ATLAS DAQ - - PowerPoint PPT Presentation

ATLAS 実験シリコン検出器アップグレード の為のテスト用 DAQ システム

計測システム研究会@J-PARC 2014/11/20-21 廣瀬穣 for the ATLAS-Japan silicon group 東工大理工

Introduction

• Inner detector in ATLAS

➡Purpose :

• Particle tracking
• Vertexing

➡Provides very important information for “every” reconstructed objects.

• ATLAS-Japan group is

involved in the silicon tracker. ➡Pixel detector ➡SemiConductor Tracker (SCT)

2

ATLAS Detector ATLAS Inner Detector

Inner detector in HL-LHC

• Many problems to use the current design.

➡Intolerable radiation damage

• Fluence of ~1016 neq/cm2

➡Unacceptable occupancy

• 23 → 140 pp collisions in one bunch crossing.
• Completely new design is under study for the upgrade.

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LHC: L=1x1034 cm-2 s-1 HL-LHC: L = 5x1034 cm-2 s-1

ATLAS Pixel Detector

~year 2015

Overview of the upgraded detector

• Full silicon tracker.

➡To have high granularity/fast responding detector.

• Wide coverage of the detector acceptance.

➡Extend up to η<4.0.

• Many studies are ongoing.

➡Detector R&D, layout, support structure, cooling etc...

4

Concept ring+IBL

New design (Not final) Current design

Center of the detector

pixel pixel SCT SCT TRT

proton beam proton beam

Overview of the upgraded detector

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Concept ring+IBL

New design (Not final) Current design

| η | < 2 . 5 ( ~ 9 ° ) | η | < 4 . ( ~ 2 ° ) Center of the detector

• Full silicon tracker.

➡To have high granularity/fast responding detector.

• Wide coverage of the detector acceptance.

➡Extend up to η<4.0.

• Many studies are ongoing.

➡Detector R&D, layout, support structure, cooling etc... proton beam proton beam

Overview of the upgraded detector

6

Concept ring+IBL

New design (Not final) Current design

| η | < 2 . 5 ( ~ 9 ° ) | η | < 4 . ( ~ 2 ° ) Center of the detector

• Full silicon tracker.

➡To have high granularity/fast responding detector.

• Wide coverage of the detector acceptance.

➡Extend up to η<4.0.

• Many studies are ongoing.

➡Detector R&D, layout, support structure, cooling etc...

Japanese group is working mainly on this part.

proton beam proton beam

Work field relating to DAQ

• Pixel :

➡DAQ development for testing new module design.

• SCT :

➡DAQ development for testing new module design.

• Telescope to test the detectors above :

➡DAQ development to readout telescopes.

• Telescope : reference detector to provide hit position.

➡Software to operate the telescope+DUT system.

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※DUT : Device Under Test

Work field relating to DAQ

• Pixel :

➡DAQ development for testing new module design.

• SCT :

➡DAQ development for testing new module design.

• Telescope to test the detectors above :

➡DAQ development to readout telescopes.

• Telescope : reference detector to provide hit position.

➡Software to operate the telescope+DUT system.

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All these DAQ systems are developed based on the “SEABAS” board.

※DUT : Device Under Test

Introduction of the SEABAS board

• SEABAS(2) : general purpose DAQ board with SiTCP

. ➡SiTCP : network processor to communicate with PC. Maximum data rate : 100 (1000) Mbps. ➡FPGA for each user application. ➡2(4)×NIM_IN, 2×NIM_OUT (trigger, busy etc...). ➡1(16)ch×ADC and 4ch×DAC

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Connectors for each application (120 signal lines from UserFPGA)

UserFPGA SiTCP

Ethernet (via TCP/UDP)

NIM I/O

~ 20 cm

Advantage to use SEABAS

• “Compact” and “versatile” DAQ system.

➡Compact :

• Don’t need large crates just for testing prototypes...

✓E.g. NIM, CAMAC, VME, ATCA etc...

• Portable system is preferable.

✓We have to transport the system for the testbeam. ➡Versatile :

• Have to test new features of the prototype quickly.

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SEABAS is one of the good solution !!

• enough data transfer speed.
• enough I/O ports.

Pixel module readout

11

Upgrade of the pixel detector

• Readout ASIC : FE-I3 → FE-I4.

➡Smaller pixel size, faster readout speed.

• To cope with higher hit rate.

12

20mm 19mm

10.8mm 7.6mm

FE-I3 FE-I4

FE-I3 FE-I4

Pixel array

18×160 80×336

Pixel size (um2) 50×400

50×250

Data rate (Mb/s)

40 160

CMOS process (nm)

250 130

Expected module design

• Final design for the pixel module uses an multiplexer (MUX).

➡Since module mount have only two data line for one module.

