Machine Learning For Feature‐Based Analytics
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Li‐C. Wang University of California, Santa Barbara
ISPD 2018 Monterey CA ‐ Wang
Machine Learning For FeatureBased Analytics LiC. Wang University - - PowerPoint PPT Presentation
Machine Learning For FeatureBased Analytics LiC. Wang University of California, Santa Barbara ISPD 2018 Monterey CA Wang 1 Machine Learning Machine Model Data Learning Machine Learning is supposed to construct an
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samples labels vectors
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Self‐Driving Car Mobile Google Translation Smart Robot AlphaGo (Google)
*These images are found in public domain
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28,20% 25,80% 16,40% 11,70% 7,30% 6,70% 3,57% 5,10% 0,00% 5,00% 10,00% 15,00% 20,00% 25,00% 30,00% 2010 2011 2012 2013 2014 2014 2015 Human
8‐Layer AlexNet 8‐Layer ZFNet 19‐Layer VGG 22‐Layer GoogleNet 152‐Layer ResNet
2016 CUImage: 269 Layers Top‐5 error rate http://www.image‐net.org/ Also see: O. Russakovsky et al. rXiv:1409.0575v3 [cs.CV] 2014
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28,20% 25,80% 16,40% 11,70% 7,30% 6,70% 3,57% 5,10% 0,00% 5,00% 10,00% 15,00% 20,00% 25,00% 30,00% 2010 2011 2012 2013 2014 2014 2015 Human
8‐Layer AlexNet 8‐Layer ZFNet 19‐Layer VGG 22‐Layer GoogleNet 152‐Layer ResNet
2016 CUImage: 269 Layers Top‐5 error rate http://www.image‐net.org/ Also see: O. Russakovsky et al. rXiv:1409.0575v3 [cs.CV] 2014
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28,20% 25,80% 16,40% 11,70% 7,30% 6,70% 3,57% 5,10% 0,00% 5,00% 10,00% 15,00% 20,00% 25,00% 30,00% 2010 2011 2012 2013 2014 2014 2015 Human
8‐Layer AlexNet 8‐Layer ZFNet 19‐Layer VGG 22‐Layer GoogleNet 152‐Layer ResNet
2016 CUImage: 269 Layers Top‐5 error rate http://www.image‐net.org/ Also see: O. Russakovsky et al. rXiv:1409.0575v3 [cs.CV] 2014
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Pre‐silicon Post‐silicon
Post‐shipping
Test cost reduction Functional verification Layout hotspot Design‐silicon timing correlation Po‐Si Validation Yield Customer return Fmax prediction Classification Regression Transformation Clustering Outlier Rule Learning Supervised learning Unsupervised learning Apply Delay test
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See: Li‐C. Wang, “Experience of Data Analytics in EDA and Test – Principles, Promises, and Challenges,” TCAD Vol 36, Issue 6, June 2017
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– What combination of signals can activate CP?
– Positive Samples: 0 to few – Negative Samples: 1K to few K’s
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– What combination of features can cause a issue?
– Positive Samples: 1 to few – Negative Samples: many
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Start End
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– What combination of design features can cause an unexpected critical path?
characterize a timing path
– Positive Samples: 1 to few – Negative Samples: many (STA critical but not silicon critical – about $25K paths)
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Slack <= x (total 130 paths)
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– Tuning what combination of process parameters can improve yield?
– Positive Samples: Failing parts or Low‐yield wafers – Negative Samples: Others
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Wafers
Test Limits 76 GHz @ Cold 77 GHz @ Hot
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Selected Features
– (1) Prepare the datasets to be analyzed – (2) Determine if the results are meaningful
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Sample Selection Feature Selection Machine Learning Toolbox Model Evaluation
Models Meaningful Models
Dataset Construction Data The Analyst Layer
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Sample Selection Feature Selection Machine Learning Toolbox Model Evaluation
Models Meaningful Models
Dataset Construction Data The Analyst Layer
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Sample Selection Feature Selection Machine Learning Toolbox Model Evaluation
Models Meaningful Models
Dataset Construction Data The Analyst Layer
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Sample Selection Feature Selection Machine Learning Toolbox Model Evaluation
Models Meaningful Models
Dataset Construction Data The Analyst Layer
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– Hence, many machine learning algorithms solve a non‐convex constrained minimization problem (NP‐Hard or Harder)
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Space of all hypotheses
Data is used to filter out inconsistent hypotheses For the remaining, find the “simplest” hypothesis as the answer Version Space
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Sample Selection Feature Selection Machine Learning Toolbox Model Evaluation
Models Meaningful Models
Dataset Construction Data The Analyst Layer
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0 positive sample 1 positive sample 2 positive samples OBDD SAT
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1 113 225 337 449 561 673 785 897
1 52 103 154 205 256 307 358 409 460
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Wafers
Test Limits 76 GHz @ Cold 77 GHz @ Hot
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Test Limits (Hot)
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Process parameter Cs value Frequency test value
Each dot represents a wafer
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