Energy Efficient PFC Reduction Technologies and other Energy Saving - - PowerPoint PPT Presentation

Energy Efficient PFC Reduction Technologies and other Energy Saving Solutions

Andreas Neuber

Head Fab Environmental Solutions, Applied Materials AGS/EPG/FES

Executive summary

• Today, carbon footprint reduction is a task that involves reducing both

direct (scope 1) and indirect (scope 2) emissions in manufacturing.

• This presentation shows how the following can be achieved:

– Assess and subsequently reduce carbon footprint in general and GHG emissions specifically. – Provide the necessary data and easily compile reports in compliance with current EPA reporting regulations.

• The focus of the presentation is to demonstrate that GHG emissions,

as well as power and other resource consumption, can be substantially reduced even for existing fabs.

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Direct and indirect emissions

Direct emissions (scope 1) in a semiconductor fab

Stationary Combustion Process Emissions Fugitive Emissions

• Central boiler
• VOC abatement
• Local scrubber (burn

type)

• Emissions released during

the manufacturing process (e.g., F-GHG, N2O, and ammonia)

• Unintentional release of

GHG from sources including chillers

Note: Mobile combustion is not used much in a fab

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Process emissions: F-GHG

Source: World Semiconductor Council (WSC)

Power: 1.1 kWh/cm2 Si Total semiconductor industry 8.1 GW (fabs only) Assume 0.510 kgCO2e/kWh 36.2 MMTCE (scope 2) 2014 WSC PFC CONSUMPTION AND EMISSIONS DATA

(New gases include CH2F2, C4F6, C3F8, and C4F8O) 5

ITRS facilities technology requirements (Table ESH5)

Year of Production 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 FACILITIES DESIGN Facilities Design Meet established goal and metrics Meet established goal and metrics WATER Total fab* water consumption (liters/cm2) [1] 300mm/450mm fabs

7.8

7.8 7.3 7.0 6.4 6.4 5.8 5.5 5.5 5.3 5.0 5.0 5.0 4.6 4.6 4.6 200mm fabs

7.6

7.6 7.0 6.4 5.8 5.8 5.0 4.8 4.8 4.3 4.1 4.1 3.9 3.5 3.5 3.5 Total UPW consumption (liters/cm2) [1]

6.5

6.5 6.5 6.0 6.0 6.0 5.0 5.0 5.0 4.5 4.5 4.5 4.5 4.5 4.5 4.5 Site water recycled/reclaimed** (%

• f use)

50%

50% 60% 60% 70% 70% 70% 75% 75% 75% 80% 80% 80% 90% 90% 90% ENERGY (ELECTRICITY, NATURAL GAS, ETC.) Total fab energy usage (kWh/cm2) Non EUV

1.0

1.0 1.0 0.9 0.9 0.9 0.8 0.8 0.8 0.7 0.7 0.7 0.6 0.6 0.6 0.6 EUV

1.1

1.1 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 WASTE Hazardous waste (g per cm2) [1] 8.0 7.5 7.2 7.2 7.2 7.2 6.5 6.5 6.5 6.0 6.0 6.0 AIR EMISSIONS Volatile Organic Compounds (VOCs) (g per cm2) [1] 0.060 0.055 0.050 0.050 0.050 0.050 0.045 0.045 0.045 0.045 0.045 0.045

Fluorinated greenhouse gases, fluorinated heat transfer fluids, and nitrous oxide Normalized emission rate (NER) to be 0.22 kg CO2 equivalent/cm2 by 2020

• - as agreed by (WSC)

Normalized emission rate (NER) to be 0.22 kg CO2 equivalent/cm2 by 2020 - - as agreed by World Semiconductor Council (WSC) Normalized emission rate (NER) <0.22 kg CO2 equivalent/cm2

Manufacturable solutions exist, being optimized Manufacturable solutions known Manufacturable solutions are NOT known

2

Energy consumption

1

Air emission: GHG, NOx, VOC

2 1

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Abatement for GHG: F-GHG and N2O

• Reduction of GHG is very important, but it also must be energy

efficient

• BKM recipe for poly etch
• Note: Some recipes with small F-GHG flows at low GWP can even

show negative effects, i.e. consume more energy during abatement than the reduction of GHG is contributing

F-GHG reduction in kgCO2e/yr 102,908 Standard with idle mode control A Burn-Wet 6,645 5,440 B Burn-Wet 9,384 6,872 C Plasma-Wet 16,504 13,485 Abatement consumption in kgCO2/yr

7

Energy and resource savings

Energy consumption: energy is wasted

Fab Energy Consumption Wafer Starts

Source: ISMI

Energy consumption does not track fab utilization.

