IBM Deep Computing – SC08
Petascale Delivered Whats Past is Prologue IBMs pNext ; The Next - - PowerPoint PPT Presentation
Petascale Delivered Whats Past is Prologue IBMs pNext ; The Next - - PowerPoint PPT Presentation
IBM Deep Computing SC08 Petascale Delivered Whats Past is Prologue IBMs pNext ; The Next Era of Computing Innovation IBM Deep Computing A mix of market forces, technological innovations and business conditions have created a
IBM Deep Computing
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IBM Deep Computing – SC08
A mix of market forces, technological innovations and business conditions have created a tipping point in HPC
HPC at a tipping point
Ecosystems & Collaboration
- Mix of traditional HPC and “edge”
applications will require new skills
- Growing necessity for collaborative
initiatives to enhance solution context and manage risk
Ecosystems & Collaboration
- Mix of traditional HPC and “edge”
applications will require new skills
- Growing necessity for collaborative
initiatives to enhance solution context and manage risk
HPC Going “Mainstream”
- Hyper-growth within Departmental
and Divisional HPC buyers
- Large influx of new buyers provides
- pportunity for new solution models
HPC Going “Mainstream”
- Hyper-growth within Departmental
and Divisional HPC buyers
- Large influx of new buyers provides
- pportunity for new solution models
System-level Performance & Reliability
- Petascale computing enabling new
paradigm in complex systems analysis
- x86-based clusters dominate – but are
not meeting ever-increasing requirements for ultra-scale users
System-level Performance & Reliability
- Petascale computing enabling new
paradigm in complex systems analysis
- x86-based clusters dominate – but are
not meeting ever-increasing requirements for ultra-scale users
Environmentals
- Growing importance and
limitations on power consumption, datacenter space, cooling capabilities, noise
- Likely governmental actions that
will influence system designs
Environmentals
- Growing importance and
limitations on power consumption, datacenter space, cooling capabilities, noise
- Likely governmental actions that
will influence system designs
Software
- ISV business model challenged
by new systems
- RYO / Open-source initiatives
gaining strong-hold beyond traditional segments
Software
- ISV business model challenged
by new systems
- RYO / Open-source initiatives
gaining strong-hold beyond traditional segments
How can we exploit these shifts to meet our
Performance & Productivity requirements?
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Performance and Productivity Challenges require a Multi- Dimensional Approach
Hybrid Systems Highly Scalable Multi-core Systems Highly Productive Systems Comprehensive (Holistic) System Innovation & Optimization
POWER
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June 18, 2008 – Petascale Delivered!
Roadrunner Breaks Petaflop Milestone
Date added: 18 Jun 2008 Lead engineer Don Grice of I BM inspects the w orld's fastest com puter in the com pany's Poughkeepsie, NY plant. The com puter nicknam ed "Roadrunner" w as built for the Departm ent of Energy's National Nuclear Security Adm inistration and w ill be housed at Los Alam os National Laboratory in New
- Mexico. I BM engineers in Poughkeepsie,
N.Y., Rochester, Minn., Austin, Texas and Yorktow n Heights, N.Y., w orked on the com puter, the first to break a m ilestone know n as a "petaflop" -- the ability to calculate 1 ,0 0 0 -trillion
- perations every second. The com puter
packs the pow er of 1 0 0 ,0 0 0 laptops -- a stack 1 .5 m iles high. Roadrunner w ill prim arily be used to ensure national security, but w ill also help scientists perform research into energy, astronom y, genetics and clim ate change.
Groundbreaking system will have a profound impact on science, business and society
Hybrid Systems
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Slide 5
17 Connected Units – 278 Racks Misc
ALF
DaCS
.
