HIRDES PhaseB1 Kayser Threde FinalPresentation - - PowerPoint PPT Presentation

HIRDES PhaseB1

FinalPresentation @DLR,Bonn

April05,2006

www.kayser#threde.com

Kayser Threde

R.Graue;D.Kampf;Ch.Neumann

2 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

Contents

Requirements PhaseB1Study Logic SystemArchitecture Optical Performance Mechanical andStructural Design ThermalandDistortion Analyses Mechanisms Design InOrbitCalibration ElectronicsandDetectors Budgets Design,Development andVerification Plan Documentation

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HIRDESRequirements

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HIRDESInstrument– DrivingRequirements

1.6Mbit/sec DataRate(downlink) 150W Power 155kg Mass ProtectiveCase Envelope >40Hz Stiffness(firstfundamentaleigenfrequency) 15g(tbc) Limitloadsinallaxesw/oSF 16mag (VUVES);18(UVES) 11mag (VUVES);13(UVES) Minimumsensitivity SNR=10in10h SNR=100in10h >48000 SpectralResolution 1748310nm 1028176nm Wavelengthcoverage UVSpectrograph VUVSpectrograph

BaselineRequirements Parameter

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Applicable Documents

AD1 UserRequirements Document;3.2006 AD2 ProjectWSOUV;PhaseAPreliminary Design(T170M);7.2005

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PhaseB1StudyLogic

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MainObjectivesoftheHIRDESPhaseB1Study

SystemArchitectureandDesignConceptualDesign Preliminary Engineering Optical PerformanceofSpectrometers andIFGS Structural Performance Mechanical Configuration andConceptual Design ThermalBehaviour andOptical Stability ElectronicsandSoftwareArchitecture MCP/IFGSDetector PerformanceAnalysesandDesign ExternalIFEngineering(Telescope,ExternalElectronicsPanels) EvaluationofProgrammatic Design,DevelopmentandVerificationPlan PAApproach ROMCostEstimations

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Optical Analyses andLayout(SpotDiagrams,RayTracing) ThermalAnalyses andControl (Passive,Active) Structural Analyses (Eigenmodes,Strength) PerformanceAnalyses (Distortion Analyses,Tolerancing) Mechanical Design Mechanisms Concept MCPandIFGSDetector Design InstrumentElectronicsDesign IFEngineeringtoS/C(Telescope,Electroics) Budgets(Mass,Power,Data) InFlight Calibration Concept >tbc

ArchitecturalTradesandEngineering# Overview

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Study Logic PhaseB1

Architectural Design ICDpreparation Preliminary DesignandEngineering DDVPlanandROMCost Estimation Preliminary Documentation FinalDocumentation

FP (DLR) PM1 KO

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PhaseB1TeamConfiguration

IAAT Scientific andTechnical Management MCPDetector EngineeringSupport KT IndustrialStudy Team Optomechanics,Electronics ISAS Scientific Consultancy Spectrometer Layout Expertise

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System Architecture

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T170MTelescope

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BaselineConfigurationofHIRDES(VUVESandUVES)

PhaseA UVandVUVSpectrometersOptomechanics (OpticalElements,Housing) UVandVUVMCPDetectors(2x2)includingFrontEndElectronics ICU(InstrumentControlandDataProcessing) HVPSandLVPS(HighandLowVoltagePowerSupply) ThermalH/W MechanismsincludingMotorControlElectronics VacuumShutterforMCPDetectors(UV,VUV) GreyFilterMechanism(UV,VUV) ServoMirrorMechanism(UV,VUV) Echelle andCollimatorFocusMechanisms(UV,VUV) PhaseB1(AdditionalEquipment) UVandVUVInternalFineGuidanceSensor(IFGS)includingFrontEndElectronics andOptics

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Optical Performance

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HIRDESOpticalLayoutincl.WSO/UVTelescopeT170M

VUVSpectrometer UVSpectrometer T170MTelescope FocalLength: 27m PrimaryMirror: dia.1.7m

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UVSpectrograph

UVspectrograph with echelle grating (40lines/mm/70deg.blaze) andprism (fused silica,12deg.)