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Equivalent energy consumption fabwide according to SEMI S23

Power 52% Exhaust 14% Heat 7% CDA 5% N2 6% Hot UPW 4% PCW 6% UPW 6%

Manufacturing use actually 71% of energy in a fab!

SEMI S23 -> equivalent power consumption

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Pareto Analysis

0.0% 5.0% 10.0% 15.0% 20.0% 25.0% 30.0% 35.0% 40.0% 45.0% 50.0%

Key system drivers

0.0% 2.0% 4.0% 6.0% 8.0% 10.0% 12.0%

Key component drivers Vacuum pumps + local abatement

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Actual opportunities to reduce energy use

Manufacturing tool

Dry pumps Local scrubber Heater Local chiller RF generator Laser

Remote plasma clean

Turbo & cryo pumps O3 generator Non process pumps Mini-Env. +

• ther blowers

Ultrapure water Nitrogen Compressed air Process cooling water Process exhaust

Other process gases

Process chemicals Precursor Specialty waste disp. Others

Subfab components Process support systems

Hot ultrapure water Cleanroom VOC Chiller Cooling tower

General waste treatment Make-up air handling

Other air handing Life safety Mechanical Others

Infrastructure systems

Exhaust treatment

Low hanging fruit High hanging fruit Interface

• pportunities

Green mode

• pportunities

Innovation RTP FCVD CMP vs. SOG Green mode capabilities, Improvements in subfab components Normally already

• ptimized

Normally already

• ptimized

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Best practices – energy savings in subfab

BACKGROUND

• Operating costs in the subfab have

been systematically reduced over the last few years. Sometimes this has caused process issues, such as clogging, when purge flows have been selected as too small. SOLUTION

• Align subfab operation to process, which

requires communication of process status to subfab components, specifically dry pumps and abatement (e.g., purge can be reduced without any risk to process when only inert gases are flowing from the process). Two modes will be distinguished (Source: SEMI S23, E167/2) 1. Idle mode (hot standby mode): 2. Sleep mode:

idle mode — The condition where the equipment is energized and readied for process mode (all systems ready and temperatures controlled) but is not actually performing any active function such as material movement or

• processing. (refer to SEMI S23)

sleep mode — the condition where the equipment is energized but it is using less energy than in idle mode. The sleep mode is primarily differentiated from idle mode in that it is initiated by a specific single command signal provided to equipment, either from an equipment actuator, from an equipment electric interface, or a message received through factory control software (e.g. SECS). Other than the possible initiation of the sleep mode by an equipment actuator, entry into the sleep mode does not require manual actions. (refer to SEMI S23)

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PROCESS CHAMBER

Deposition (SiH4) Clean (NF3) Deposition (SiH4) Clean (NF3)

Synchronizing subfab matches energy need to

• peration

Energy Savings Energy Savings ABATEMENT ENERGY VACUUM PUMP ENERGY

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Subfab equipment operation synchronized with process to save energy.

iSYS 2.0 system overview

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Multiple Pumps Abatement(s) Tool Ethernet Cable Dry Contact Cables Remote IO Ethernet Cable iSYS 2.0 QUAD Rack with Controllers Remote IO Modules 24V DC

Requirements for dry pumps

• Pump purge and pump speed shall be synchronized with process.
• Requirements: Idle mode

– Pump shall allow for multiple (two or three) purge N2 set points depending on type of gases coming from process. – Note: VFD changes require sleep level information since frequent acceleration/decceleration cycles would even increase power consumption.

• Requirements: Sleep mode

– Pump shall allow for a lower N2 mode as well as one or more levels of reduced speed with a known and guaranteed wake-up time, e.g. to restabilize temperatures.

• Requirements: Communication

– Pump shall be able to receive idle and sleep mode signals via dry contacts or other fail safe communication, e.g. Ethernet with Heartbeat signal. – When the signal is interrupted the pump shall go automatically in a safe operating mode. – The pump shall maintain the interlock signals to the tool, but shall not send alarms to the tool, when the reason for the deviation is the idle/sleep mode itself. – Pump shall provide hand shake signals to indicate when they are in a certain saving (green) mode. This will allow accurate recording of achieved savings and several checking functions, but is not available today.

