DIAKOPTIC ANALYSIS OF COMPLEX 3-D ELECTROMAGNETIC SYSTEMS 1 School - - PowerPoint PPT Presentation

diakoptic analysis of complex 3 d electromagnetic systems
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DIAKOPTIC ANALYSIS OF COMPLEX 3-D ELECTROMAGNETIC SYSTEMS 1 School - - PowerPoint PPT Presentation

A.R. Djordjevi 1 , D.I. Ol an 1 , B.M. Kolundija 1 , J.R. Mosig 2 , I.M. Stevanovi 3 DIAKOPTIC ANALYSIS OF COMPLEX 3-D ELECTROMAGNETIC SYSTEMS 1 School of Electrical Engineering, University of Belgrade, Serbia 2 Ecole Polytechnique


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SLIDE 1

DIAKOPTIC ANALYSIS OF COMPLEX 3-D ELECTROMAGNETIC SYSTEMS

1School of Electrical Engineering, University of Belgrade, Serbia 2Ecole Polytechnique Fédérale de Lausanne, Switzerland 3Freescale Semiconductor, Geneva, Switzerland

A.R. Djordjevi1, D.I. Olan1, B.M. Kolundžija1, J.R. Mosig2, I.M. Stevanovi3

COST Action IC0603 Workshop Cyprus, April 2008

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SLIDE 2

Contents

Present status of research and software

development

Plans for future work Collaboration among universities and STSMs

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SLIDE 3

Diakoptics

Split the original system into smaller nonoverlapping

subsystems

Solve each subsystem individually Combine partial solutions to obtain the solution of

the whole system

Diakoptic approach is based on

surface integral-equation (SIE) formulation equivalence theorem (Huygens’ Principle)

Diakoptic surface integral equation (DSIE)

formulation

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SLIDE 4

DSIE efficacy

One outer subsystem (for open systems) and

K congruent inner subsystems

The total number of ports for the circuit is KM Brute-force solution, using tableau system of

equations, with total of 2KM unknowns

More sophisticated solution results in KM

unknowns

If topological elimination is used, then the

solution time is negligible

Nesting

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SLIDE 5

DSIE efficacy

Assumptions/conditions:

matrix inversion time dominates K congruent subsystems, each with N unknowns 2M unknowns for each diakoptic surface

Total number of unknowns for circuit solution: KM Efficient when overhead is small (M<<N) Storage reduction =1 for closed systems, =2 for open systems

2 2 2 SIE DSIE

) ( ) ( ) ( KM M N KN m m s

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SLIDE 6

3 3 3 SIE DSIE

) ( ) ( ) ( KM M N KN t t a

  • DSIE efficacy

Acceleration

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SLIDE 7

DSIE applications so far

2-D electrostatic problems with piecewise-

homogeneous dielectrics

3-D electrostatic problems with piecewise-

homogeneous dielectrics

2-D quasi-static and dynamic problems

(TM,TE) with piecewise-homogeneous media

3-D dynamic problems with piecewise-

homogeneous media NEW

new results

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SLIDE 8
  • 2

2 4 6

  • 2

2

  • 2

2 x [m] y [m] z [m]

3D electrostatics: 2 cubes

Two metallic cubes

Original system Outer subsystem Inner subsystems

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SLIDE 9

3D electrostatics: potential

Potential (verification)

Original system Outer subsystem Inner subsystems

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SLIDE 10

3D electrostatics: DSIE performance

200 400 600 800 1000 1200 1 2 3 4 5 6

[%]

M

200 400 600 800 1000 1200 1 2 3 4 5 6

a M

200 400 600 800 1000 1200 0.0 0.5 1.0 1.5 2.0 2.5

s M

Error Acceleration Storage reduction

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SLIDE 11

3D electrostatics: diakoptic surfaces

Metallic spheres with dielectric coating Diakoptic surfaces can be arbitrary; they

need not touch each other

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SLIDE 12

Metallic patches

  • n dielectric

substrate

Diakoptic surfaces

penetrate into dielectric

3D electrostatics: diakoptic surfaces cut the structure

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SLIDE 13

Metallic plates (scatterers) in dielectric cubes

3D dynamic: simple scatterer

  • 1.00 -0.75 -0.50 -0.25 0.00

0.25 0.50 0.75 1.00

  • 18
  • 16
  • 14
  • 12
  • 10
  • 8
  • 6
  • 4
  • 2

Real MoM-SIE Imag MoM-SIE Real DSIE Imag DSIE

z - coordinate Js [mA/m]

  • 20 -15 -10 -5

5 10 15 20 25 30 35 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2

y [mm] Ez [V/m]

MoM-SIE DSIE

Current distribution Near field

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SLIDE 14

3D dynamic: simple scatterer

40 80 120 160 200 240 280 320 360 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 3.25

[deg] /

2

MoM-SIE DSIE

Radar (monostatic) cross section (RCS)

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SLIDE 15

3D dynamic: complex scatterer

Metallic cubes (1250)

One cluster Outer subsystem One inner subsystem

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SLIDE 16

Complex scatterer: MoM vs. DSIE

RCS

40 80 120 160 200 240 280 320 360

  • 50
  • 40
  • 30
  • 20
  • 10

10

[deg] /

2 [dB] DSIE MoM-SIE

30 60 90 120 150 180

  • 30
  • 25
  • 20
  • 15
  • 10
  • 5

5 10 15

[deg] /

2 [dB] DSIE MoM-SIE

7 . 39

  • a

5 . 30

  • s

s 557 24

SIE

t s 619

DSIE

t GB 6 . 3

SIE

m MB 59

DSIE

m

  • cut
  • cut
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SLIDE 17

3D dynamic: patch antenna array

Patch antennas (cookies)

  • 180
  • 120
  • 60

60 120 180

  • 50
  • 40
  • 30
  • 20
  • 10

10

[deg]

g [dB] ( = 0)

  • Int. Acc. 0
  • Int. Acc. 2
  • Int. Acc. 4
  • Int. Acc. 6
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SLIDE 18

3D dynamic: 10 x 10 array

Patch antennas (cookies)

congruent subsystems

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SLIDE 19

771.9 93.0 6 000 82 200

  • 617.5

92.5 4 860 66 582

  • 349.8

91.7 3 840 52 608

  • 228.1

90.3 2 940 40 278

  • 142.3

87.5 2 160 29 592

  • 107.0

81.6 1 500 20 550

  • 51.1

68.7 960 13 152

  • 21.4

43.5 540 7 398

  • 11.8

13.7 240 3 288

  • Acceleration

Storage reduction Coefficients DSIE Coefficients MoM-SIE Array

Patch arrays: DSIE vs MoM

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SLIDE 20

Future work

Evaluation for arbitrary 3D dynamic problems

and comparison with other techniques, STSM (Belgrade, Lausanne, Louvain, Barcelona)

antennas, large arrays printed circuits, microwave devices

Fully incorporate the diakoptics into existing

software based on MoM-SIE (Wipl-D)

subdomain and entire-domain basis functions

Software implementations of DSIE on

clusters and parallel-processing computers