3D-FlexSys 3D FlexSys MIDs Made of Deep Drawn Circuitry on - - PowerPoint PPT Presentation

▶

May 10, 2023 249 likes •473 views

3D-FlexSys 3D FlexSys MIDs Made of Deep Drawn Circuitry on Thermoplastic Sheets e op ast c S eets B.Wojakowski, U.Heckmann, U. Klug, R. Kling l Outline Motivation Process Chain Process Chain PVD-Metallization Deep

SLIDE 1

3D-FlexSys 3D FlexSys

MIDs Made of Deep Drawn Circuitry on Thermoplastic Sheets e

p ast c S eets

B.Wojakowski, U.Heckmann, U. Klug, l

R. Kling

SLIDE 2

Outline

Motivation
Process Chain
Process Chain

– PVD-Metallization D D i – Deep Drawing – Laser Structuring Pl i – Plating

Conclusion
Outlook

SLIDE 3

Motivation

Problem

Usually MID components are manufactured in Usually MID components are manufactured in three dimensional processes. Thus advantages in efficiency of a two dimensional process are sacrificed.

Solution So u o

Manufacturing of 3D-MIDs using a combination of a number of standard 2D- d Th t iti t 3D h i

procedures. The transition to a 3D shape is

done at the end of the process chain

SLIDE 4

Motivation Goal

Deep-drawable MIDs made of thermoplast

Deep drawable MIDs made of thermoplast foil substrates

Cost efficient low vacuum PVD metallization

Cost efficient low vacuum PVD metallization

High speed 2D laser structuring of the

metallization to generate stretchable g circuitry

Plating of the metallization to increase the

conductance

SLIDE 5

Process Chain

SLIDE 6

Process Chain Process Chain PVD-Metallization

Magnetron

sputtering sputtering

Coarse pre-

structuring structuring using a shadow mask shadow-mask

Shadow-mask outline

SLIDE 7

Process Chain Process Chain PVD-Metallization

Connecting layer of

50 nm chromium

– Improves adhesion

Conductive layer of

1 µm copper

Copper Chromium Copper Thermoplast Thermoplast

Coating sketch Coated g polystyrene

SLIDE 8

Process Chain Process Chain Deep Drawing

Heating of the

substrate

Blowing of a primary

extrusion

Forming by a

mechanical tool

Drawing tool and drawn PS Drawing tool and drawn PS

SLIDE 9

Process Chain Process Chain Deep Drawing

Untreated

metallization is too rigid to withstand the mechanical stress during deep stress during deep drawing

Cracks
Cracks
Loss of conductivity

1000 µm

D i Drawn copper coating on a polystyrene substrate

SLIDE 10

Process Chain Process Chain Laser Structuring

LUMERA Rapid

– 532 nm – 12 ps

Coherent AVIA

– 355 nm – 20 ns

Galvanometric

scanner Ai b i t

Air bearing stages

Laser treatment setup

SLIDE 11

Process Chain Process Chain Laser Structuring

First approach

Simple meander cuts

100 µm

Simple meander cuts
Seen here:

Additional removal of surplus material

d C Laser structured copper on PC

SLIDE 12

Process Chain Process Chain Laser Structuring

Small structures are withstanding the

mechanical stress of deep drawing

100 µm

mechanical stress of deep drawing

– Structure widths below 40 µm

Bigger structures crack at the pivot

Polycarbonate

Bigger structures crack at the pivot points of the meander

Structures conductive on

polycarbonate

100 µm

P l t Polystyrene

SLIDE 13

Process Chain Process Chain Laser Structuring

Added complexity
Computer generated

m

Computer generated

geometry

Shortened overall

500 µm

length

Works only on

y polycarbonate

100 µm

Laser structured copper on PC pp

SLIDE 14

Process Chain Process Chain Laser Structuring

Added redundancy
Suited to orthogonal

500 µm

Suited to orthogonal

stress

80% increase in

length achieved

Laser structured copper on PC Laser structured copper on PC

SLIDE 15

Process Chain Process Chain Laser Structuring

Very complex net

structures

1 mm

Added redundancy
Suited to orthogonal

g stress

Laser structured copper on Laser structured copper on polycarbonate

SLIDE 16

Process Chain Process Chain Laser Structuring

Very complex net

structures

1 mm

Added redundancy
Suited to orthogonal

g stress

Works also on

polystyrene

Laser structured copper on polystyrene

SLIDE 17

Process Chain Process Chain Plating

Electroless plating

Increasing layer
Increasing layer

thickness to a usable level

Curing of very small

cracks

Possible on

polystyrene and ABS b t t substrates

Electroless plated copper on polystyrene and ABS polystyrene and ABS

SLIDE 18

Process Chain Process Chain Plating

Electro-plating

Fast growing
Fast growing

material thickness

Needs full

conductivity

Works on

polycarbonate

Tests on polystyrene

Electro plated copper on polycarbonate

not concluded yet

polycarbonate

SLIDE 19

Conclusion

Manufacturing

method for MIDs

– Mostly two- dimensional

Proof of principle
Further improvement

necessary

SLIDE 20

Outlook

Building a demonstrating

application application

Developing a machine concept

p g p

Refining the process

D l i dd

Developing add-on processes

SLIDE 21

Thank You!

Laser Zentrum Hannover e.V. Mikrotechnik Fraunhofer-IST Sensorische Funktionsschichten Hollerithallee 8 30419 Hannover M Sc Bodo Wojako ski Se so sc e u t o ssc c te Bienroder Weg 54 E 38108 Braunschweig Di l I Ul ik H k

M. Sc. Bodo Wojakowski