SLIDE 10 8/5/2010 10
Applying Autonomics to Create an Intelligent, Ubiquitous Environment Slide 19
Fabrication Fabrication of PI
- f PI-based electrode process
based electrode process
- Fig. 1. A schematic overview of polyimide based electrode process. (a) Sacrificial layer (Al). (b) Polyimide for 1st layer
spin-coating and patterning. (c) Metallization (Ti/Au). (d) Polyimide for 2nd layer spin-coating and patterning. (e) peel-off the polyimide base electrode. (f) Connector connection. Sacrificial layer Al layer - 1000Å 1st polyimide layer 3000rpm - 30sec soft baking 95℃ - 3min UV exposure 150mJ/㎠ PEB 95℃ - 3min Develop & rinse Developer : 5min (soak) dry N2 blowing metal deposition Ti : 500Å, Au : 2500Å metal patterning 3500rpm - 30sec (AZ1512) soft baking 95℃ - 1 min UV exposure 150mJ/㎠ develop 1 min metal patterning Au etching - HCl: HNO3=3:1 Ti etching - H2O: HF: HNO3 = 50:1:1 Removal PR Acetone - 3min
Applying Autonomics to Create an Intelligent, Ubiquitous Environment Slide 20
Platinum Platinum (Pt) electro (Pt) electro-
plating method
Electroplating solution Electroplating solution * H * H2PtCl PtCl2 : 5g (Chloroplatinic acid, Sigma : 5g (Chloroplatinic acid, Sigma-Aldrich) Aldrich) * Pb (NO * Pb (NO3) : 2 71.4mg (lead acetate, Sigma ) : 2 71.4mg (lead acetate, Sigma-Aldrich) Aldrich) * DI * DI-water : 357mL water : 357mL Method #01 Method #02 Method #03 *Chemical- treatment Chemical- treatment *Ultra-sonic Ultra-sonic
*Chemical-treatment : H2SO4 solution dipping for 20sec *Ultra-sonic : ultra-sonic wave during electroplating process TABLE 1. electroplating conditions TABLE 1. electroplating conditions
PDMS Electroplating solution Ultra-sonic wave Applied current density Applied current density ① 0.4mA/cm 0.4mA/cm2 ② 2.0 2.0mA/cm mA/cm2 ③ 5.9 5.9m mA/cm A/cm2
2