barc iifc fc are reas as of of c c i co coll llab
play

BARC IIFC: FC: Are reas as of of C& C&I Co Coll llab - PowerPoint PPT Presentation

II IIFC FC C&I C&I - Pr Present esent St Stat atus us Electronics Division BARC IIFC: FC: Are reas as of of C& C&I Co Coll llab aboration oration C&I for CMTS o RF Protection Interlock System o LLRF o


  1. II IIFC FC C&I C&I - Pr Present esent St Stat atus us Electronics Division BARC

  2. IIFC: FC: Are reas as of of C& C&I Co Coll llab aboration oration • C&I for CMTS o RF Protection Interlock System o LLRF o Cryogenic Temperature Monitoring System o Software for the integrated operation of the CMTF • Beam Position Monitor (BPM)

  3. RF F Pro rotection tection Int nterlock erlock System stem • Received schematics and other technical literature during Gopal’s Visit to Fermilab during Oct -Nov 2011 • Detailed technical discussions with Peter and Manfred during their visit to BARC in April 2012 • Improvements in the existing systems were also discussed during this visit

  4. RF F Pro rotection tection Int nterlock erlock System stem RF Power Source RF Power Coupler (klystron, solid state amp) Circulator PMT PMT GaAs-Switch RF-In Video-Pulse, FWD REFL FWD FEP REFL or RF Modulator Enable RF Multi-Trip PMT FEP Interlock module Module Module System Controller Reset RF Enable

  5. RFP FPI I - fun unctions ctions  The RF Protection Interlock (RFPI) system continues to monitor the high power RF (HPRF) system during the entire power ON period and protects it by opening the fast switch at the output of LLRF within 1-2 microseconds of detection of any fault condition .  The RFPI system inhibits the modulator in case the same fault is observed on three consecutive pulses, thereby removing the DC power source to the klystron .

  6. IIFC IIFC The existing RFPI system at Fermilab

  7. RFP FPI I - sub ubsystems systems • PMT Trip Module • FEP Trip Module • Multi-Trip Module • Relay /Contact Module • System Control Module • Digitiser Module • EPICS based IOC MVME5500 controller running VxWorks RTOS

  8. RFPI – System Architecture High Power RF System GaAs AMP From LLRF KLYSTRON Switch RF_INH Interlock Signals Reset Reset Reset Reset VideoPLS VideoPLS VideoPLS VideoPLS PMT System Control FEP RF_INH Contacts MODINH FWR/REFL & TTL RF_INH MODINH RF_INH MODINH Fas ast t Si Signal al Co Conditioning ditioning MOD_EN GUN VOLTAGE

  9. RFP FPI I - Fe Feat atures ures • RFPI operations are independent of VME64 bus activity. • Programmable trip limits • The Set point and other control actions are dependent on VME Interface. In case of a link failure, interlock operations will continue as on board FPGA stores the DAC reference Value. • Fail-safe mode of operation is built into the design • Fast and deterministic response • Cable connect detection on all analog signals • Analog signals digitized and displayed through control system.

  10. RFP FPI I - Lo Low Sp Speed eed sig ignal nals • Waveguide Pressure • Coupler Temperature • Coupler and Cavity Ion gauge controller • Coupler and Cavity Vacuum pump controller • Klystron parameters These signals are handled through a PLC which sends a TTL active low level to the RFPI system to inhibit RF

  11. VME64 E64 -TRANSITION RANSITION BOA OARD RD ARCHITE CHITECTURE CTURE VIDEO PULSE ANALOG RESET SIGNALS P2 To Digitizer Port ANALOG RF_INH SIGNALS MOD_INH INPUT Rear I/O card VME64 card

  12. VME64 BACKPLANE INTERCONNECT SCHEME P1 CONNECTORS BACKPLANE VME BUS MVME 12 CH 5500 Digitizer P2 RF INTRLK INTERCONNECT SYSTEM FWR PMT FEP REFL PWR MODULE MODULE CNTL MODULE MODULE

  13. IIFC IIFC New proposed RFPI system

  14. Pr Prop oposed osed Mo Modi difica ications tions • Provision of on-board digitiser- Eight channels of 14bit, 10-80MHz ADC and 64 MWord DDR2 RAM on each board will eliminate the need of a separate digitiser card and allow capture of longer duration events. • Remote update of FPGA via VME Bus • VME64X slave interface: Full feature VME64X slave interface supporting multiple interrupts, DMA, block transfer • Modifications in analog sections- • FEP Trip Module: use of higher supply voltage JFET amplifier thereby eliminating DC/DC convertor stage. • PMT Trip Module: Dark current detection stage is used only for cable connect confirmation. Can it be removed if a reliable cable sense mechanism is developed? • No of input channels to be increased to sixteen in Relay /Contact Module

