ITDs Petal e.g. ITD2 Preliminary Thermal Calculation ITDs Petal e.g. - - PowerPoint PPT Presentation

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CLICdp Tracker Technology Meeting ITDs Petal e.g. ITD2 Preliminary Thermal Calculation ITDs Petal e.g. ITD2 Preliminary Thermal Calculation Szymon Sroka, Fernando Duarte Ramos Presentation Layout Presentation Layout Design Parameters

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SLIDE 1

CLICdp Tracker Technology Meeting

ITDs Petal e.g. ITD2 ‐ Preliminary Thermal Calculation ITDs Petal e.g. ITD2 ‐ Preliminary Thermal Calculation

Szymon Sroka, Fernando Duarte Ramos

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SLIDE 2
  • Design Parameters & Boundary Conditions
  • ITDs PETAL Baseline Design
  • Thermal Simulation in ANSYS
  • Thermal Studies

Szymon Krzysztof Sroka 2

Presentation Layout Presentation Layout

24/02/2017

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SLIDE 3

3 Szymon Krzysztof Sroka 24/02/2017

Reminder‐ ITDs support structures

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SLIDE 4

4 Szymon Krzysztof Sroka 24/02/2017

Reminder‐ ITDs support structures

  • Support Structure
  • Support Structure + Petals

1 2

  • Petal ‐ the Object of interest
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SLIDE 5

Design parameters & Boundary Conditions

5

DPs:

  • Chip power dissipation
  • Assumed range of Chip Power Dissipation 0.01 ‐ 0.15 W cm‐2
  • Operational temperature and uniformity
  • Ambient temperature T = 22 ⁰C
  • Chip operational temperature T < 30 ⁰C
  • Coolant Input temperature T = 15 ⁰C
  • Water Cooling System
  • System has to be leak‐less

‐ the pressure drop should remain well below 1 bar in order to guarantee return of the water flow

BCs:

  • Tmin > Tdew‐point (assumed 12 ⁰C )
  • Minimum chip operational temperature above the Dew Point
  • Reliability
  • Robust design with minimum maintenance required
  • Operating Conditions
  • Materials and design compatible with operation in the CLIC Inner Region

Szymon Krzysztof Sroka 24/02/2017

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SLIDE 6

ITDs PETAL Baseline Design

6

Assumptions:

  • Mechanical layout (Petal ITD):
  • CF Skins (K13D2U, T = 150 μm; 60% Fibre; 40% Epoxy)
  • PGS ( Pyrolytic Graphite Sheet, T = 25μm)
  • Glue Layer ( Eccobond 54, T = 100 μm)
  • CORE (Rohacell IG51, T = 3.5 mm) + Graphite Foam (Allcomp K9, T = 3.5 mm)

+ Cooling Pipe (ID = 2.05; TH = 140 µm) + Cooling Fluid (Water)

  • Glue Layer ( Eccobond 54, T = 100 μm)
  • PGS ( Pyrolytic Graphite Sheet, T = 25μm)
  • CF Skins (K13D2U, T = 150 μm; 60% Fibre; 40% Epoxy)
  • Glue Interface (Eccobond 54, T = 100 μm)
  • Module of Traker Disks:
  • Silicon Pixel Chips (T = 200 μm ( 100 + 100))
  • FPC Insulating layer (Polyimide, T = 50 μm)
  • FPC Metal layer (Aluminium, T = 50 μm)
  • FPC Insulating layer (Polyimide, T = 50 μm
  • Glue Interface (Eccobond 54, T = 100 μm)
  • Power Bus:
  • Insulating layer (Polyimide, T = 100 μm)
  • Metal layer (Aluminium, T = 200 μm)
  • Insulating layer (Polyimide, T = 100 μm)

Module Power Bus

CFS CFS Core & Carbon Foam & Cooling Pipe & Cooling Fluid PGS PGS

  • Additional Glue Interfaces (Eccobond 54, T = 100 μm):
  • Core & Carbon Foam
  • Carbon Foam & Cooling Pipe

PARTICLES DIRECTION Szymon Krzysztof Sroka 24/02/2017

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SLIDE 7

7

COMPONENTS MATERIAL DENSITY [ kg/m3] CTE [1/C] x 10‐6 THERMAL CONDUCTIVITY [ W/m*C] MECHANICAL LAYOUT (PETAL ITD)

