R e c e n t P r o g r e s s i n S i l i c o n - PowerPoint PPT Presentation

R e c e n t P r o g r e s s i n S i l i c o n M o d u l e s a n d S c i n t i l l a t o r C a l o r i me t r y J e r e m i a h M a n s C D 1 D i r e c t o r ’ s R e v i e w M a r c h 1 9 , 2 0 1 9 Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 1

Outline  Recent Updates on Silicon Module Constructjon  Recent Updates on Scintjllator, SiPMs, and Tile Modules S i l i c o n S e n s o r G l u e L a y e P C r B B a s e p l a t e Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 2

Module Constructjon Strategy  UCSB – Internatjonal Lead Module Assembly Center (MAC) Responsible for developing procedures, baseline  sofuware tools, specifying equipment, defjning site commissioning protocols For both US and internatjonal sites (IHEP-Beijing, ● Taiwan NTU/NCU, India BARC) Responsible for assembly of limited-run odd-  sized modules  Texas Tech University Standard hadronic modules, high-throughput  center  Carnegie Mellon Standard hadronic modules, high-throughput  center  Multj-site solutjon provides redundency in case of risk, opportunity for acceleratjon of productjon if required Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 3

Studies at UCSB  Some concern with leakage currents in testbeam Humidity modules early in 2018 dependence Observatjons have been  understood, important implicatjons of humidity and “burn-in” fjrst high-voltage cycle  Excellent sensor-placement accuracy measured throughout productjon ± 20 m m ± 20 m m Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 4

Mechanical Studies  Module heights measured for 19 Cu Cu of the 6” modules Baseplate Baseplate Modules Modules All have 300 mm sensors  13 have 1.20 mm thick Cu baseplates of  which 7 had two Au/Kapton layers 6 used 0.90 mm thick PCB baseplates  PCB PCB Baseplate Baseplate Modules Modules  Results Modules all within  -150 μm and +200 μm (σ~100 μm) most in range ±100 μm  Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 5

8” Module Assembly Status  New 8’’ fjxtures and tooling delivered by shop Wirebonding fjxture, Carrier  Tray PCB Tray, PCB Pick up tool   Received PCB Baseplates from FNAL  Currently practjcing building dummy modules with acrylic PCB layers and dummy G-10 baseplates to qualify gluing patuerns.  Next step will be to build with an HPK dummy sensor and a PCB with 2 bad SKIROC chips. Expect to be complete by end of  month Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 6