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UVSpectrograph# FocalPlane

Wavelength : 174#312nm Grating order 253#149

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UVSpectrograph# FocalPlaneHighResolution(69000)

Spotsatposition 5for demonstration only

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UVSpectrograph# InFieldFineGuidancewithLens

Infield reflected atprism frontsurface towards focus mirror vialens onto fineguidance detector

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UVSpectrograph# InFieldFineGuidancePerformancewithLens

• Spotsat550nmwith10Bmpixeland0.3arcsec distance(instantillumination)
• Spotsrangingat600and630nmwith10Bmpixeland0.3arcsec distance(instantillumination)

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VUVSpectrograph

Spectral separation viaechelle grating (65lines/mm/71deg.blaze) andcrossdisperser (onfocus mirror,625lines/mm)

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VUVSpectrograph# FocalPlane

Wavelength: 102#176nm Grating order: 282#165

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VUVSpectrograph# InFieldFineGuidance

Infield decoupled from 0thorderreflection ofgrating via2mirrors onto fineguidance detector

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VUV# InField FineGuidance # Performance

Spots,10Bmpixel 2spotswith10Bmpixeland0.6arcsec distance(instantilluminationfordemonstrationonly) Diffractionlimitationdueto600nmwavelengthand160mfocallength(diffractionlimited)

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Mechanical andStructural Design

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HIRDESSpectrometerPrimaryStructure# Baseline

ModularApproachofSpectrometerHousing(StandAloneSpectrometerUnits) MonolithicCeSiC structure(conservativematerial,quasiisotropicbehaviour) Light#weightapproach MinimizedProcurementcosts

FabricationtechnologyavailableinGermany ReducedManufacturingtolerances Standardizedadjustmentdevicesforeachopticalcomponent

Isostatic suspensionfortheHIRDESspectrometerstotheTelescopeI/F Isostatic suspensionandthermaldecouplingbetweendetectorsandSpectrometer Housing

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SpectrometerArrangement

h

Z Y LSS U V Spect r om et er VU V Spect r om et er O pt i cal bench I / F see page 2 1100 50 462 ( 3x ) 3 7 . 3 1 2 520 540 120 ( 3x ) A A B B

UVSpectrometer VUVSpectrometer

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Isostatic MirrorSuspension (ORFEUSHeritage)

CriticalComponentsDesign

MirrorsandGratings

• QuartzGlas withInvarflexuralmounts
• WFE:λ

λ λ λ/20atλ λ λ λ =633nm

• SurfaceRoughness:<1nm
• Coatings:
• UV:Al+SiO2
• VUV:Al+MgF2
• VIS:Al+SiO2 (Option:Au)

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CriticalComponentsDesign

Isostatic SuspensionmadefromCFRP (PACSheritage) InvarSuspensionwithSSflexuralBlades (ORFEUSHeritage)

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S/C> Bus

PowerSupply

LVPS,HVPS,Converter

ICUandMCE

Power cmd,control,data

ElectronicsSubsystem

Power cmd,control,data

SensorSubsystem IFGSVUVES IFGSUVES Optical Subsystem MCPVUVES (Main/Red) MCPUVES (Main/Red)

UVES

Entrance Slit Spectrometer Optomechanics Grey FilterMechanism Servo MirrorMechanism

VUVES

Entrance Slit Spectrometer Optomechanics Grey FilterMechanism Servo MirrorMechanism

Telescope T170M

cmd, control data Power

Vacuum Shutter Mechanism

PhaseB1Architecture

Vacuum Shutter Mechanism

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MechanicalDesignofSpectrometerHousings

UVES VUVES

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SpectrometerswithoutHousing

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StructuralPerformance# Stiffness

StructuralMathematicalSimulationModel Eigenmodes >78Hz

• 40Hz(Requirement)

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StructuralPerformance# Strength

PositiveMarginofSafety

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ThermalandDistortion Analyses

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ThermalArchitecture

Nothermallink(e.g.heatpipe)required

• Detectors
• FEE
• HVPS

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Optical Stability Analyses

UVandVUVTemperature Distribution Assumptions Temperature ofthe Protective Case:20°C IntegrationTemperature :24°C(i.e.DeltaT:4°C) PassiveOptomechanics LateralShifts /Distortions inthe Focal Plane Translatoric Displacement ofOptical Elements RotationofOptical Elements(MostCritical) ChangeofProperties i.e.Curvature andLineSpacing ofthe Gratings

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Optical Stability Requirements # Sensitivity ofOptical Elements

