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Electronics Thermal Simulation – Trends, Implications, & Software Requirements
Ruben Bons, Director – Electronics, CD-adapco
Agenda
- 1. Trends & inherent
design challenges.
- 2. Simulation software
Electronics Thermal Simulation Trends, Implications, & Software - - PowerPoint PPT Presentation
Electronics Thermal Simulation Trends, Implications, & Software - - PowerPoint PPT Presentation
Electronics Thermal Simulation Trends, Implications, & Software Requirements Ruben Bons, Director Electronics, CD-adapco Agenda 1. Trends & inherent design challenges. 2. Simulation software requirements IC Trends : Moores
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IC Trends: Moore’s Law
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IC Trends: Moore’s Law
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IC Trends: Other Areas Following Moore’s Law
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IC Trends: Power Density and Moore’s Law
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IC Trends: Stacked Die Chips
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Electrification Trends: Automotive
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Electrification Trends: Automotive HEV/EV
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Electrification Trends: Automotive Power Electronics
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Electrification Trends: More Electric Aircraft
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Electrification Trends: Marine
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Thermal Simulation Software Requirements
- 1. Complex geometry
- 2. Coupled multiphysics
- 3. Cluster / cloud
computing
- 4. Automation
- 5. Process-centric
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- 1. Complex geometry
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Complex Geometry in STAR-CCM+
3D-CAD CAD import Surface repair Surface wrapper Polyhedral mesh Trimmed mesh JAVA scripting
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- 2. Coupled Multiphysics
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Coupled Multiphysics in STAR-CCM+
Flow & heat transfer (CFD)
Stress Fluid- structure interaction Acoustics Batteries Electro- magnetics Turbo- machinery Multi-phase Phase change Particle modeling Combustion
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- 3. Cluster / Cloud Computing
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Cluster / Cloud Computing in STAR-CCM+
2 4 6 8 10 12 14 16 50 100 150 200 250 Speed-Up # Cores
STAR-CCM+ Ideal
Scalable to 1000’s of cores. Windows & Linux Client / Server architecture Licensing
– Power Session – Power on Demand – Power Tokens
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- 4. Automation
Geometry Mesh Conditions Solve Results
Geometry Mesh Conditions Solve Results
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Automation in STAR-CCM+
STAR-CCM+ Server STAR-CCM+ Java
Geometry Mesh Conditions Solve Results
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- 5. Process-Centric
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Simulation Process in STAR-CCM+
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