Tyndall 2025 Core equipment upgrade and transition towards Smart - - PowerPoint PPT Presentation

Graeme Maxwell Tyndall National Institute graeme.maxwell@tyndall.ie

Tyndall 2025 – Core equipment upgrade and transition towards Smart Manufacturing

ENRIS 2019 – Enschede 16th - 18th June 2019

Where Are we?

Tyndall – Infrastructure numbers

• 18,000 m2 of buildings.
• 1,200 m2 of cleanrooms.
• Pumping 250 l/s of fluid.
• Conditioning 120 m³/s of fresh air.
• Exhausting 40 m³/s of air.
• Approximately 11 GW energy pa
• 7.8 M kWhrs for electricity
• 3.2 M kWhrs for gas

Tyndall - Operational numbers

• 500+ researchers & engineers,

students, support staff

• Approx 250 staff, the rest are students/

postdocs

• 51 nationalities
• ca. €38M Income each year
• 85% of which is competitively won
• 25% industry funding
• Over 200 industry partnerships and

customers worldwide

• 230+ peer reviewed publications pa
• 22 EU H2020 projects
• 20 Industry Researchers-in-Residence
• ISO 9001; ISO 500001; ISO 17025

Tyndall Growth Plan

• Identified as part of the National Development Plan
• Involves ~ €50M capital upgrade and the construction of an

addition building

• Designed to facilitate a doubling in size as part of Tyndall 2025

strategic plan “We will … upgrade and expand the Tyndall National Institute in Cork to stay at the forefront of new technologies and build on its successful industry engagement model in sectors such as health and life sciences, ICT, energy and agri-tech.”

• Government of Ireland, National Develop Plan 2018 - 2027

Elements of the core equipment upgrade plan

1.

Building the case – need simple message

2.

Clarifying existing and identifying emerging research themes and alignment with national thematic centres – eg CONFIRM – Smart Manufacture

3.

Mapping to capability requirements

4.

Prioritisation

5.

Procurement

6.

Review and revise

7

Capital status in fab areas Capital item YOP

Capital status in fab areas

Capital item YOP

2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022

Wafer / device pre- and post conditioning Semitool SRD 1991 6" Semitool <1995 4" Semitool <1995 Rapid thermal Anealler AST SHS 1000 RTP 1991 Bio Rad benchtop furnace <1995 Carbolite Furnace 1991 KARL SUSS SCRIBER 1991 Semitool SAT (Spray Acid Tool) 2004 Jet first rapid Thermal Annealer (Jet first 150) 2010 Laser Dicer 2013 Material deposition ELECTROTECH DELTA PECVD 1992 Nordiko Sputterer 2550 1991 Furnace A STACK 1991 FURNACE B STACK 1991 FURNACE C STACK 1991 Furnace D STACK 1991 Ion Implanter 1991 Nordiko Sputterer <1995 PECVD, STS 310 PC , Doped and undoped oxides 2001 STS Multiplex CVD 2005 Sputterer - PlasmalabSystem400 - Oxford Instrument 2005 Temscal 2005 Fiji F202DCS System ALD 2009 EVG 501 Bonder 2009 Thermco 6" Furnace 2010 AML Bonder 2010 EVG 301 Cleaner bonder 2012 SCIL Embosser 2012 Temescal installed in 2012 2012 Leybold Optics Syrus Pro Evaporator 2013 Wafer / device patterning Canon 600 aligner Main Fab 1991 Ultratech 1500 1X Stepper 1991 Mask Plate Cleaner 1991 DNS Resist Develop Tracks 1991 DNS SOG Tracks 1991 SUSS MICROTEK- Mask Aligner MA 1006 III-V <1995 IMP Direct write <1995 DNS Tracks <1995 EVG 420 <1995 JEOL JBX6000 FS/E electron beam lithography tool 2001 Suss MA6 DUV aligner III-V 2010