RZ RY RX TZ TY TX >40“ >40“ 9“ >100Em >100Em >100Em Prism 20“ 4“ 4“ >100Em >100Em >100Em Echelle Grating 5“ 5“ 20“ 10Em 10Em >100Em Focus Mirror 2“ 4“ >40“ 10Em 6Em >100Em Collimator >10“ 1“ >10“ 10Em >100Em 10Em Detector

LateralFocusShift of10EmatDetector Negligible DegradationofFocusSpot

LocalLateralandRotationalStabilityRequirements

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TradeOff ActiveAluminum Structurevs.Thermostable Structure

PhaseABaseline

ThermallyunstableAluminum structure 2criticalFocusMechanisms(CollimatorMirror,Echelle Grating)

Compensationofthermalgradients,temperaturechange,(drift) Multiaxesadjustmentwithveryhighaccuraciesrequired CriticalInOrbitOperationtofindbestfocusposition 2rotationaland1translatoric degreeoffreedom

1arcsec 2

• m

Repeatability 2arcsec 5

• m

Accuracy 20arcsec 200<m TravelRange RotationalAccuracy Translatoric Accuracy

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TradeOff ActiveAluminum Structurevs.Thermostable Structure

R x [E ra d ] R y [E ra d ] R z [E ra d ] >1 .8 0 .7 3 .3 E c h e lle G ra tin g >0 .5 >0 .7 9 .1 P ris m >1 .0 >1 .6 1 .8 1 .M irro r >2 .6 0 .1 3 .1 2 .M irro r >2 .1 >0 .9 3 .0 D e te c to r >1 1 .7 2 .4 >1 3 .5 F in e G u id a n c e D e te c to r 1 0 .9 6 .0 1 7 .5 F in e G u id a n c e M irro r >3 .5 >0 .7 2 .8 F in e G u id a n c e M irro r >4 .1 >4 .0 >6 .2 G ra tin g >1 .9 >0 .4 >4 .5 1 .M irro r >2 .8 >0 .8 >5 .2 2 .M irro r >3 .0 >2 .2 >5 .4 D e te c to r >4 .6 >0 .5 >4 .3 F in e G u id a n c e M irro r >3 .2 >0 .6 >4 .6 F in e G u id a n c e D e te c to r 0 .6 >0 .7 >8 .5 F in e G u id a n c e M irro r U V V U V

Thermostable CeSiC Structure IntegrationTemperature:24°C

RotationsofOpticalElements(wrt localinstrumentreferenceframes)

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OPTICALSTABILITYAnalyses # Results

Negligible LateralShift inthe Focal Plane:<20Em Acceptable Degradationwithout Active Alignment as Spectral Resolutioncomes with >80EmDistanceinDetector Plane ⇒ Required Spectral Resolutionwithout Active Control ofOptical Elements ⇒ ComplexCollimatorandEchelle GratingMechanismsSkipped!!

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Mechanism Design

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GreyFilterMechanism#Design

Demonstratorwith2Positions(PACS)

Functionality

Useofdifferentgreyfilters(neutraldensityandopaquefilter)

DesignPrinciple(PACSheritage)

Slidingcrankforaperturecover

Kinematics

TravelRange

360deg

Accuracy

10arcmin

MovingMass

0.2kg(filterandrotor)

Aperture

35x45mm(MCParea+margin) Mechanismmotordriveandequipment

Directdrive Torquer Motor(TTL) MagneticPositioning

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VacuumShutter– MechanismDesign

Functionality

Openingandclosingofdetectorhousinginvacuum

(Note:Nowindowapplicableduetoopticalperformance)

LeakageRate <10#9 mbar• dm³/sec

DesignPrinciple(ORFEUSheritage)

Slidingcrankforaperturecover

Kinematics

TravelRange 60mm Accuracy

±50Bm(equiv.20arcsec)

MovingMass <<1kg(aperturecover) Aperture

35x45mm(MCParea+margin) Mechanismmotordriveandequipment

SpurGearandWormGear StepperMotor(Phytron) Mechanicalendstops

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ServoMirror– MechanismDesign

Functionality

Servomirrorsteersmainbeamintoredundantdetector

Kinematics:

Translatoric movementofservomirror (40x50mm²) TravelRange

60mm

Accuracy

±50Bm(equiv.20arcsec)