MAC Documentatjon T Wi k i > C M S We b>S L H C Wi k i H o m e>H G C A L Wi k i H o m e>H G C A L S i l i c o n S e n s o r s>H G C A L M o d u l e A s s e m b l y C e n t e r S e t u p ( 2 0 1 9 - 0 3 - 0 6 , B r u n e l C o n s t a n t i n e O d e g a r d ) T h i s p a g e c o n t a i n s d o c u m e n t a t i o n f o r t h e s e t u p o f H i g h - G r a n u l a r i t y C a l o r i m e t e r ( H G C a l ) M o d u l e A s s e m b l y C e n t e r s . I f y o u h a v e q u e s t i o n s t h a t a r e n ' t c o v e r e d h e r e , p l e a s e c h e c k t h e F A Q p a g e . I f y o u r q u e s t i o n i s n o t a n s w e r e d t h e r e , f e e l f r e e t o p o s t i t i n t h e Q & A p a g e ( i f i t ' s n o t a l r e a d y t h e r e . ) P a g e C o n t e n t s E q u i p m e n t G a n t r y V a c u u m s y s t e m G l u e d i s p e n s i n g s y s t e m Wi r e b o n d e r P l a t e s a n d t o o l i n g P u l l t e s t e r E n c a p s u l a t i o n g a n t r y M i c r o s c o p e ( o p t i c a l i n s p e c t i o n ) O G T / O G P E l e c t r i c a l t e s t s t a n d s ( s i n g l e m o d u l e ) K e i t h l e y 2 4 1 0 S o u r c e M e t e r R a s p b e r r y P i I n t e r p o s e r F i l t e r T h e r m a l c y c l i n g a n d t e s t i n g S o f t w a r e L a b V i e w F l o o r p l a n E q u i p m e n t B a c k t o t o p T h i s s e c t i o n c o n t a i n s i n f o r m a t i o n a b o u t t h e e q u i p m e n t u s e d b y M o d u l e A s s e m b l y C e n t e r s . I t w i l l i n c l u d e m o d e l n u m b e r s , w e i g h t a n d fl o o r s p a c e i n f o r m a t i o n , a n d r e s o u r c e s o n a c q u i s i t i o n a n d s e t u p o f t h e e q u i p m e n t . F o r i n f o r m a t i o n o n u s i n g t h e e q u i p m e n t o n c e i t ' s s e t u p , s e e t h e p a g e s o n m o d u l e a s s e m b l y a n d m o d u l e t e s t i n g . G a n t r y U C S B h a s a n A e r o t e c h A G S 1 0 0 0 0 - 7 5 0 - 7 5 0 g a n t r y ( s e r i e s 1 0 0 0 0 , 7 5 0 m m x 7 5 0 m m t r a v e l a r e a . ) M A C s s h o u l d a c q u i r e t h e A G S 1 5 0 0 0 - 1 2 5 0 - 1 2 5 0 ( s e r i e s 1 5 0 0 0 g a n t r y w i t h 1 2 5 0 m m x 1 2 5 0 m m t r a v e l a r e a t o a c c o m o d a t e t h e p r o d u c t i o n o f s i x 8 - i n c h m o d u l e s a t a t i m e . Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 7

TTU Status  HESSE Bondjet BJ820 Wire bonder delivered and commissioning is planned for June 2019. Royce 610 pull tester is also delivered  AEROTECH AGS10,000 (1.25 m x 1.25 m) Gantry is delivered and placed in Room 1: Wire bonder the cleanroom. Working on commissioning, including the gantry head accessories, this month (March 2019)  Vacuum and compressed air systems are commissioned  Filter replacement and cleanroom offjcial certjfjcatjon will follow afuer all major equipment is moved in. Monitoring systems are in place.  New personnel joined the technical Room 2: Gantry team full-tjme (S. Undleeb) Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 8

CMU Status  Expansion of Cleanroom #1 (100 m 2 ) complete. Sealing and cleaning on-going. Monitoring setup in place: 8 temp/humidity monitors with logging and 2 webcams  Constructjon for Cleanroom #2 (60 m 2 ) to start shortly. Completjon expected in April  HESSE Bondjet BJ820 Wire bonder delivered and placed in cleanroom. 3-day setup and on-site training by HESSE to occur end of March  Royce 610 pull tester and epoxy dispenser close to be ordered  AEROTECH AGS10,000 (1.25 m x 1.25 m) Gantry is expected in June 2019  New electronics engineer hired (start March 15) to join Eric Day (mechanical) in technical team Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 9

Scintillator Calorimetry Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 10

Steps of Contructjon  Tile productjon : injectjon-molding (low-dose) and machined cast scintjllator (high-dose)  Tile wrapping with ESR foil Mechanical and light yield QC   SiPM productjon Batch QC   Mountjng of components onto the tjle PCB QC of assembled tjle PCB (inc full SiPM  QC)  Mountjng of tjles onto tjle PCB to create a tjle module  Integratjon into a cassetue with motherboards and cables Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 11

Tile Wrapping R&D Punched material outlet Replaceable die for each size  Studying use of ESR in-feed punch/die for ESR cuttjng High throughput, low dust compared with laser  cuttjng  Studying use of hydroforming to create pocket for scintjllator tjles Forms sharp creases, possibility for higher precision  than ‘candy machine’ folding processes Jeremiah Mans 402.4 Si Modules and Scintjllator Recent Updates CD1 Director’s Review March 19, 2018 p. 13