Age Service status Being depreciated - less than 7 years old Full backup available Out of warranty but servicable - 5 year window Some backup available Old / Obsolete - over 12 years old No or very limited backup available

Equipment audit & obsolescence

Thanks to Kay Gastinger at NTNU for the format

Inputs to capability requirements

8

#2 Current & upcoming project activities - defines 1-5 year requirements #1 Equipment audit & obsolescence Immediate – 5 year view #3 Stakeholder input & roadmapping -

• utlines 5-10 year time horizon

Tooling choices 1-5 years procurement horizon 1-15 year operational horizon

Current capability areas

• 3 lines in 2 cleanrooms
• CMOS – 4” line, cassette to cassette operation
• MEMs line – 4” with some 6” tooling. Manual wafer processing
• Compound Semiconductor (III-V) line – pieces, 2”, 3” wafers and 6”-

8” Si for heterogeneous integration. Manual processing

• Flexible fabrication protocols but needs strict rules on traffic flow

through/from the different lines

• Direction of traffic is CMOS ↔ MEMs → III-V
• Decision to move tooling to 8“ capable
• Better tooling available – 4” & 6” tooling becoming legacy product or

niche

• Supports higher TRL agenda
• Aligns with commercial partners – ease of downstreaming and direct

wafer exchange

• Does not preclude processing smaller wafers if necessary
• 4” silicon becoming harder to source

9

Input #2 Current & upcoming project activities

• Existing programmes (1- 4 year time horizon)
• EU & ERC
• SFI PI awards and new/existing centres
• EI – Enterprise Ireland
• Commercial
• Currently >250 research contracts with combined value >€150M
• Submitted proposals (2-6 year time horizon)
• EU & ERC
• SFI PI awards and renewal of existing centres
• 80 pro

roposals submitte ted and awaiti ting a fu funding decis ecision with ith a va valu lue

• f >€62M
• Provides themes for existing programmes (1-5 years)

10

Input #3 Roadmapping activities

• Tyndall engagement:
• White Papers of EARTO, European Association of RTOs
• EC Reports on Digital Innovation Hubs and Digital Platforms
• Photonics 21 Roadmap
• EC

ECS SRA RA, , Elec Electronic Com

• mponents an

and System stems Str trat ategic Rese Research Agen genda

• EP

EPoS

• SS SRA

RA, , Str trat ategic Res Research Age genda of

• f Eur

European Pla Platfo form of

• f Smar

art System stems

• AEN

ENEA EAS SRA RA, , Str trat ategic Rese Research Agen genda of

• f Asso

ssocia iation fo for Eur European Nan anoele lectr tronics Activ ctivit ities

• ESFRI Roadmap, European Science Forum for Research Infrastructures
• ETP Nanomedicine
• NEREID-European Nanoelectronics Roadmap
• AIOTI White Papers, Alliance of Internet Of Things Innovation
• ESTHER Medtech initiative Roadmap
• EPIC Reports, European Photonics Industry Consortium
• IRD

IRDS, , Int Internatio ional l Roa Roadmap fo for Dev evic ices es & System stems

• PSMA Roadmap, Power Sources Manufacturers Association
• iNEMI Roadmap, International Electronics Manufacturing Initiative
• Roadmap on Si Photonics
• Photonics Packaging Standards

11

Distillation & consistency check

• Nano-scale

le in integ tegrati tion

• Wafer surface pre-and post conditioning critical
• E-beam lithography fundamental
• FIB / SEM / TEM upgrades & tooling
• He

Heterogen eneous fu funct ctionali litie ies, tech technologie ies, proc roces esses & dev evic ices

• Deposition & etch tooling
• ALD & ALE for 2D material processing
• Wafer bonding & release processes
• In line metrology tooling
• Cryogenic measurement capability
• Smart

t syste tem-in in-package tech technologie ies

• TSV
• BEOL technologies – material & device integration
• Plating & wet etch systems
• Device and sub-system characterisation
• Device Forensics