MovingMass

100g(mirror) Mechanismmotordriveandequipment

SpurGearandWormGear StepperMotor(Phytron) Mechanicalendstops

StepperMotorwith nominaland redundantcoils Mirror Mechanicaljoint betweennominaland redundantMCP detector

MCPdetectorHousing Nominal MCPdetectorHousing Redundant

Beamdirection nominal Beamdirection redundant Spindle

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InOrbitCalibration

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InOrbitCalibration

MCPs

WellKnownTargetStars nearlyabsoluteradiancereferencewithhighstability&homogeneity Calibrationradiancepassingtheentiretelescopeandspectrometersoptics PhotoResponseNonUniformitybysimulationofphotonevents (builtinMCP

Detectorfunctionality)

DarkSignalNonUniformitybyclosureofopaquefilter(greyfiltermechanism) IFGS PhotoResponse NonUniformity =>not required DarkSignalNonUniformitybydarkareapointing

⇒ NoActiveinOrbitCalibration ⇒ ConceptQualifiedandSuccessfullyFlownonORFEUS

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ElectronicsandDetectors

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TypeofObservations

Standby/OFFwhileotherWSO>UVinstrumentswork AcquisitionofeitherUVESorVUVESsciencedata Sciencedata:Observationmodesanddatatypes FullFrametransfer(IntegrationMode)

spectralimagewith4096x4096Pixel

“Partialframetransfer”(Quicklook Mode)

user>definedpartofspectralimage

Eventtransfer(PhotoCountingMode)

X>,Y>Coordinates,Impulseheight,Timestamp

InstrumentCalibration(Ground/In>flight) InstrumentAlignment(Ground/In>flight) Test/Service/Maintenance

OFF SafeMode Test/Service Mode (Ground) In>flight Calibration/ AlignmentMode ScienceMode VUVES UVES VUVES VUVES UVES UVES

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Redundancy– SystemConcept

Resultofredundancyconcepttrade#off

Cross#switchfunctionforHIRDESpowersupplyanddatainterfacetoS/C CommoncontrolunitforUVESandVUVESspectrometer Coldredundancy Switchoverbyrelais commandincaseoffailureoccurrence

Includingcalibrationmeans x x UVESMCPDetector Includingcalibrationmeans x x VUVESMCPDetector Redundantelectrical I/F # x UVESIFGS Redundantelectrical I/F # x VUVESIFGS Includingtelemetry/HKsensors x x ICU Redundantcoilsandsensorsonly x x Mechanisms

Comments Redundant Nominal Subunit

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Systemarchitecture

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MCPDetector Subunits

FPA(main/red.) Front#endElectronics(main/red.) DetectorHousing(main/red.) VacuumShutter(main/red.) ServoMirrorMechanism

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MCPDetector – Specification

WavelengthRange UV

174.5..310.0nm

VUV

102.8..175.6nm

Totalgain

107e# /Photon

Pulseheightdistribution

FWHM<80%(TBC)

MCPporediameter

6Bm(TBC)

Openarearatio(OAR)

80%

Lengthtodiameterratio 80:1(firstandsecondsingleMCP) 40:1(thirdsingleMCP) Activearea

30x40mm

ReadoutMethod

WedgeandStripeAnode(WSA)

Photocathodematerial

CsI,CsTe Dependsonthewavelengthrange

Operationalpressure

<1*10#5mbar

Lifetimeonground

(TBD) (afterdelivery)

LifetimeinSpace

10years(TBC)

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MCPDetector – Designconcept

MCPdetectordesign

MCPassembly Z>configuration Integrationatmanufacturerfavored

(criticalhandlingduetooxygensensitivity,TBC)

Mesh Replacementby“wedged”firstmicrochannel

plate,TBC

Material,Design/Layoutequiv.toOrfeus WSA Design/Layoutequiv.toOrpheus

PotentialManufacturers

MCPstack

Hamamatsu,Proxitronic,Burle,…

WSA

IMTAG

MCPSEMimageshowingthemicro channels(Burle ElectroOptics,Inc.) Orfeus Wedge#and#StripeAnode(IAAT)

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MCPDetector – Roadmap

SimulationModelunderdevelopment(Matlab/Simulink;Mathcad)

Impulseheightdistribution AnodeCapacitance Outputsignalshape(WSA/CSA) Front#endelectronics(functionallevel) InstrumentSNR

Goals

Verificationofsensorperformance Selectionofcomponents(MCPtype,CSA,…) OptimizationofOperationalParameters