CFS K13D2U 1742 2.6 [ 294; 159; 1.2 ] INTERFACE PGS ( PYROLYTIC GRAPHITE SHEET) 1900 93 1600 GLUE HYSOL ECCOBOND 45 1240 58 0.35 CORE ROHACELL IG51 52 1 0.03 CARBON FOAM ALLCOMP K9 220 3.5 [ 34; 38; 34 ] COOLING PIPE TITANIUM CP2 R50400_COOLING PIPE 4510 8.4 21 ALUMINIUM 5251 A95251 2690 25 134 POLYIMIDE ( KAPTON ) 1540 20 0.385 CF TUBE (T300) 1770 19.2 1 COOLANT WATER 998.3 207 0.604

GLUE INTERFACE

HYSOL ECCOBOND 45 1240 58 0.35

MODULE OF TRACKER DISKS

SILICON SENSORS SILICON 2329 2.61 156 FPC INSULATING LAYERS POLYIMIDE ( KAPTON ) 1540 20 0.385 METAL LAYER ALUMINIUM 2690 22.2 205

GLUE INTERFACE

HYSOL ECCOBOND 45 1240 58 0.35

POWER BUS

PB INSULATING LAYERS POLYIMIDE ( KAPTON ) 1540 20 0.385 METAL LAYER ALUMINIUM 2690 22.2 237.5

ITDs PETAL Baseline Design

Szymon Krzysztof Sroka 24/02/2017

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SLIDE 8

8

1 2

Szymon Krzysztof Sroka 24/02/2017

ITDs PETAL Baseline Design – Cooling Loop

“Curly” Cooling Pipe Straight Cooling Pipe

Material Candidates e.g. :

  • Titanium
  • Aluminium

Material Candidates e.g. :

  • Polyimide (Kapton)
  • Carbon Fibre

Technical Details:

  • Length of CP = 973 [mm]
  • ID of CP = 2.05 [mm]
  • Thickness of CP = 140 [µm]

Technical Details:

  • Length of CP = 911 [mm]
  • ID of CP = 2.05 [mm]
  • Thickness of CP = 140 [µm]
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SLIDE 9

9

1 2

Szymon Krzysztof Sroka 24/02/2017

ITDs PETAL Baseline Design – Cooling Loop

“Curly” Cooling Pipe Straight Cooling Pipe

Material Candidates e.g. :

  • Titanium
  • Aluminium

Material Candidates e.g. :

  • Polyimide (Kapton)
  • Carbon Fibre
  • Internal Structure: Core & C. Foam
  • Internal Structure: Core & C. Foam
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SLIDE 10

10

1 2

Thermal Simulation in ANSYS – BCs

3 4

Szymon Krzysztof Sroka 24/02/2017

  • BCs: Radiation
  • CFS ( BACK SIDE)
  • CFS ( FRONT SIDE)
  • POWER BUS
  • BCs: Heat Flux
  • SILICON SENSORS
  • CFS ( BACK SIDE)
  • CFS ( FRONT SIDE)
  • POWER BUS
  • BCs: NC ( Air )
  • WATER INLET TEMP
  • FLOW CONVECTION

(Water & Inner CT Wall)

  • MASS FLOW RATE
  • BCs: Cooling Loop
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SLIDE 11

11

1

Thermal Simulation in ANSYS – Mesh

2

Szymon Krzysztof Sroka 24/02/2017

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SLIDE 12

12

Thermal Simulation in ANSYS –Temp. Distribution

“Curly” Cooling Pipe

Szymon Krzysztof Sroka 24/02/2017

1 1.2

Cooling Pipe Material :

  • Titanium

Cooling Pipe Material :

  • Aluminium

Obtained in case of:

  • Heat Flux = 1500 Wm‐2
  • Mass Flow Rate = 20.4 Lh‐1

Obtained in case of:

  • Heat Flux = 1500 Wm‐2
  • Mass Flow Rate = 20.4 Lh‐1
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SLIDE 13

13

Thermal Simulation in ANSYS –Temp. Distribution

Straight Cooling Pipe

Szymon Krzysztof Sroka 24/02/2017

Cooling Pipe Material :

  • Polyimide (Kapton)

Cooling Pipe Material :

  • Carbon Fibre

2 2.1

Obtained in case of:

  • Heat Flux = 1500 Wm‐2
  • Mass Flow Rate = 20.4 Lh‐1

Obtained in case of:

  • Heat Flux = 1500 Wm‐2
  • Mass Flow Rate = 20.4 Lh‐1
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SLIDE 14

Thermal Studies

14

  • NB. OF

CASE ASSUMED POWER CHIP DISSIPATION [W/cm2] POWER APPLIED (W) HEAT FLUX (ANSYS) [W/m2] MASS FLOW RATE [ L/h] CHTC ‐ Duct walls & Internal flow of water [W/m2K] ‐‐> TI & AL ( LCL = 976 [mm] ) CHTC ‐ Duct walls & Internal flow of water [W/m2K] ‐‐> Kapton & CF ( LCL = 911 [mm] CHTC ‐ CFS ( Vertical plate) & air [W/m2K] TCF ‐ Input [ ⁰C ] ΔTCF [ ⁰C ] 1