  15. Prop Pr oposed osed Mo Modi difica ications tions cont. • Mezzanine board approach- • Common VME64X carrier Board: One carrier board for all modules, handling VME64X interface and digital logic common to all cards. • Analog section unique to each module can be on Mezzanine board • The challenge here is accommodating RF connectors on Mezzanine card facia and shielding within one slot width of card. • Feasibility of integrating Relay/ contact module with System Control Module to be studied. • Mechanical arrangement for cable sense logic: The mechanical arrangement for cable connect detection logic to be improved for more reliable operation. 11/7/2012 15

  16. Pr Prop oposed osed Mo Modi difica ications tions Cont. nt. • VME64X /VXS: All the boards will be VME64X compliant. The FPGA selection and board layout will be done keeping in VXS requirement, allowing VXS interface to be added in future. • General purpose analog signal conditioning modules and low speed ADC are required for eliminating the PLCs. • Eliminating interconnect cables among module: Open collector logic based FRC cable interconnect on the rear I/O card for additional functionality. Can be used for adding more signals to the Interlock. Eliminates cable and expensive LEMO connector?

  17. Pr Prog ogress ress so so far Peter has advised to take up the development of new System Control board with all the features of the existing board with additional PMT channel, ADC and memory, in the first phase. • A brief design report showing block diagram of the same was submitted to Fermi Lab and was approved by them. • The detailed schematics of the new system control board is in final stage of preparation. The same will be sent to Fermilab for review before fabrication. • The mechanical arrangement of cable connect detection assembly has been finalised. • Development of Multi-trip board based on the mezzanine board approach has been initiated.

  18. n Board ard Di On Digi gitiz izer er • LTC 2173-14 four channel 14 bit 80MSPS ADC • ADC provides 2 LVDS output per channel • LTC6406 single ended to differential driver • FPGA de-serializes the ADC Data • 128 MB of DDR2 memory Interfaced to FPGA • 8M word per channel: stores 100mS @ full speed • Pre trigger and post trigger information is available • The pre trigger to post trigger ratio can be adjusted using software

  19. Mod odified ified System stem Con ontrol trol Boa oard rd Port 1 Port 2 VME P1 to LVTTL Transrecivers VME P2 to LVTTL Transrecivers Memory FPGA Contact PROM Memory TTL Processing ADC DAC Power Supply ADC ADC Filter Driver Driver Section Serial Channel 1 PMT Processing Channel RF Leakage Channel VIDEO LED AND RESET Drivers SWITCHES LEMO Connectors

  20. RF F le leakage age cha hannel nnel AD8318 ADA4897-2 ADA4897-2 LTC 6406 LTC 2173-14 SMA GAT-10 S3LP606 Gain of 2 Buffer A 14 bit To FPGA 33mV /dB Buffer A Unity Gain ADC Driver ADC 1 Ch ADA4897-2 LT1763-1.8 Buffer B SMB 1.8V Unity Gain Regulator Quad DAC AD5664 AD8465 Comparator To FPGA Soft Limit POT AD8465 Comparator To FPGA Hard Limit Resistor 3.3V Divider AD8465 R Comparator To FPGA 1k Safety Limit Cable U34A 1 LVDS Disable 3 Sense 2 7400 To FPGA

  21. PMT T ou outp tput ut processing rocessing ch chann annel el AD 8138 AD 8310 SMA OPA 627 Diff Amp Log Amp POT R ADA4897-2 SMB Buffer B Unity Gain POT ADA4897-2 AD8465 Buffer B Comparator To FPGA Unity Gain Hard Limit +12V R 1k C AC Coupled 2 1 AD8465 R 1n Comparator To FPGA 1k R 1k -12V LM6172 LTC 6406 LTC 2173-14 14 bit To FPGA Unity Gain ADC Driver ADC 3 Ch LM6172 SMB Unity Gain

  22. Wh Why y Mez ezzanine zanine ca card? rd? • The VME board is common, once proven, it can be used with all mezzanine modules. • Migration to VXS or cPCI platform is very easy, we need to develop new base board only. • Mix and match approach can improve board utilization – cost saving • Maintenance is easy, module level replacement at site • ADC can be tailored as per application requirements as it is located on Mezzanine card • Noise mitigation more convenient

  23. Mechani hanica cal l details ails of f Mezz zzanine anine card rd SMB Connector SMA Connector Mezzanine card Base Board

  24. Va Vari rious ous vie iews ws of of Mez ezzani zanine ne ca card rd QTH-90- Base Board 01-LDA on mezzanine board QSH-90- 01-LDA on Base Board 5mm Spacing

  25. Mez ezzanine zanine ca card rd 78 mm Standard PMC bezel 65 mm 1 2 0 m m

  26. Ca Cable ble Se Sense nse Asse ssembly mbly

  27. Cr Cros oss-se section ction vi view of of Beze zel PCB Size 10 O-Ring

  28. SM SMA and nd SM SMB Co Connecti nnections ons Positive Contact

Download Presentation
Download Policy: The content available on the website is offered to you 'AS IS' for your personal information and use only. It cannot be commercialized, licensed, or distributed on other websites without prior consent from the author. To download a presentation, simply click this link. If you encounter any difficulties during the download process, it's possible that the publisher has removed the file from their server.

Recommend


More recommend