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MCPFrontEndElectronic– Specification

Functionality

Charge#to#voltageconversion Signalshapingandamplification Pulseintegritycheck(e.g.pileupdetection) ADconversion# 12Bit(14bitgoal) Centroid andpulseheightcalculation(seenextchapter) TransferofthesciencedatatotheICU Samplingrate:5MSPS(min)10MSPS(goal) Oversampling

>3x(TBC)

controlandmonitoringfunctionstotheICU(=master)

PerformanceSpecification

Signalamplification,Readoutnoise,DynamicRangewillbederivedfrom

MCPsimulation

PowerConsumption

<5W

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MCPFrontEndElectronic– DesignConcept

MCPFEEHousing

Local power distribution FEE Control

RS422

digitaldataprocessing (x,y,q)

(Sealed)MCPHousing

MCP detector

HVfeedtrough

1of4Analogchannels

Discharge &Baseline restore Pulse shaper ADC Control Logic Charge sensitive amplifier

analogdata

Temperature Sensor

HK>ADC

Vacuum Sensor LVfeedtrough

toHVPS

x1 x2 y1 y2

connector toICU

LVDSbuffer

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MCPFrontEndElectronic– Roadmap

Simulation

InputfromMCPsimulation/measurements ElectricalModel(e.g.PSpice)fordiscrete

components

Implementdifferentconceptsfor pulseidentification pile#updetection CSAreset Designevaluationofdifferentconcepts Performanceanalysis Concepttrade Optimizationofdesign

Breadboard Selectionofrealizationconcept

discretecircuit ASIC

• Selectionofcomponents

MCPFEEASICfromIMEC/FillFactory/KULeuven (ESA# ESTECGSTP)

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MCPDetector – Housing design

Vacuumcompartment

MCPassembly HVharnesstoMCP#stack LVharnesstoWSA

Ambientpressurecompartment

MCPfront#endelectronic

(dissipatingapprox.5W)

Vacuumshuttermotor

controlelectronics

EMIshieldbetweenFEE

andMotorControl Electronic

I/FtoICUandspectrometer

(alignmentandthermal control)

ICU S/C

CSA,PSA,ADC CSA,PSA,ADC CSA,PSA,ADC CSA,PSA,ADC ControllerElectronic

hν

M

ControlandHK DigitalI/O(control/data) FEEHousing Purgingvalve Mesh(TBC) SealedMCPHousing Shield Pressuresensor Temperaturesensor MCPAssembly FEE HVPowerSupply Vacuumshuttermotor Testimpulselectrodes CoatedsingleMCP

TC/TMand highspeedMCPdatalink LVPS LVPS ICU MIL>Bus

Motorcontrolelectronic VacuumShutter WSASignalGround

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MCPDetector– HousingDesign

Pressure<10#5 mbarvacuumorinertgas(N2) Envelope:14x12x10cm³ Wallthickness:3mm 50%ofvolumeforMCPassembly,feed

throughs,harness,… ServoMirrorMechanism Maindetector Redundantdetector

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IFGSDetector – Specification

IFGSdataforcompensationofspectralimagejitteron

theMCPdetectorsduetotelescopemovementduring exposure

• increasedHIRDESspectralaccuracy

Standardalgorithmfor2D– centroid calculation IdenticalIFGSDetectorsforUVandVUV

100pixels PossibleSpotshape X Y

Keyrequirements Detectorwavelengthrange

visible

Requireddetectorpixelsize

<=15Bm(10Bmgoal)

Numberofpixels

100x100(optional20x20window)

Framerate

>=1Hz

Programmableexposuretime0.1– 10sec(bright/faintstars) Centroid calculation

performedbyICU

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IFGS Detector – DesignTradeOff

CMOSvs.CCDdetector– Selectioncriteria

SensorSNR#>Simulationofdetectorchain

SNRsimulationresults

LimitedNumberofsignalelectrons(~incomingphotons)byFWCofCMOS

detectorduetohighdarkcurrentandhighintegrationtimes

Worst#caseSNRforfaintstarswith10secexposure:SNR=20 SNRimprovementbydetectorcooling(darkcurrentreduction)

AdvantagesofCMOSdetectorswrt HIRDESinstrumentdesign

Lowpowerdissipation Radiationhardnessbydesign Programmablefunctionslike windowing gain

