

Circuit level techniques : Inject a current source (obtained empirically, or,

analytically) in the circuit node, representative of the particle strike, and measuring the charge deposited by the ‘critical’ current source.

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SPICE Level Qcrit Modeling SPICE Level Qcrit Modeling

  • Three waveforms

used for analysis :

Triangular /

Trapezoidal

Rectangular Double

exponential

  • Triangular and

rectangular pulses are governed by a single peak; exponential waveform is rise- time and fall-time dependent.

Representative waveforms used in study : exponential, triangle and rectangle (AMPS) −500u 0.0 500u 1.0m 1.5m 2.0m t(SECONDS) 1e−06 1.00001e−06 1.00002e−06 1.00003e−06 1.00004e−06 (AMPS) : t(SECONDS) Exponential Triangular Rectangular

(Peak, Tp/10) (Peak/2, Tp/5) (Peak/3, 2Tp/5) Tp

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Circuit Response to different waveforms Circuit Response to different waveforms

  • Evidently, a triangular

pulse leads to significant amount of undershoot on the struck node, as compared to exp. current source depositing same charge.

  • These undershoots alter

the device properties for a transient duration, making the Qcrit result inaccurate.

  • In fact, undershoots are associated with altering the threshold voltage of the

struck device and make it conducive to flip.

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Impact of Undershoot : Impact of Undershoot : threshold voltage lowering threshold voltage lowering

  • As is seen, the threshold
  • f the struck device,

lowers by as much as 20% due to the triangular current pulse strike.

  • This reduction in Vt of the

device makes the device stronger, causing the logic to flip faster.

  • It is hence recommended that triangular waveforms, with shorter pulse widths

should not be used for Qcrit estimation

Vt of the struck transistor

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Impact of Pulse Width Impact of Pulse Width

  • Qcrit at a node is generally summarized by following equation :

Qcrit = C*Vdd + Ion*tFlip

Where, C is the node’s parasitic capacitance, tFlip is the time the node takes to flip and Ion is the recovery current, provided by the restoring pMOS

  • Typically, a particle strike is associated with generation of current pulses with a

wide width-distribution.

  • It is important from a design stand-point to assess the impact of different pulse

widths on the circuit response and circuits SER reliability.

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Circuit under study Circuit under study

  • Rectangular waveforms of different

pulse widths are used to characterize the Qcrit at the struck node :

0.1ps to 1e5 ps.

  • We also measure the time the

circuit node takes to flip, as in cases with large pulse widths, the logic flips much before than the pulse duration is over

  • Additionally, we also measure a

metric : modified Qcrit, which represents the area under the curve

  • f the current waveform, till the time

when the logic flips irreparably.

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Circuit Response Time Circuit Response Time

  • Modified Qcrit and

flip time for the circuit node are as shown.

  • As can be seen,

modified Qcrit saturates for very small and very large values of pulse widths.

  • Flip time remains constant till pulse width of 100ps, where-in the device

action kicks in. This causes the Qcrit to increase and also the flip time.

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Discussion : Circuit Response Time Discussion : Circuit Response Time

  • At very small pulse,

Qcrit is basically a function of the node capacitance (device action does not comes into play).

  • As the pulse width

increases, the restoring pMOS action kicks in, causing the Qcrit to increase

  • Eventually, at very high pulse widths, the logic flips much before the pulse

duration is over and the modified qcrit saturates.

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Impact of aging Impact of aging

  • As seen, the restoring

pMOS action is critical in improving the node’s Qcrit.

  • With increasing importance
  • f transistor degradation

phenomenon like NBTI, it is

  • f interest to assess how

does the node’s critical charge change with device aging.

  • Assuming a latch, which stores logic ‘1’ through the life - will cause NBTI degradation

in only the pMOS P1.

  • pMOS P1 is restoring transistor for 1-0 flip on N1, while it is a feedback transistor in
  • ther case.
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Discussion : Impact of aging Discussion : Impact of aging

  • Comparing the Qcrit

for two nodes at two different pMOS ages (t=0 and t=End of Life), clearly, there is a reduction in the Qcrit at EOL.

  • Additionally, the nodes

N3 and N4 interchange in the criticality order.

  • If aging weakens the restoring pMOS, Qcrit of the flip associated with the node

decreases, making the node more sensitive to particle strikes.

Qcrit of the circuit node should be assessed considering the device aging.

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Re-ordering of critical nodes Re-ordering of critical nodes

  • Imperatively, due to strong

circuit effects, it is likely that a node which is most critical with a particular waveform, may become less critical with other.

  • Nodes N5 and N3

interchange the criticality

  • rder with a different choice
  • f waveforms
  • We believe that this reordering is mainly due to the restoring transistor’s response,

which indeed is a function of the injected current pulse.

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  • An elaborate analysis of several key factors, which impact the assessment of

the critical charge of the circuit was presented.

It was shown that triangular and pulses with short rise times are associated

with artifacts like undershoots on the struck node, and may lead to an erroneous Qcrit result.

A detailed study of how the node’s Qcrit changes with the choice of the

pulse width of the injected current was presented, highlighting the major contributors (node’s cap and device’s response).

The Qcrit of the node was studied in the presence of the device aging and it

was shown that aging may weaken the recovery action, decreasing the Qcrit.

  • The study also provides a way for designers to rank-order the logic

blocks/nodes in Qcrit criticality.

We show that rank-order is a strong function of the pulse width and hence, it

strongly motivates to make particle-strike induced pulse-width distribution, an essential parameter in such a ranking.

Conclusions Conclusions

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Thank You Thank You

Email Feedback : palkesh@ti.com Email Feedback : palkesh@ti.com