Electronics Thermal Simulation Trends, Implications, & Software - PowerPoint PPT Presentation

Jan 28, 2024 •952 likes •1.21k views

Electronics Thermal Simulation Trends, Implications, & Software Requirements Ruben Bons, Director Electronics, CD-adapco Agenda 1. Trends & inherent design challenges. 2. Simulation software requirements IC Trends : Moores

Electronics Thermal Simulation – Trends, Implications, & Software Requirements Ruben Bons, Director – Electronics, CD-adapco
Agenda 1. Trends & inherent design challenges. 2. Simulation software requirements
IC Trends : Moore’s Law
IC Trends : Moore’s Law
IC Trends : Other Areas Following Moore’s Law
IC Trends : Power Density and Moore’s Law
IC Trends: Stacked Die Chips
Electrification Trends: Automotive
Electrification Trends: Automotive HEV/EV
Electrification Trends: Automotive Power Electronics
Electrification Trends: More Electric Aircraft
Electrification Trends: Marine
Thermal Simulation Software Requirements 1. Complex geometry 2. Coupled multiphysics 3. Cluster / cloud computing 4. Automation 5. Process-centric
1. Complex geometry
Complex Geometry in STAR-CCM+ CAD Surface Surface Polyhedral Trimmed JAVA 3D-CAD import repair wrapper mesh mesh scripting
2. Coupled Multiphysics
Coupled Multiphysics in STAR-CCM+ Stress Fluid- Combustion structure interaction Particle Acoustics modeling Flow & heat transfer (CFD) Phase Batteries change Electro- Multi-phase magnetics Turbo- machinery
3. Cluster / Cloud Computing
Cluster / Cloud Computing in STAR-CCM+ 16 STAR-CCM+ 14 12 Ideal Speed-Up 10 8 6 4 2 0 0 50 100 150 200 250 # Cores Scalable to 1000’s of cores. Windows & Linux Client / Server architecture Licensing – Power Session – Power on Demand – Power Tokens
4. Automation Geometry Mesh Conditions Solve Results Geometry Results Mesh Solve Conditions
Automation in STAR-CCM+ Geometry Mesh Conditions Solve Results STAR-CCM+ Java STAR-CCM+ Server
5. Process-Centric
Simulation Process in STAR-CCM+
Thank you! Ruben Bons +1 (760) 536-8122 ruben.bons@cd-adapco.com

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