• ffset

On#Chipdataconversion Easeonintegration(nodifficultbiasingortimingpattern) Costs

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IFGSDetector– DesignConcept

• IFGSI/F

internalFineGuidanceSensorUVES/VUVES

IFGSFPAControl

• Cypress/FillFactorySTAR1000CMOSdetector

localpower distribution IFGSFEE control Readoutcontrol (exposure,windowing,…) FixedPattern Noise(FPN) correction

PGA column amplifier x,y address decoder 2D> imaging array

connector ICUnominal connector ICUredundant RS422 (UART) LVDS buffer (serializer) LVDS buffer (serializer) RS422 (UART)

HK>ADC FPA Temperature sensor

10Bit ADC

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ICU– TechnicalSpecification

Scientificdataacquisition Instrument/Subsystemscontrolandmonitoringfunctionsincl.statussupervision Housekeepingdataacquisition Communicationprotocolofthe1553BMIL#Bus Telecommand andtelemetry(TC/TM)functions Selftestandfailuredetection,insulationandrecovery(FDIR)functions Softwaremaintenancefunctionsincl.softwaredownloadtoothercontrollers(if

applicable) Datatypes:

DataType Subtype Paramater DataFormat PhotonCount(Eventtransfer) X,Ycoordinate Impulseheight Timestamp X,Y:16Bit Q:8Bit T:24Bit Integration(FullFrametransfer) Pixel 4096x4096x16Bit Quicklook(PartialFrametransfer) Userdefined(compressed)pixel nx16Bit RawData Pixel 100x100x16Bit CorrectedImageData Pixel 100x100x16Bit CentroidData X,Ycoordinate Intensity X,Y:16Bit I:16Bit Telecommands AnalogorDigitalTC NumberofParametersTBD 32Bit(TBC) Telemetry AnalogorDigitalTC NumberofParametersTBD 32Bit(TBC) ControlData(internal) AnalogorDigitalTC NumberofParametersTBD 32Bit(TBC) MonitoringData(internal) AnalogorDigitalTC NumberofParametersTBD 32Bit(TBC) ScienceData IFGSData

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ICU– „Excerpt“ofDataBudget

HIRDESsciencedataratetohighforreal#timedatatransfertoS/Cif, ObservationofBrightstars PhotonCount(EventTransfer) Otherobservationmodes:TransferofScienceDataafterintegration/compressioninto

S/C

• “Designdriver”forICUarchitecture

Interface/Unit DataFormat ExposureTime (Durationofacquisitioncycle) Dataper Acq.Cycle TransfertoS/C viaMIL#Bus PhotonCount(EventTransfer)

• VUVES

110sassumingan incomingflux10>11erg/cm²/sec/A Photonrate327.000cts/sec 274MB 3075s Intermediatestorage required! UVES 250sassumingan incomingflux10>11erg/cm²/sec/A Photonrate208.000cts/sec 397MB 4446s Intermediatestorage required!

• VUVES

11000sassumingan incomingflux10>13erg/cm²/sec/A Photonrate5.000cts/sec; 420MB 4702s UVES 26000sassumingan incomingflux10>13erg/cm²/sec/A Photonrate1.500cts/sec 298MB 3335s Integration(FullFrameTransfer) 4096x4096x16Bit seeabove 32MB 356s Quicklook(PartialFrameTransfer) nx16Bit seeabove 1.6MBW/C approx.16sW/C X(16Bit),Y(16Bit), Q(8Bit),t(24Bit)

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ICU– DesignConcept

internalMass Memory

S/C

MemoryWriteController

LVDS Receiver LVDS Receiver LVDS Receiver LVDS Receiver MCP UVES MCP VUVES IFGS UVES IFGS VUVES

MemoryReadController

HKADC

2x20kB SDRAM (FlipBuffer) 672MB SDRAM (FIFO) 2x32MB SDRAM (FlipBuffer) 2x32MB SDRAM (FlipBuffer)

Localtime

dataselection DPUdata I/F

DPU (includinginstrument controlfunction) MILBus 1553B Controller

memory accessctrl memory accessctrl

RS422

HVPS LVPS Greyfilter mechanism Vacuumshutter/ Mirrormechanism S/C MCP UVES MCP VUVES IFGS UVES IFGS VUVES