Other
/
Library
SDK 3.1 TriBlade
Linux
New Hardware New Hardware Systems Integration Systems Integration Bring Up, Test and Benchmarking Bring Up, Test and Benchmarking
LS21 Expansion LS21 QS22 QS22
Firmware Device Driver
New Software New Software Open Source Open Source Los Alamos National Lab
- A New Programming Model extended from
standard, cluster computing (Innovation derived through close collaboration with LANL)
- Hybrid and Heterogeneous Hardware
- Built around BladeCenter and Industry IB-DDR
The making of Roadrunner – Key Building Blocks
Hybrid Systems
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Highly Scalable Multi-Core Systems
13.6 GF/s 8 MB EDRAM 4 processors 1 chip, 20 DRAMs 13.6 GF/s 2.0 (or 4.0) GB DDR Supports 4-way SMP 32 Node Cards 1024 chips, 4096 procs 14 TF/s 2 TB 72 Racks 1 PF/s 144 TB Cabled 8x8x16 Rack System Compute Card Chip 435 GF/s 64 GB (32 chips 4x4x2) 32 compute, 0-1 IO cards Node Card
Role of Highly Scalable Multi-core Systems continues to Evolve
Front End Node / Service Node POWER-based blade & rack-based offerings
Blue Gene/P - a hallmark system for leadership performance in a space- saving, power-efficient package for the most demanding and scalable high-performance computing applications
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Highly Productive Computing Systems
Highly Productive Systems
DARPA HPCS Performance Goals:
up to 3,000X
Minimum bandwidth connecting system components
up to 2,000X
Memory access
up to 50X
Data processing rate
10X
Sustained execution speed Improvement Performance dimension
up to 3,000X
Minimum bandwidth connecting system components
up to 2,000X
Memory access
up to 50X
Data processing rate
10X
Sustained execution speed Improvement Performance dimension
Next-Generation POWER processor Enhanced POWER Instruction Set Architecture High-speed Network Advanced, Eco-Friendly Footprint, Packaging, Power & Cooling Scalable, Balanced System Design Architecturally Robust Hardware & Software Design Simple, Efficient Systems Mgmt. Superb Reliability, Availability, Serviceability
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Five Decades of Eco-friendly System Innovations
1960s -1970s 1980s mid-1990s late-1990s 2000s
IBM Energy Efficiency Institute, Austin, TX S/360 Model 67 first virtualized machine CMOS processors Modular refrigeration cooling technology High-k metal gates Airgap Air / liquid hybrid cooling technology VM virtualization Thermal conduction cooling technology Flat plate conduction cooling technology Copper chip Cell BE processor 3D chip stacking eDRAM
POWER6
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I nnovation from Atoms to Software I nnovation from Atoms to Software
- The simultaneous optimization of
The simultaneous optimization of:
Materials, Devices, Circuits, Cores, Chips, System Architecture, System Assets and System Software
Provides the most effective means to optimize the value
- f IT offerings to the end user
Catalyst for innovations in HPC: Systems, Algorithms, Software Tools, Business Models
Note:
Execution relies upon the seamless integration of skills from across the spectrum
Holistic Design as Applied to Petascale Systems
Holistic System Innovation
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Market Dynamics and Design Principles; Petascale and Beyond
Existing and emerging workloads with highly specialized (heterogeneous) requirements Increased societal awareness and regulatory mandate on environmentals/carbon footprint (power consumption, noise, space efficiency, resource lifecycle) Open, adaptive software ecosystem that supports legacy applications and hardware architectures while enabling new, advanced capabilities Robust, modular hardware architecture framework that enables new and existing processor types to be applied for workloads acceleration Reliability and Scalability for 1015 and beyond....
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Next Era of Innovation – Hybrid Computing The Next Bold Step in Innovation & Integration
Symmetric Multiprocessing Era Hybrid Computing Era Today pNext 1.0 pNext 2.0 p6 p7 Cell BlueGene
Driven by cores/threads Driven by workload consolidation
Throughput Traditional Computational
Technology Out Market In
All statements regarding IBM future directions and intent are subject to change or withdrawal without notice and represent goals and objectives only. Any reliance on these Statements of General Direction is at the relying party's sole risk and will not create liability or obligation for IBM.
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All statements regarding IBM future directions and intent are subject to change or withdrawal without notice and represent goals and objectives only. Any reliance on these Statements of General Direction is at the relying party's sole risk and will not create liability or obligation for IBM.
2009/2010 2007 2011 2008 2013
Performance
Capability Machines Extended Configurability
BG/P
Linux Clusters Power, x86-64, Less Demanding Communication
BG/Q Power, AIX/ Linux PF ExaF
2012 2018-19
PERCS Systems
HPC Cluster Directions
ExaScale
Accelerators Accelerators Accelerators Accelerators Capacity Clusters Roadrunner Accelerators
Targeted Configurability
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All statements regarding IBM future directions and intent are subject to change or withdrawal without notice and represent goals and objectives only. Any reliance on these Statements of General Direction is at the relying party's sole risk and will not create liability or obligation for IBM.
Logical Single Address Space
Logical Multiple Address Spaces Shmem GSM MPI
PGAS CAF /X10/ UPC
Multiple Machine Address Spaces
BG Open MP, SM-MPI HW Cache Power/PERC Open MP, SM-MPI HW Cache Roadrunner Open MP, OpenCL Software Cache
Cluster Level Node Level Logical View
Homogeneous Cores Heterogeneous
Fortran C
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All statements regarding IBM future directions and intent are subject to change or withdrawal without notice and represent goals and objectives only. Any reliance on these Statements of General Direction is at the relying party's sole risk and will not create liability or obligation for IBM.
Two Standards
- Two standards evolving from different sides of
the market
CPUs MIMD Scalar code bases Parallel for loop Shared Memory Model GPUs SIMD Scalar/Vector code bases Data Parallel Distributed Shared Memory Model
OpenMP OpenCL CPU GPU SPE
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In the end, it’s not about the technology; It’s what you do with it that counts
Join us as we: Continue to innovate across the whole systems stack to deliver leadership in performance and usability Help solve problems that are currently intractable or not cost-effective Accelerate discovery in science, engineering, and business
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...any Questions? Thank you...
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Footnotes
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This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in
- ther countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM
- fferings available in your area.
Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions
- n the capabilities of non-IBM products should be addressed to the suppliers of those products.
IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA. All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives
- nly.
The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied. All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions. IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice. IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies. All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally- available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment.
Special notices
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