12

2017/2018 Capital items procured

Ebeam - Elionix Awaiting lab refurb – expect Q3 2019 AlN / AlScN cluster tool - Evatec Awaiting block C refurb – expect Q4 2019 Plasma etchers - SPTS & Oxford for III/V Awaiting block C refurb – expect Q4 2019 AFM & Nano-indenter - Bruker Operational – OACF & FW lab Ferrotec Temescal ebeam evaporator Operational – block C Linewidth measurement tool - Promicron Operational – block C Mask aligners – III/V & silicon Operational – blocks A&C Profilometers – Tencor for III/V, silicon & MEMS Operational – blocks A&C HF vapour etcher – Memsstar for MEMS, silicon, III/V Awaiting block C refurb – expect Q4 2019 EVG coater – CMOS line Operational – block A

20 2019 19/2020 Cap apital ite items in in pro rocess & plan lanned

PECVD tool – III/V Tender spec under review Block C RTA for III/V Tender spec under review Block C Resist lines for MEMS & III/V & Ebeam inc vapour priming Tender spec under review Block C & ebeam lab O2 plasma asher for silicon / MEMS Tender complete. Contract being processed Silicon fab 200mm clean wafer cleaning systems – SAT, SOT, SRD Tender being generated Blocks A & C Dielectric Deposition System – MEMS & silicon Vendor discussions Block A Plasma / 3 beam FIB Vendor discussions New lab Helium free SQUID-VSM with combined DC/vibrating magnetometer Vendor discussions Replace existing Peripheral equipment for ebeam lab Tenders being generated Ebeam lab All cleanroom build costs, HVAC, water, waste, gas installations etc Tenders being generated Various Environmental TEM - inc EELs &HAADF Laser spike anneal Cryoprobe station – Quantum - III/V Specs being discussed New labs required

>2020 capital items identified, but will be reviewed in 2020

€47 million funding 36 36 investigators 42 42 industry partners 8 core RPO’s 8 national research and technology centres 16 16 international collaborators

Alignment to Smart Manufacturing Agenda – SFI funded thematic centre

Tyndall l provid ides tes estb tbed ed faci cili lity for Smart Manufactu turin ing targeted proje jects through th the e fabrication faci cili lity and assoc

• ciated in

infr frastructure.

Targeted Project Example – Predictive Maintenance Testbed

• Resonates with all manufacturing organisations - significant opportunity

for rapid ROI

• Sensorising plant room equipment and electrical distribution panels

feeding new and existing equipment with industrial partners Analog Devices Inc. and Verdigris Technologies

• All sensors have wireless connectivity and data managed in the cloud
• Monitor equipment signatures
• Electrical current signature - hardware and AI to disaggregate signals on

distribution boards to deliver virtual meters on downstream machines

• Vibration signature – three axis vibration analysis using modules fixed to

motors / pumps

• Project aims to assess benefits of sensors acting in isolation and value of

sensor data fusion in terms of accuracy of signatures for predictive maintenance

• Started Q2 2019 – currently rolling out hardware

Motor Current Signature Analysis

• System monitors energy usage (cost), phase

balance, harmonic distortion, power factor etc

• AI system learns behaviours of the tools and can

alarm on deviations / trends

Vibration sensors

Vibration excursion identified and tracked over 2 month period

• Sensor ID - mcsvu2hdd on chiller

pump PU7001

Summary

• Introduced Tyndall National Institute
• Outlined the approach taken for a major capital refresh and scale up

to 8” wafer capability

• Highlighted start of activities in predictive maintenance as part of

Smart Manufacturing programme

Tyndall ll Na Natio ional l Ins nsti titu tute, Lee Maltings, Dyke Parade, Cork, Ireland. T12 R5CP t: +353 21 490 4177 e: info@tyndall.ie tyndall.ie