0.15 71.05 1500 20.40 9667 9667 13.115 15 3

2

0.10 47.37 1000 13.60 1527 1544

3

0.080 37.90 800 10.88 1449 1472

4

0.060 28.42 600 8.16 1366 1384

5

0.040 18.95 400 5.41 1275 1288

6 (IB)

0.034 16.10 340 4.62 1246 1257

7

0.030 14.21 300 4.08 1226 1236

8

0.020 9.47 200 2.72 1174 1181

9 OB)

0.0185 8.76 185 2.52 1166 1173

10

0.010 4.74 100 1.36 1118 1122

Szymon Krzysztof Sroka 24/02/2017

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SLIDE 15

‐1.5 ‐0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5 11.5 12.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75

ΔTCHIP VS ENVIROMENT [⁰C] POWER APPLIED [W]

Thermal Performance

ID = 2.05 mm, Titanium Pipe ID = 2.05 mm, Aluminium Pipe ID = 2.05 mm, Kapton ( Polyimide ) Pipe ID = 2.05 mm, CF Pipe

Thermal Studies

15 Szymon Krzysztof Sroka 24/02/2017

Results: The proposed

design presents good thermal performance at the assumed power dissipation: (0.01 – 0.15 W cm‐2)

Objective: Evaluation of

the thermal performance

  • f the proposed design by

simulating the chip surface temperature at various flow rates and power dissipation at chips

Max Chip operational temperature Turbulent Flow

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SLIDE 16

0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 0.11 0.12 0.13 0.14 0.15 0.16 0.17 0.18 0.19 0.2 0.21 0.22 0.23 0.24 0.25 0.26 0.27 0.28 0.29 0.3 0.31 0.32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

ΔpH20 [bar] H20 flow rate [ L/h]

Pressure Drop

ID = 2.05 mm, Titanium and Aluminium ID = 2.05 mm, Polyimide and CF

Thermal Studies

16 Szymon Krzysztof Sroka 24/02/2017

Objective:

Verification the compatibility of the proposed design with the leak – less

  • peration

system by simulating the pressure drop at various flow rates and power dissipation at chips

Results: The proposed

design is compatible with the leak – less

  • peration system

Turbulent Flow

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SLIDE 17

17

Thermal Studies ‐ ITDs PETAL

Szymon Krzysztof Sroka 24/02/2017

1

“Curly” Cooling Pipe

COMPONENTS MATERIAL DENSITY [ kg/m3] Thickness Mass [ gm ] X0 [ cm ] RL [%X0] MECHANICAL LAYOUT (PETAL ITD) CFS

K13D2U 1742 2 x 150 [µm] 33.57 24.512 0.122

INTERFACE

PGS ( PYROLYTIC GRAPHITE SHEET) 1900 2 x 25 [µm] 6.10 22.474 0.022

GLUE

HYSOL ECCOBOND 45 1240 4 x 100 [µm] 29.6 35.5 0.112

CORE

ROHACELL IG51 52 [Th = 3.5 [mm]] T_smeared = 2.8 [mm] 9.52 784.6 0.036

CARBON FOAM

ALLCOMP K9 220 [Th = 3.5 [mm]] T_smeared = 0.7 [mm] 9.18 194.1 0.036

COOLING PIPE

TITANIUM CP2 R50400_COOLING PIPE 4510 (ID = 2.05 [mm] TH = 0.14 [mm]) T_smeared = 19.8 [µm] 4.23 3.592 0.055 ALUMINIUM 5251 A95251 2690 2.53 8.896 0.022

COOLANT

WATER 998.3 T_smeared = 67.8 [µm] 3.21 36.08 0.0188 TOTAL 91.18 + CP TOTAL 0.347 + CP

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SLIDE 18

COMPONENTS MATERIAL DENSITY [ kg/m3] Thickness Mass [ gm ] X0 [ cm ] RL [%X0] MECHANICAL LAYOUT (PETAL ITD) CFS

K13D2U 1742 2 x 150 [µm] 33.57 24.512 0.122

INTERFACE

PGS ( PYROLYTIC GRAPHITE SHEET) 1900 2 x 25 [µm] 6.10 24.474 0.022

GLUE

HYSOL ECCOBOND 45 1240 4 x 100 [µm] 29.6 35.5 0.112

CORE

ROHACELL IG51 52 [Th = 3.5 [mm]] T_smeared = 2.8 [mm] 9.36 784.6 0.036

CARBON FOAM

ALLCOMP K9 220 [Th = 3.5 [mm]] T_smeared = 0.7 [mm] 9.87 194.1 0.036

COOLING PIPE

POLYIMIDE ( KAPTON ) 1540 (ID = 2.05 [mm] TH = 0.14 [mm]) T_smeared= 18.5 [µm] 1.35 28.41 0.0065 CF TUBE (T300) 1770 1.55 24.124 0.0076