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Module mount Data line B Data line A

• Final design for the pixel module uses an multiplexer (MUX).

➡Since module mount have only two data line for one module.

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FEI4① FEI4② FEI4③ FEI4④

Data line B Module mount

Expected module design

Data line A

• Final design for the pixel module uses an multiplexer (MUX).

➡Since module mount have only two data line for one module.

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Data③+④

FEI4① FEI4② FEI4③ FEI4④

MUX MUX

Data①+② Module mount

Expected module design

FEI4-SEABAS2 DAQ system

• Can readout up to four FEI4s

➡MUX can be used to readout two FEI4s.

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FEI4×4

Control, analysis ...

4-chip adapter card SEABAS2

LAN

SCC × 4

FEI4-SEABAS2 DAQ system

• Can readout up to four FEI4s

➡MUX can be used to readout two FEI4s.

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MUX

• ptional

FEI4×4

Control, analysis ...

4-chip adapter card SEABAS2

LAN

SCC × 4

Firmware design

• To make flexible DAQ system

➡Only provide the interface for ten FEI4 commands.

• e.g. LV1Trigger, CalibrationPulse, WrRegister etc...

➡All meaningful data from FEI4s is sent to PC.

• All operation can be done by software coding.

➡Relatively easy for non-DAQ expert to test new things.

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PC

Control Analysis

SEABAS2 FEI4×4

FIFO0

SiTCP (TCP) FEI4 FEI4 FEI4 FEI4

FIFO1 FIFO2 FIFO3

SiTCP (RBCP) Com.

decoder Command Data

10b→8b 10b→8b 10b→8b 10b→8b

Threshold tuning

• To set same threshold among pixels.

➡Good example of the operation

• Needs global configuration.
• Needs pixel local configuration.
• Charge injection
• etc...

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• Charge[e]

5000 10000 Hit efficiency 0.2 0.4 0.6 0.8 1 1.2

/ ndf

• 5.685 / 8

Prob 0.6825 Threshold 12.62 ± 2412 Noise 21.83 ± 140.7 / ndf

• 5.685 / 8

Prob 0.6825 Threshold 12.62 ± 2412 Noise 21.83 ± 140.7

(chip,col,row)=(0,34,11)

• Threshold [e]

2000 4000 6000 8000 10000 # pixels 1 10

2

10

3

10

4

10

5

10

6

10

0.8[e] ± Mean:3596.3 RMS :124.2[e]

Before tuning After tuning

Threshold determination for each pixel

Set global threshold Set local threshold Charge injection × n Extract threshold Save the best DAC value

Repeat

Strip module readout

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Current/new design of the SCT module

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• Shorter strips to cope with high density of the particle.
• Radiation hard ASIC and sensor.

120 mm 24 mm

768 strips 1280 strips

strip direction strip direction

New design Current design

ACBD R/O ASIC (12 ASICs/module) ABC250 R/O ASIC (80 ASICs/module) Hybrid (Unit of data structure)

DAQ setup

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• Relatively large system : readout data from 16 modules.

Hybrid

SEABAS Daughter board

Data from top/bottom side

Detector ladder

• 16 hybrids on top/bottom
• (Total 32 hybrids)

16 16

Control, analysis ...

• SEABAS is purely used as an interface to pass...

➡“Command bit stream” from PC to each detector. ➡“Hit data” with corresponding ID from detector to PC.

• Advantage :

➡No firmware development is needed for future prototypes.

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システムの特徴

 からのコマンドビット列劣をそのままプロトタイプ検出器へ送る  プロトタイプ検出器からの出⼒力曆ビット列劣を のタグ付けのみして へ送る  未加⼯左の出⼒力曆ビット列劣を直接 で確認可能なため、デバッグが容易李

 システム内でビット列劣の変換をしないため 読み出し対象の仕様変更車に容易李に対応可能

日本物理学会 秋期大会 佐賀大学 年憐 ⽉有 ⽇旦

プロトタイプ検出器

SEABAS

… コマンド データ … … PC

User FPGA SiTCP

…

セットアップ

DAQ design

Picture written by K. Todome

• Measuring the size of noise.
• Procedure :

➡Injecting a certain amount of charge. ➡Repeat injection by changing the threshold setting. ➡Fitting the efficiency curve by the error function. ➡Extract parameter σ as the size of noise.

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Example of the operation

• !"# $%&'

(√* + = * √- . /−&*1&

%&' 2√* 3

σ=noise

Vthreshold [mV]

εhit [mV]

Result of the noise measurement

• Tried two ways to measure the noise.

➡Measuring hybrid by hybrid. ➡Measuring whole hybrids at the same time.

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• 2

4 6 8 10 12 14 16 500 550 600 650 700 750 800

Top side Bottom side

• Change to new one
• Noise [e]

Hybrid ID Hybrid ID

Individual measurement Measuring at the same time

Difference might be caused by the detector design. → Giving a feedback to designers.