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Requirements for Abatement

• Abatement operation shall be synchronized with process.
• Requirements: Idle mode and several levels of processing mode depending on

the gas type flowing at how many chambers.

– Abatement shall allow for multiple oxidising, scrubbing, and purge set points depending on type of gases coming from process, – Note: Thermal wet abatement maintains the same temperature. Savings are achieved via less gas flowing to the reactor,

• Requirements: Sleep mode

– Abatement shall allow for an lower resource using modes with a known and guaranteed wake-up time, e.g. to restabilize temperatures. Especially to be used for thermal wet abatement systems

• Requirements: Communication

– Abatement shall be able to receive idle and sleep mode signals via dry contacts or other fail safe communication, e.g. Ethernet with Heartbeat signal – When the signal is interrupted the abatement shall go automatically in a safe operating mode – The abatement shall maintain the interlock signals to the tool, but shall not send alarms to the tool, when the reason for the deviation is the idle/sleep mode itself – Abatement shall provide hand shake signals to indicate when they are in a certain saving (green)

• mode. This will allow accurate recording of achieved savings and several checking functions, but is

not available today.

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iSystem energy/utility savings

Pump utilities Pump purge N2 Power PCW Abatement utilities Fuel gas Oxidizer (O2, CDA, Air) Power Purge gas (N2, CDA) PCW Water Caustic

Foreline

Secondary line heater power Post pump purge Heat load To subfab

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Computer based monitoring/modelling

• f F-GHG+N2O emissions

F GHG and N2O Reporting

Monitoring of gas flows Monitoring of abatement availability Abatement performance information Conversion efficiencies in tool Emission estimate

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BASIC CALCULATON MODEL

Abatement and Subfab Monitoring

• Monitor gas consumptions and abatement status

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Recordings/Reports

• Abatement on/off times and accumulative gas flows for current day,

week, and/or month.

• Process maintenance due dates.
• Flows for all chambers for all manufacturing equipment.
• PFC gas removal configured via DRM table.

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Analyze long term trends, weekly, monthly, yearly averages

• Task: Visualize data

Total 1 year

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Database

Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor Will Contribute Approx. Factor CF4 3 1 1 1 3 1 1 1 CHF3 2 3 1 1 2 1 1 1 CH2F2 2 1 3 1 1 1 1 1 CH3F 2 1 1 3 1 1 1 1 C2F6 2 1 1 1 3 1 1 1 c-C3F6 2 1 1 1 1 3 1 1 C3F8 2 1 1 1 1 1 3 1 c-C4F8 2 1 1 1 1 1 1 3 COF2 1 1 1 1 1 1 1 1 CO2 1 1 1 1 1 1 1 1 CO 1 1 1 1 1 1 1 1 NF3 2 1 1 1 1 1 1 1 N2O NO2 NO N2 SF6 1 1 1 1 1 1 1 1 SO2F2 1 1 1 1 1 1 1 1 SO2 H2S CH4 1 1 1 1 1 1 1 1 C2H6 1 1 1 1 1 1 1 1 C3H8 1 1 1 1 1 1 1 1 TEOS 1 1 1 1 1 1 1 1 NH3 H2 O2 O3 F2 1 1 1 1 1 1 1 1 HF 1 1 1 1 1 1 1 1 Ar He no unlikely 1 likely 2 highly likely 3 CF4 CHF3 CH2F2 CH3F C2F6 c-C3F6 C3F8 c-C4F8

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Potential output

• GHG emission per gas
• Configurations possible

– Per stack - compare with stack measurements – Per process area

• Can be combined with tool energy measurement to provide actual

carbon footprint impact

Gas no Gas GWP 1 CF4 6,500 2 CHF3 11,700 3 CH2F2 550 4 CH3F 150 5 C2F6 9,200 6 c-C3F6 17,340 7 C3F8 7,000 8 c-C4F8 10,000 9 COF2 1 10 CO2 1 11 NF3 16,800 12 N2O 310 13 SF6 23,900

Optional stack locations

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Overall Impact Assessment

5–20% of local scrubber water consumption 5–20% reduction

• f subfab power

consumption (equivalent power) 5–20% reduction of NOx, VOC, direct and indirect CO2 emission

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