ECS CSEL EL Bro roker erage age Event nt 2016 16 ECSE CSEL - - PowerPoint PPT Presentation

ECS CSEL EL Bro roker erage age Event nt 2016 16

ECSE CSEL

Joint Undertak aking ng

Anneliese Pönninger a.poenninger@evgroup.com

Nano-Imprint Lithography “Large Surface” Pilot Line RIA Proposal

Courtesy of Fraunhofer ISE

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NIL –Why and What for?

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• More than Silicon substrates

(Polymer/Flexible/Sapphire...)

• High resolution / Large surface
• High throughput
• Bio compatible polymers
• Polymer

for permanent applications

• 3D complex shapes
• Non flat samples

MEMS NEMS Image Sensors Displays Solar Cells BioMEMS Flexible e- OLED LED Micro Fluidics Plasmonic Components

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Solutions Transferred to End Users or Companies in the value chain. Market Needs End User Request (design / product) NIL Value Chain (Master, Equipment, Material, Metrology, Integration) Pilot Line Environment (infrastructure building, solution qualification and integration)

NIL – Project Concept

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A little more technical information about my project

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• Standardization w.r.t. applications
• Fully automated solutions assessed in pilot line environment
• what about real alignment capabilities in production regime?
• what about the real defectivity levels and what are the real bottlenecks?
• Associated metrology (real time is not needed for wafer scale, but in line YES!)
• Defectivity assessment w.r.t. applications
• “Real” CoO assessment in pilot line in a full process flow (yield, stamp lifetime…).
• Validation of some “elementary modules” that are still missing in the value chain:

Stamp Design (w.r.t. process that will be implemented), Stamp Repair, Complete Simulation ToolBox.

Demonstrate Industrial Maturity Qualify a well established Supply chain

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Information about the Consortium

• Consortium under construction / RIA call / Total budget 15 M€
• NIL technology maturity TRL from 4 (start) to 6 (in 2019)
• Materials development, metrology
• Device design and manufacturers

– Photonics (LED, displays, opto-electronics) – Bio-technology – MEMS, Flexible support, @ wafer level / @ large surface scale level etc.

• End-user assessment / Specific Work packages // NIL options.

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To accelerate adoption of this technology. To demonstrate the benefits of the full-wafer NIL technology and spreading its use for applications beyond the traditional semiconductor industry.

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Thank you!

Anneliese Pönninger A.Poenninger@EVGroup.com, EV Group

DI Erich Thallner Str. 1, 4782 St. Florian am Inn, Austria

www.EVGroup.com

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