COOLANT

WATER 998.3 T_smeared= 63.5 [µm] 3 36.08 0.0176 TOTAL 91.5 + CP TOTAL 0.346 + CP 18 Szymon Krzysztof Sroka 24/02/2017

2

Straight Cooling Pipe

Thermal Studies ‐ ITDs PETAL

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SLIDE 19

19

COMPONENTS MATERIAL DENSITY [ kg/m3] Thickness Mass [ gm ] X0 [ cm ] RL [%X0] GLUE INTERFACE

HYSOL ECCOBOND 45 1240 100 [µm] 5.87 35.5 0.028

MODULE OF TRACKER DISKS

SILICON SENSORS SILICON 2329 200 (100+100) [µm] 33.10 9.369 0.212 FPC INSULATING LAYERS POLYIMIDE ( KAPTON ) 1540 100 [µm] 6.73 28.41 0.035 METAL LAYER ALUMINIUM 2690 50 [µm] 6.40 8.896 0.056

GLUE INTERFACE

HYSOL ECCOBOND 45 1240 100 [µm] 5.87 35.5 0.028

POWER BUS

PB INSULATING LAYERS POLYIMIDE ( KAPTON ) 1540 200 [µm] 13.46 28.41 0.070 METAL LAYER ALUMINIUM 2690 200 [µm] 25.6 8.896 0.225 TOTAL 97.03 TOTAL 0.654

Thermal Studies ‐ ITDs PETAL

Szymon Krzysztof Sroka 24/02/2017

Modules of Tracker Disks & Power Bus

+

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SLIDE 20

20

Design Total Mass [ gm ] Total RL [%X0] “CURLY” COOLING PIPE

TITANIUM CP2 R50400 192.5 1.056 ALUMINIUM 5251 A95251 191.0 1.023

STRAIGHT COOLING PIPE

POLYIMIDE ( KAPTON ) 190 ~1.01 CF TUBE (T300) 190.1 ~1.01

Thermal Studies ‐ Comparison

Szymon Krzysztof Sroka 24/02/2017

“CURLY” COOLING PIPE VS STRAIGHT COOLING PIPE

1/2

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SLIDE 21

Conclusions

21 Szymon Krzysztof Sroka 24/02/2017

  • The ITDs Petal thermal characterization has been presented.
  • The cooling of the ITDs Petal is provided by water flowing inside a

polyimide (CF) / titanium (AL) tube embedded in the sandwich structure where the module and power bus are glued.

  • The different design parameters were numerically investigated to

increase the performance of the system.

  • A numerical analysis were performed simulating the assumed

power dissipation (0.01 – 0.15 W cm‐2) of the chip pixel. The analysis confirm the thermal design of the system.

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SLIDE 22

Thank you

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SLIDE 23

BACKUP SLIDES BACKUP SLIDES

23 Szymon Krzysztof Sroka 24/02/2017

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SLIDE 24

24 Szymon Krzysztof Sroka 24/02/2017

POWER BUS

PB INSLULATING LAYER ( 100 µm) PB METAL LAYER( 200 µm) FPC INSLULATING LAYER ( 100 µm) CFS ‐ K13D2U (60% Fibre; 40% Epoxy) ( 150µm) CORE ‐ ROHACELL IG51 + CARBON FOAM ( 3.5 mm ) + COOLING PIPE ( ID = 2.05 mm) + COOLING FLUID CFS ‐ K13D2U (60% Fibre; 40% Epoxy) ( 150µm) PGS (Pyrolytic Graphite Sheet) (25 µm ) PGS (Pyrolytic Graphite Sheet)( 25 µm )

PETAL (TD) / OTB UNIT

GLUE LAYER ( 100 µm) GLUE LAYER ( 100 µm)

PARTICLES DIRECTION

SENSOR + READOUT ASIC ( 2 x 100 µm)

MODULE OF OTB & TACKER DISKS

FPC INSLULATING LAYER ( 50 µm) FPC METAL LAYER( 50 µm) FPC INSLULATING LAYER ( 50 µm)

PETAL

GLUE LAYER ( 100 µm) GLUE LAYER ( 100 µm)

ITDs PETAL APPROPRIATE VALUE OF RL [%]

ITDs PETAL Baseline Design