RS422 RS422 RS422 3x RS422 RS422 RS422 RS422 RS422

memory accessctrl memory accessctrl memory accessctrl memory accessctrl

toMemory Write Controller MIL>Bus 1553B

Bus arbitration from LVPS

Power

LUT (compression/ encoding)

S/C sync

localpower distribution toSubunits (seesystemarchitecture)

Power I/O extension

Image Builder memory accessctrl memory accessctrl Image Builder x,y,q+t

iFGS>LUT (x,ycorrection)

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ICU– DesignConcept

DataProcessingUnit

Mosaic20DPUfromAstrium DSPTSC21020Eclockedat20MHz 128Kx48bitprogrammemory 128Kx40bitdatamemory

• ptionalDataMemoryBusExtension

SpacequalifiedDPU ICU LVPS ExternalElectronicsPanel

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LVPSTechnical Specification

15voltagestoSubunits ICU MCP(UVESandVUVES) IFGS(UVESandVUVES) MotorControlElectronics PreventionofS/CpowererrorstopropagateintoHIRDESinstrumentandviceversa RelaycommandtoswitchbetweenHIRDESpowerinterfacefromS/Cinterface RelaycommandtotheS/C(“TurnLVPSON/OFF”)

70 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

LVPSDesignConcept

NominalSystem

EMI Filter LowVoltage Converter LatchingInput CurrentLimiter LVPScontrol RS422 poweroutput

Crossswitch (+27V)

EMI Filter LowVoltage Converter LatchingInput CurrentLimiter LVPScontrol RS422 poweroutput HKADC HKADC 15output voltagesto 7sub>units toICU toICU

RelaisCommands: >CrossSwitchLVPS >LVPSNomON >LVPSRedON >HVPSNomON >HVPSRedON >ICUReset

+27V_Nom 27V_Nom_RTN +27V_Red 27V_Red_RTN S/C

RedundantSystem

feedthroughofrelaiscommands >HVPSNomON >HVPSRedON >ICUReset

toICU/ HVPS

RelaisCommand CrossSwitchLVPS RelaisCommand LVPSNomON RelaisCommand LVPSRedON to HVPS (Red) to HVPS (Nom)

15output voltagesto 7sub>units

71 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

HVPSTechnical Specification

16outputvoltagestothe MCPAssemblyUVES MCPAssemblyVUVES interlocktopreventtheMCPfromdestructionduetofalseoperation PreventionofS/CpowererrorstopropagateintoHIRDESinstrumentandvice

versa

RelaycommandtotheS/C(“TurnHVPSON/OFF”)

72 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

HVPSDesignConcept

pressuresensor

NominalSystem

EMI Filter HighVoltage Converter LatchingInput CurrentLimiter HVPScontrol EMI Filter HighVoltage Converter LatchingInput CurrentLimiter HVPScontrol HKADC HKADC

RelaisCommands: >HVPSNomON >HVPSRedON

+27V_Nom 27V_Nom_RTN +27V_Red 27V_Red_RTN LVPS

RedundantSystem

RelaisCommand HVPSNomON RelaisCommand HVPSRedON

toMCP’s

pressuresensor

RS422 poweroutput RS422 poweroutput 16outputvoltages toMCPdetectors toICU toICU toMCP’s 16outputvoltages toMCPdetectors

Budgets

74 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

Mass&PowerBudget

# 29.8/31.1

UV/VUVSpectrometer

Alternateoperation 2.7 2.6/2.6

UV/VUVIFGS

81.1(<150) 151.2(<155)

Total

13.5 25.2

Margin(20%)

67.6 126

Subtotal

53.7 10.3

ExternalElectronics

5 4

HVPS

Alternateoperation 6.2 22.8/22.8

UV/VUVDetector Comments Power[W] Mass[kg] Subsystem

PowerBudget:

• Nominalmode(=ScienceMode)
• Peak Power:119W

Design,Development andVerification Plan

76 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

ModelPhilosophy

Breadboarding: > MCPstacksandFEE > Mirror/Grating/Coatingdemonstrator>tbc STM: > UV/VUVStructureswiththermomechanical dummiesfor electronics,mechanisms,detectors; EQM: > Mechanisms,MCP/CMOSDetectors,Electronics PFM: > FullFlightHardwarewithrefurbishedSTM FS: > Repairkitsforcriticalitems(bearings,etc.) > MCPSparemodels(UV,VUV)>>refurbishedEQM > IFGSDetectorSparemodels>>refurbishedEQM > MechanismsSparemodels>>refurbishedEQM

