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Introduction June 2016 1 KC Confidential History of Kyocera - PowerPoint PPT Presentation

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KYOCERA PWB Introduction June 2016 1 KC Confidential History of Kyocera Organic Package and PWB 1959 Kyoto Ceramic Co., LTD Establishment 1971 1975 IBM Japan Yasu Plant NEC Toyama Factory Start of 1984 Start of PWB

  1. KYOCERA PWB Introduction June 2016 1 KC Confidential

  2. History of Kyocera Organic Package and PWB ● 1959 Kyoto Ceramic Co., LTD Establishment ● 1971 ● 1975 IBM Japan Yasu Plant NEC Toyama Factory Start of ● 1984 Start of PWB Production PWB Production TOPPAN Niigata Factory Merged Start of PWB Production ● 1996 Start of Organic Package Production Business Transfer ● 2002 TNCSi Establishment ● 2003 KYOCERA SLC Technologies Co. Establishment ● 2004 Integration of Kyocera Organic Package Business ● 2013 Joined Kyocera Group Merged Company and the name Changed to KYOCERA Circuit Solutions, Inc. October 2014 Company name was changed from KYOCERA SLC Technologies Co. to 2 KC Confidential

  3. Japan Network Toyama Nyuzen Plant Product ： Printed Wiring Boards Niigata Shibata Plant Product ： Printed Wiring Boards Kyoto Ayabe Plant Product ： Organic Packages Tokyo Office ／ Design Center Chubu Sales Office ／ Design Center Shiga Yasu Office (R&D) Kagoshima Sendai Plant Product ： Organic Packages Kyoto Headquarters All site are ISO9001 and ISO14001 certified 3 KC Confidential

  4. 4 KC Confidential

  5. 5 KC Confidential

  6. 6 KC Confidential

  7. 7 KC Confidential

  8. 8 New Plating line Installation 1) Boards plating requirement ・ Copper plating thickness shall meet the requirement of IPC-6011 Class2 in IPC-6012. 2) Compare to Current T5 line capability with New Plating T6 line ・ ETV ; Board Thickness:254mil, Min. DHS:11.8mil, Aspect Ratio:21.5 Current Plating : T5 Line New Plating : T6 Line A: 1.7mil A: 2.6mil A A B: 1.0mil B: 1.2mil B B C: 1.5mil C: 2.7mil C C 38% 80% * Throwing power KC Confidential

  9. 9 Cross section ● Evaluation Result A-1 A-2 A-2 ・ ETV specification ・ T/H plating thickness measurement points are bellow Board Thickness 254mil Min. DHS 11.8mil 1 2 a b 0% Aspect Ratio 21.5 c d 25% e f 50% ・ KC measured plating thickness g h 75% at 11.8mil DHS. i j 100% 4 3 ・ Measurement Results Unit:um A-1 A-2 A-3 DHS 11.8mil Ave. Max. Min. R σ 1 2 1 2 1 2 a 32.0 33.4 43.0 45.6 37.8 36.4 b 32.6 34.4 40.4 40.6 36.6 36.4 0% 37.52 45.6 32.0 13.6 3.87 100% i 36.4 34.0 37.2 35.8 41.4 41.8 j 32.2 32.8 37.6 37.4 41.6 43.0 c 38.0 37.4 38.2 38.4 35.4 34.8 Plating Thickness 25% d 37.0 38.0 37.6 38.8 34.6 35.6 36.88 38.8 34.6 4.2 1.24 75% g 37.6 37.2 37.4 37.0 35.2 36.0 h 38.6 36.4 37.8 36.6 35.8 35.8 e 36.4 36.4 37.4 37.8 34.4 35.2 36.55 50% 38.0 34.4 3.6 1.26 f 36.0 38.0 37.8 38.0 35.0 36.2 1 53.4 50.0 66.0 62.0 57.0 56.6 Surface 2 49.8 50.6 60.6 60.4 59.8 59.2 Conductor 57.07 66.0 49.8 16.2 4.89 3 55.2 55.4 51.6 54.2 63.6 61.6 Width 4 54.0 51.6 54.2 55.0 64.0 63.8 Thowing Power 109% 111% 95% 95% 88% 91% 98.0% - - - - KC Confidential

  10. 10 New Plating Line and Schedule Front side Horizontal conveyor for drying In evaluation Schedule May Jun. Jul. Aug. Reliability Internal Evaluation Evaluation Internal PCN approval Release KC Confidential

  11. 11 KC Confidential

  12. 12 KC Confidential

  13. 13 KC Confidential

  14. 14 KC Confidential

  15. 15 KC Confidential

  16. 16 KC Confidential

  17. 17 KC Confidential

  18. 18 Embedded Passive Components PWB KC Confidential

  19. 19 Embedded Active Component PWB KC Confidential

  20. 20 Thank You KC Confidential

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