?

Telescope development

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Telescope system for testbeam

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• Testbeam is important to check the detector performance.

➡Needed a precise reference detector → silicon telescope.

• Telescope specification :

➡Four layers of the strip sensor pair with 90° stereo angle. ➡256 strips with 50 um pitch (active region ~ 13×13 mm2) ➡R/O ADC data from each strip by SVX4 ASIC. ➡Expected position resolution of ~3 um.

HUB$ DAQ$PC$

SEABAS$

SEABAS$x2$ Telescopes$ DUT$ Beam$ Ethernet$

table$ 10cm$ Telescopes$ SEABAS$

DAQ software

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• Web based GUI interface called SCTJDAC.

➡Independent software modules sharing memory.

• Fast : thanks to multi-processing.
• Flexible : composed of software modules.
• Interface

Online plots

How to synchronize multi-SEABAS

• Trigger logic unit (TLU).

➡Based on Xilinx Spartan 3AN startarkit. ➡Handling external trigger, busy, veto ... ➡Supplying reference clock to two SEABASs.

• SEABAS sends data with “TimeStamp” bases on this CLK.

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• Spartan startarkit

Extension board

Testbeam @ CERN (Oct. 2014)

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• Beam time : 26 Oct. - 3 Nov
• 120 GeV pion beam from SPS.
• Acquired ~10 M events

➡Trigger supplied by a fiber tracker. ➡Analysis is ongoing.

Beamtest@CERN$Oct2014$

Telescopes$+$DUT$ SEABAS$ Power$supplies$ NIM$modules$ (For$trigger$logic)$ S$

• PC (SCT JDAQ)

SVX4 (テレスコープ) SEABAS SEABAS ABCN トリガー 1kHz クロック 100kHz Trigger Logic Unit データ送信可能フラグ 読み出し プロセス イベント再構成 プロセス 読み出し プロセス

• Fiber

tracker

External trig.

Preliminary result

• Successfully see the correlation between telescope layers.

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svx1_ch 50 100 150 200 250 svx4_ch 50 100 150 200 250

Entries 29094 Mean x 148.9 Mean y 138.6 RMS x 60.41 RMS y 64.91 20 40 60 80 100 120 140

Entries 29094 Mean x 148.9 Mean y 138.6 RMS x 60.41 RMS y 64.91

correlation_svx_Rear_1_4

• –

–

• –

– To ¡increase ¡telescope’s ¡capacity ¡

svx1_ch 50 100 150 200 250

• –

–

• –

– To ¡increase ¡telescope’s ¡capacity ¡

Layer0 Layer1 Layer2 Layer3 Clear correlation observed !!

Hit ch. on layer3 Hit ch. on layer0

Conclusions

• Development of the DAQ system for testing future silicon

detectors in ATLAS. ➡For pixel, strip detector. ➡Telescope system to test detectors above.

• Aiming to develop a compact and versatile system.

➡All DAQ system is based on the SEABAS board. ➡Benefitted from these features.

• Easily migrated to the new design of modules.
• Potable for testbeams.
• Little word about our future plan :

➡Keep using SEABAS. ➡Limitation would be caused by the FIFO size/IO speed(?).

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Backup

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External trigger

• NIM standard input can be used as an external trigger.

➡Maximum DAQ rate : ~400 Hz

• Example of the data taking with β-source.

➡Scintillator + PMT was used for the trigger signal. ➡Hits by collimated β-ray can be seen as expected.

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Dark box

45mm

β-source

cover sensor Sci.+PMT collimator (Φ=2.2mm)

0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 20 40 60 80 50 100 150 200 250 300

h2_hitmapAtLV1Lat_7 Entries 3763 Mean x 0.1669 ± 42.09 Mean y 0.8915 ± 186.2 RMS x 10.24 RMS y 54.69 Integral 3763 3763

100 150 200 250 300

Row Column #hits Hitmap

5 10 15 20 25 30 35 40 45 50 Column 10 20 30 40 50 60 70 80 Row 50 100 150 200 250 300 (Chip,BCID)=(0,0) 2 4 6 8 10 12 14 1000 2000 3000 4000 5000 6000 7000

5 10 15 20 25 30 35 40 45 50 Column 10 20 30 40 50 60 70 80 Row 50 100 150 200 250 300 (Chip,BCID)=(1,0) 2 4 6 8 10 12 14 1000 2000 3000 4000 5000

Operation with MUX

• Developed things

➡Firmware : de-multiplexer, data extractor ➡Software : decoder

• Result of charge injection.

➡Two FEI4s are operated successfully.

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Chip0 Chip1

Column Column Row Row ToT[/25ns]

Time over threshold(ToT)

Threshold

ToT[/25ns]