77 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

PreliminaryRiskAssessment(toprankingrisks)

ExtensivetechnologyprogramsperformedbyECM (ESAcontract) QualificationtobeperformedinphaseB Potentialfallback:SpacequalifiedC/SiC (Astrium F); butnotconsideredforbaselineapproach Technicalriskdueto missingspace qualification Structural materialsand Hybrid Structure (CeSiC;Invar, QuartzGlas) SelectionofexperiencedCMOSdeveloper(Fill Factory) AdequateSubcontractorcontrol; Scheduleriskdueto customizedCMOS development IFGS Selectionofexperiencedstacksdeveloper (Hamamatsu);coating facilities,etc.) UseofFEEheritagepartlyavailableatIAAT EarlyMCPprocurement&breadboarding Scheduleriskdueto customizedMCP developmentand technicalrisks(quantum efficiency;Coatings) MCP

RiskMitigationStrategy RiskType Element

78 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

WBS PhaseB1Bridging

HIRDESPhaseB1 Bridging IAAT

Engineering 3000 Product Assurance 2000 ManagementOffice 1000

ProjectOffice 1100IAAT Product Assurance 2100KT ProjectOffice 1200ISAS ProjectOffice 1300KT Electrical Engineering 3600KT Structural/Thermal Engineering 3500KT Mechanical Design 3400KT Optical Engineering 3300KT Configuration andIFEngineering 3200KT SystemEngineering 3100KT

PhaseC/D Programmatics

4000 DDVPlanand Costs 4100KT AITEngineering 3700KT

HIRDESPhaseB1 Bridging IAAT

Engineering 3000 Product Assurance 2000 ManagementOffice 1000

ProjectOffice 1100IAAT Product Assurance 2100KT ProjectOffice 1200ISAS ProjectOffice 1300KT Electrical Engineering 3600KT Structural/Thermal Engineering 3500KT Mechanical Design 3400KT Optical Engineering 3300KT Configuration andIFEngineering 3200KT SystemEngineering 3100KT

Breadboarding 4000

MCP 4100KT AITEngineering 3700KT MCPDetector Support 4100KT

79 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

ProjectDevelopment Scheme # PhaseB1Bridging

EvaluationofSystemRequirements andSystemSpecification SystemRequirements Review Engineering Electrical Structural andThermal Optical AIV Mechanisms Detectors (MCP,IFGS) InterfacestoS/C MCPBreadboarding (Stacks,coating,QE) FinalPresentation Review

80 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

B1Bridging/B2/C/D/EMasterSchedule# HIRDES

81 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

HIRDESSchedulePlanning – MeetingsandMilestones

PhaseB1Bridging (03.07.06#29.12.06) KoM (Virtual date)

03.07.2006 KT

SRR

15.09.2006 IAAT

FP

20.12.2006 DLR

PhaseB2(15.03.07#28.09.07) KoM

15.03.2007 KT

PDR

17.09.2007 DLR

PhaseC/D(01.10.07#28.10.2010) KoM

01.10.2007 KT

DRB(EQM/STMDelivery)

02.09.2008 KT

CDR

22.09.2008 KT

TRR

19.08.2009 KT

FAR(PFMDelivery)

27.01.2010 KT

Launch

(28.10.2010) >

ContingencyplanningforPFMMAIT:8weeks

82 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

Documentation

83 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

PreliminaryICD(mechanical,electrical,optical,S/W)andBudgets(mass,power,data) PreliminaryOpticalPerformanceAnalyses;Spectrometer Layout; FinalDocumentation(FinalReport,DocumentControlSheet) PhaseB2,C/DCostAssessment DDVPlan(Implementationplanning,ModelPhilosophy,VerificationAnalyses/Tests,Schedule, DeliverableItems) PreliminaryPAPlan PreliminaryS/WArchitectureandS/WImplementationPlan PreliminaryDesignDescription(Mechanics,Electronics,Mechanisms,Detectors,Thermaland StructuralAnalyses)

PhaseB1Documentation

84 HIRDESFinalPresentation;05.04.2006,DLR HIRDES

MCPStack RFQ IFGSDetector Requirements Specification MCPRequirements Specification InstrumentRequirements Specification

PhaseB1– Internal Documentation