Loranger Socket Families Socket Families Loranger Over 3,000 - - PowerPoint PPT Presentation

Loranger Loranger Socket Families Socket Families

Over 3,000 Socket Designs Over 3,000 Socket Designs -

• 0.25mm and Larger Pitches

0.25mm and Larger Pitches

QFN QFN – – MLF MLF -

• LLP

LLP BGA BGA -

• LGA

LGA CSP CSP Other Socket Types Other Socket Types

QFN QFN -

• MLF

MLF -

• LLP Socket Features

LLP Socket Features

• 0.25 mm Pitch and Up

0.25 mm Pitch and Up

• Dual Row

Dual Row

• Non

Non-

• Magnetic Option

Magnetic Option

• Double Duty Kelvin

Double Duty Kelvin

• PTH / Clam Shell or Open Top

PTH / Clam Shell or Open Top

• SMT / Compliant Cover

SMT / Compliant Cover

• Thermal Management

Thermal Management

Heat Pipe Heat Pipe Heat Sink Heat Sink

Over Over 850 850 QFN Socket Designs QFN Socket Designs

BGA BGA / CSP / LGA Socket Features / CSP / LGA Socket Features

• Micro

Micro-

• spring / APS Contacts

spring / APS Contacts

• 0.25 mm Pitch and Up

0.25 mm Pitch and Up

• Current Rating: Up to 1AMP / Contact

Current Rating: Up to 1AMP / Contact

• Frequency: 5 GHz

Frequency: 5 GHz

• > 50,000 Cycles

> 50,000 Cycles

• Non

Non-

• Magnetic Option

Magnetic Option

• Clam Shell Style

Clam Shell Style

• Thermal Management

Thermal Management

• Heat Sink

Heat Sink

• RTD

RTD -

• Heater

Heater

• Programmable Smart Socket

Programmable Smart Socket Over Over 700 700 BGA / CSP / LGA Socket Designs BGA / CSP / LGA Socket Designs

• SMT / Compliant Cover

SMT / Compliant Cover

Wide Range of Socket Styles Wide Range of Socket Styles

Burn Burn-

• in and Kelvin Test Designs

in and Kelvin Test Designs

• Gull Wing

Gull Wing

• TO

TO

• SMD

SMD

• ZigZag

ZigZag

• Microwave / Hybrid

Microwave / Hybrid

• LCC / PLCC

LCC / PLCC

• Axial / Radial /

Axial / Radial / Melf Melf

• SIP / DIP

SIP / DIP

• Optical Transceivers

Optical Transceivers

• Connectors

Connectors

Ask about Thermal and Non Ask about Thermal and Non-

• Magnetic Options

Magnetic Options

Printed Circuit Boards Printed Circuit Boards

Dedicated Burn Dedicated Burn-

• in Boards

in Boards

• Highest Density to Maximize Throughput

Highest Density to Maximize Throughput

• Lowest Cost per Device Position for Volume

Lowest Cost per Device Position for Volume

• Input Isolation & Output Loading Availability

Input Isolation & Output Loading Availability

• All Device Types and Package Styles

All Device Types and Package Styles

Universal Burn Universal Burn-

• in Boards

in Boards

• Decreases Board Inventory

Decreases Board Inventory

• Device Pin Programmability

Device Pin Programmability

• High Density of Burn

High Density of Burn-

• in Sockets

in Sockets

• Quick Response to New Schematics

Quick Response to New Schematics

• Increase Board Service Life with Programming Features

Increase Board Service Life with Programming Features

HAST HAST •

• 85 / 85 THB

85 / 85 THB

Loranger Loranger HAST and Humidity boards use special board materials, optional HAST and Humidity boards use special board materials, optional inner inner layer trace routings, optimal trace spacing, surface mount or PT layer trace routings, optimal trace spacing, surface mount or PTH components, and H components, and low thermal mass designs to aid in rapid temperatures changes. low thermal mass designs to aid in rapid temperatures changes.

Program Cards & Connectors Program Cards & Connectors

• Several Styles of Program Cards are available, including dedicated designs

with components, or universal designs that can be configured by the user.

• Also, several Loranger Edge Connectors are available in various pitches and

I/O. Loranger Loranger 03199 A01 6218A connector with 49/98 contacts on 0.100 pitch 03199 A01 6218A connector with 49/98 contacts on 0.100 pitch to accommodate a keyed 98 I/O universal program card to accommodate a keyed 98 I/O universal program card

Environmental Systems Environmental Systems

• Optional computer controlled

burn-in and data collection

• Custom signal generation

boards

• Single or multiple chamber

systems

• Various chamber sizes
• Powered cool down racks
• Feed through back chamber

wall

Dynamic Dynamic •

• Static

Static •

• Humidity

Humidity •

• Ambient

Ambient

Environmental Systems Environmental Systems

• Custom board designs for signal

generation, data collection, fuses, and resistive loads

• Caged, external rack on rear of

system holds the multifunction boards

• Burn in boards pass through the

chamber back wall to connect to an interconnect assembly

• Power and ground buss bars

inside the rear cage provide power to the interconnect assemblies

• Multifunction boards plug into the

interconnect assemblies

Backplane Multifunction Boards Backplane Multifunction Boards

Environmental Systems Environmental Systems

Four Chamber Burn Four Chamber Burn-

• in System

in System

Environmental Systems Environmental Systems

• Room temperature burn-in

for high power devices

• Board racks set at an angle

to provide proper airflow and cooling

• Ventilated walls for airflow
• Backplane connectors and

power supplies

Ambient Burn Ambient Burn-

• in System

in System

Loranger Loranger International Corporation International Corporation

Systems Systems Sockets Sockets PC Boards PC Boards Visit Us At Visit Us At www.bce.it www.bce.it for Information Regarding for Information Regarding

Italy Support Italy Support