2012 MicroCool is a division of Wolverine Tube Inc. A Rich - - PowerPoint PPT Presentation

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2012 MicroCool is a division of Wolverine Tube Inc. A Rich - - PowerPoint PPT Presentation

General Presentation 2012 MicroCool is a division of Wolverine Tube Inc. A Rich History, A Solid Foundation, A Bold Future Wolverine has 90+ years history with decades long customer partnerships In 1935, Wolverine invented the first


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General Presentation 2012

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MicroCool is a division of Wolverine Tube Inc.

  • A Rich History, A Solid Foundation, A Bold Future

 Wolverine has 90+ years history with decades long customer partnerships  In 1935, Wolverine invented the first high performance heat transfer tubes and revolutionized the HVAC commercial chiller industry  Wolverine is the premier heat transfer design partner for OEM’s  Metal Joining and Brazing Products  Global core markets served: HVAC, Refrigeration & Appliance, Water Heater/Boiler, Process & Chemical, Electronics Cooling

Wolverine - MicroCool Confidential 2012

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Wolverine Global Customer Partnerships

Wolverine - MicroCool Confidential 2012

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Wolverine Locations

Wolverine - MicroCool Confidential 2012

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Wolverine MDT Enhanced Tube MicroCool MDT Enhanced Flat Surface

Wolverine - MicroCool Confidential 2012

MicroCool’s MDT technology originated from Wolverine’s tube surface enhancing technology

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MDT – Micro Deformation Technology

  • Patented tooling and process.
  • Work piece is cut, deformed and stretched by up to 150%.
  • No loss of material during the fining operation.
  • Fining is done without the addition of heat and can be done without lubrication if needed.
  • Little tooling or setup required, similar to CNC machining.

Wolverine - MicroCool Confidential 2012

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SLIDE 7

MDT Flexibility

  • Fins per inch: 650-8 (255-3 Fins/Centimeter)
  • Fin thickness to fin gap ratio: 1:1 – 1:3
  • Fin height to fin thickness ratio up to 15:1
  • Max fin gap: 1.2mm +
  • Pins can be formed in either an in-line or staggered pattern.
  • Pin diameter and gap vary from 1mm to 0.5mm
  • Pin height to diameter ratio up to 8:1
  • Fins or pins can be applied over large surfaces up to 1X1 meter
  • Fins or pins can be added in specific “island” locations or on across entire surface
  • All of these options can be varied with little to no setup or tooling (a customer could

easily try multiples of different fin or pin geometries with one fixture)

150 fins per inch (60 f/cm) 1mm tall 12 fins per inch (5 f/cm) 5 mm tall

Gap Thk

Example Pin array

Wolverine - MicroCool Confidential 2012

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MDT Geometry Options - Fins

Wolverine - MicroCool Confidential 2012

4mm tall 50 fpi .25mm thk .25 mm gap 4mm tall 25 fpi .5 mm thk .5 mm gap

Common Fin Pitches 200 fpi = 0.0625mm thk 100 fpi = 0.125mm thk 50 fpi = 0.25mm thk 25 fpi = 0.5mm thk 12 fpi = 1.0mm thk

  • Fins can be created in both copper and aluminum
  • Fins can have knife edge or be flat (see above)
  • Fins can be straight or slightly curved (see above)
  • Back-wall minimum thickness 1mm
  • Fin thickness to gap normally 1:1 but can vary

Design Flexibility

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MDT Geometry Options – Pins

Wolverine - MicroCool Confidential 2012

Staggered Pin ~1mm gap In-line Pin ~1mm gap

  • Pins can be staggered or in-line
  • Pins can be created from 12 FPI to

200fpi, [20fpi (0.5mm) shown to the left)]

  • Pins can be created on both aluminum

and copper.

  • Pins can have pointed or flat tops (see

above)

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SLIDE 10

MDT Material Options

Copper

  • C110
  • C101
  • Most copper

alloys Aluminum

  • 1000 series
  • 3000 series
  • 6000 series*
  • 7000 series*

Wolverine - MicroCool Confidential 2012

Other

  • CuNi
  • Steel*
  • Titanium*
  • Plastics
  • Brass
  • CTE

materials**

* More difficult **Limited success with current materials but open to R&D of new materials

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SLIDE 11

MicroCool Products

Wolverine - MicroCool Confidential 2012

IGBT Base Plates Full Cooling Loops High Performance Cold plates

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SLIDE 12

Wolverine - MicroCool Confidential 2012

Thermal, Leak and Pressure Testing

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CFD Simulation and Optimization

Wolverine - MicroCool Confidential 2012

  • Flow Balancing
  • Fin and Pin Optimization
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Future use of MDT

Wolverine - MicroCool Confidential 2012

Liquid cooling at IGBT substrate level